INDUSTRIAL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

ADSP-SC589BBCZ-4B

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

85 Cel

-40 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

IA80152JA-PDW48I

Analog Devices

INDUSTRIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP48,.6

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

.1 mA

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T48

Not Qualified

e0

ADUCM331WDCPZ

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

18 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.6 V

115 Cel

-40 Cel

QUAD

1 mm

6 mm

6 mm

CMOS

.5 mm

S-XQCC-N32

IA80152JC-PDW48I

Analog Devices

INDUSTRIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP48,.6

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

.1 mA

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T48

Not Qualified

e0

ADSP-SC584BBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

85 Cel

-40 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

ADUCM350BBCZ

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

120

LFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

GRID ARRAY, LOW PROFILE, FINE PITCH

2.5 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.35 mm

8 mm

30

260

8 mm

CMOS

3 V

.5 mm

S-PBGA-B120

3

e1

ADSP-SC584CBCZ-3A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

95 Cel

-40 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

IA82050-PLC28I-R-01

Analog Devices

SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS

INDUSTRIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

CHIP CARRIER

LDCC28,.5SQ

85 Cel

-40 Cel

QUAD

4.57 mm

11.5 mm

20 MHz

11.5 mm

CMOS

5 V

1.27 mm

S-PQCC-J28

ADSP-21584BBCZ-5A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

85 Cel

-40 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

IA8X44PLC44I3

Analog Devices

INDUSTRIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC44,.7SQ

85 Cel

-40 Cel

QUAD

CMOS

50 mA

5 V

Other uPs/uCs/Peripheral ICs

1.27 mm

S-PQCC-J44

Not Qualified

ADSP-SC584BBCZ-5A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

85 Cel

-40 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

IA82050-PDW28I-01

Analog Devices

SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS

INDUSTRIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP28,.6

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

5.08 mm

13.17 mm

20 MHz

CMOS

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T28

Not Qualified

e0

FIDO1100BGA208IR1

Analog Devices

SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS

INDUSTRIAL

BALL

208

BGA

SQUARE

PLASTIC

YES

2.75 V

GRID ARRAY

BGA208,18X18,20

2.25 V

85 Cel

-40 Cel

BOTTOM

1.2 mm

10 mm

16

2.6 MHz

10 mm

2.5 V

SPI; UART

.5 mm

S-PBGA-B208

AD6620ASZ-REEL

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

80

QFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3.3

FLATPACK

QFP80,.7SQ

3 V

85 Cel

-40 Cel

MATTE TIN

QUAD

3.4 mm

14 mm

40

260

14 mm

CMOS

3.3 V

DSP Peripherals

.65 mm

S-PQFP-G80

3

Not Qualified

e3

ADUCM331WFSBCPZ-RL

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

18 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.24SQ,20

3.6 V

115 Cel

-40 Cel

QUAD

1 mm

6 mm

NOT SPECIFIED

NOT SPECIFIED

6 mm

CMOS

SPI

.5 mm

S-XQCC-N32

ADSP-SC584CBCZ-5A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

95 Cel

-40 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

ADN2855ACPZ

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

85 Cel

-40 Cel

MATTE TIN

QUAD

1 mm

5 mm

30

260

5 mm

CMOS

3.3 V

.5 mm

S-XQCC-N32

3

Not Qualified

e3

ADSP-21584BBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

e1

ADUCM350BBCZ-RL

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

120

LFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

GRID ARRAY, LOW PROFILE, FINE PITCH

2.5 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.35 mm

8 mm

30

260

8 mm

CMOS

3 V

.5 mm

S-PBGA-B120

3

e1

ADMC201AP

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.25 V

CHIP CARRIER

4.75 V

85 Cel

-40 Cel

TIN LEAD

QUAD

4.45 mm

24.1808 mm

24.1808 mm

CMOS

5 V

1.27 mm

S-PQCC-J68

Not Qualified

e0

ADSP-SC583CBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

95 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

e1

AD6620AS-REEL

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

80

QFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK

3 V

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

QUAD

3.4 mm

14 mm

30

240

14 mm

CMOS

3.3 V

.65 mm

S-PQFP-G80

3

Not Qualified

e0

ADSP-21584CBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

95 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

e1

IA80C152JD-PLC68I-R-01

Analog Devices

SERIAL IO/COMMUNICATION CONTROLLER, LAN

INDUSTRIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

CHIP CARRIER

LDCC68,1.0SQ

4.5 V

85 Cel

-40 Cel

QUAD

5.08 mm

25.15 mm

8

16.5 MHz

25.15 mm

CMOS

5 V

UART

1.27 mm

S-PQCC-J68

ADUCM330WDCPZ-RL

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

