Intel - AGIB027R31B3E3E

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AGIB027R31B3E3E by Intel

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Manufacturer Intel
Manufacturer's Part Number AGIB027R31B3E3E
Description SoC FPGA; Terminal Form: BALL; No. of Terminals: 3184; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 100 Cel;
Datasheet AGIB027R31B3E3E Datasheet
In Stock363
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
No. of Terminals: 3184
Peripheral IC Type: SoC FPGA
Terminal Position: BOTTOM
JESD-30 Code: R-PBGA-B3184
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 100 Cel
Surface Mount: YES
Minimum Operating Temperature: 0 Cel
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