18 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.6 V

115 Cel

-40 Cel

QUAD

1 mm

6 mm

6 mm

CMOS

.5 mm

S-XQCC-N32

IA80152JB-PLC68I

Analog Devices

INDUSTRIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC68,1.0SQ

85 Cel

-40 Cel

TIN LEAD

QUAD

235

CMOS

.1 mA

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J68

3

Not Qualified

e0

IA80152JA-PLC68I

Analog Devices

INDUSTRIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC68,1.0SQ

85 Cel

-40 Cel

TIN LEAD

QUAD

235

CMOS

.1 mA

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J68

3

Not Qualified

e0

IA80C152JB-PLC68I-R-01

Analog Devices

SERIAL IO/COMMUNICATION CONTROLLER, LAN

INDUSTRIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

CHIP CARRIER

LDCC68,1.0SQ

4.5 V

85 Cel

-40 Cel

QUAD

5.08 mm

25.15 mm

8

16.5 MHz

25.15 mm

CMOS

5 V

UART

1.27 mm

S-PQCC-J68

IA8044-PDW40I-P03

Analog Devices

INDUSTRIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP40,.6

85 Cel

-40 Cel

DUAL

50 mA

5 V

Other uPs/uCs/Peripheral ICs

2.54 mm

R-PDIP-T40

Not Qualified

IA8044-PLC44I-P03

Analog Devices

INDUSTRIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC44,.7SQ

85 Cel

-40 Cel

QUAD

50 mA

5 V

Other uPs/uCs/Peripheral ICs

1.27 mm

S-PQCC-J44

Not Qualified

IA8344-PDW40I-R-P03

Analog Devices

INDUSTRIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP40,.6

85 Cel

-40 Cel

DUAL

50 mA

5 V

Other uPs/uCs/Peripheral ICs

2.54 mm

R-PDIP-T40

Not Qualified

ADSP-SC583BBCZ-3A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

e1

IA80152JC-PLC68I

Analog Devices

INDUSTRIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC68,1.0SQ

85 Cel

-40 Cel

TIN LEAD

QUAD

235

CMOS

.1 mA

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J68

3

Not Qualified

e0

ADSP-SC582BBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

e1

ADUCM331WDCPZ-RL

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

18 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.6 V

115 Cel

-40 Cel

QUAD

1 mm

6 mm

6 mm

CMOS

.5 mm

S-XQCC-N32

ADSP-SC582CBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

95 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

e1

DS8314L-RRX+

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6 V

3.3,5

SMALL OUTLINE

SOP28,.4

2.7 V

85 Cel

-40 Cel

DUAL

2.65 mm

7.5 mm

NOT SPECIFIED

NOT SPECIFIED

17.9 mm

CMOS

85 mA

3.3 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G28

Not Qualified

71M6545H-IGT/F

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

3 V

85 Cel

-40 Cel

QUAD

1.6 mm

10 mm

NOT SPECIFIED

NOT SPECIFIED

10 mm

CMOS

3.3 V

.5 mm

S-PQFP-G64

Not Qualified

71M6545-IGT/F

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

3 V

85 Cel

-40 Cel

QUAD

1.6 mm

10 mm

NOT SPECIFIED

NOT SPECIFIED

10 mm

CMOS

3.3 V

.5 mm

S-PQFP-G64

Not Qualified

MAX7359ETG+

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1.8/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.13SQ,16

1.62 V

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

.85 mm

3.5 mm

30

260

3.5 mm

BICMOS

.06 mA

2.5 V

Parallel IO Port

.4 mm

S-XQCC-N24

1

Not Qualified

e3

DS8313L-RJX+

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

6 V

3.3,5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

2.7 V

85 Cel

-40 Cel

DUAL

1.1 mm

4.4 mm

NOT SPECIFIED

NOT SPECIFIED

9.7 mm

CMOS

85 mA

3.3 V

Other Microprocessor ICs

.65 mm

R-PDSO-G28

Not Qualified

DS8313L-RRX+

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6 V

3.3,5

SMALL OUTLINE

SOP28,.4

2.7 V

85 Cel

-40 Cel

DUAL

2.65 mm

7.5 mm

NOT SPECIFIED

NOT SPECIFIED

17.9 mm

CMOS

85 mA

3.3 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G28

Not Qualified

DS3641B+TRL

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

25

BGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

GRID ARRAY

3.3 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

260

CMOS

S-PBGA-B25

3

e1

DS8314-RJX+

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

6 V

3.3,5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

2.7 V

85 Cel

-40 Cel

DUAL

1.1 mm

4.4 mm

NOT SPECIFIED

NOT SPECIFIED

9.7 mm

CMOS

85 mA

3.3 V

Other Microprocessor ICs

.65 mm

R-PDSO-G28

Not Qualified

DS3641B+

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

25

BGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

GRID ARRAY

3.3 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

260

CMOS

S-PBGA-B25

3

e1

MAXQ1061ETP+T

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

20

RECTANGULAR

UNSPECIFIED

YES

109 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

30

260

CMOS

R-XQCC-N20

1

e3

DS8113-JNG+T&R

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.7 V

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

1.1 mm

4.4 mm

30

260

9.7 mm

CMOS

3.3 V

.65 mm

R-PDSO-G28

1

e3

71M6545-IGTR/F

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

3 V

85 Cel

-40 Cel

QUAD

1.6 mm

10 mm

NOT SPECIFIED

NOT SPECIFIED

10 mm

CMOS

3.3 V

.5 mm

S-PQFP-G64

Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.