Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Information Access Method | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Interrupt Capability | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | No. of Ports | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Volatile | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
37 |
RECTANGULAR |
UNSPECIFIED |
YES |
4.2 V |
TS 16949 |
MICROELECTRONIC ASSEMBLY |
3 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.087 mm |
14.732 mm |
30 |
260 |
22.428 mm |
CMOS |
3.6 V |
1.204 mm |
R-XXMA-N37 |
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|
Espressif Systems (Shanghai) |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
38 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
MICROELECTRONIC ASSEMBLY |
3 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
3.25 mm |
18 mm |
25.5 mm |
CMOS |
3.3 V |
1.27 mm |
R-XXMA-N38 |
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Nordic Semiconductor Asa |
MICROCONTROLLER, CISC |
INDUSTRIAL |
NO LEAD |
127 |
LGA |
RECTANGULAR |
UNSPECIFIED |
YES |
5.5 V |
GRID ARRAY |
LGA127,21X30,20 |
3 V |
85 Cel |
-40 Cel |
BOTTOM |
1.1 mm |
10.5 mm |
16 mm |
CMOS |
3.8 V |
.5 mm |
R-XBGA-N127 |
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Nordic Semiconductor Asa |
MICROCONTROLLER, CISC |
INDUSTRIAL |
NO LEAD |
127 |
LGA |
RECTANGULAR |
UNSPECIFIED |
YES |
5.5 V |
GRID ARRAY |
LGA127,21X30,20 |
3 V |
85 Cel |
-40 Cel |
BOTTOM |
1.1 mm |
10.5 mm |
16 mm |
CMOS |
3.8 V |
.5 mm |
R-XBGA-N127 |
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|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
MICROELECTRONIC ASSEMBLY |
2.7 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
NOT SPECIFIED |
NOT SPECIFIED |
21.72 mm |
CMOS |
3.3 V |
R-XXMA-N28 |
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|
Espressif Systems (Shanghai) |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
38 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
MICROELECTRONIC ASSEMBLY |
3 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
3.25 mm |
18 mm |
30 |
250 |
25.5 mm |
CMOS |
3.3 V |
1.27 mm |
R-XXMA-N38 |
3 |
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|
NXP Semiconductors |
SoC |
INDUSTRIAL |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196,14X14,25 |
1.15 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.43 mm |
10 mm |
40 |
260 |
10 mm |
CMOS |
.65 mm |
S-PBGA-B196 |
3 |
e1 |
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|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
TS 16949 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.20SQ,25 |
3.135 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
5 mm |
ALSO OPERATES AT 5V SUPPLY |
5 mm |
CMOS |
3.3 V |
.65 mm |
S-PQCC-N20 |
e3 |
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|
NXP Semiconductors |
SoC |
INDUSTRIAL |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196,14X14,32 |
1.15 V |
105 Cel |
-40 Cel |
TIN SILVER |
BOTTOM |
1.52 mm |
12 mm |
40 |
260 |
12 mm |
CMOS |
.8 mm |
S-PBGA-B196 |
3 |
e2 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
12 V |
SMALL OUTLINE |
4.5 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
1.75 mm |
3.9 mm |
VCCB(Min)(V) is 3, VCCB(Max)(V) is 12 |
0 |
.4 MHz |
NOT SPECIFIED |
260 |
4.9 mm |
BIPOLAR |
5 V |
I2C |
1.27 mm |
R-PDSO-G8 |
1 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||||||||||||||
Nordic Semiconductor Asa |
MICROCONTROLLER, CISC |
INDUSTRIAL |
NO LEAD |
127 |
LGA |
RECTANGULAR |
UNSPECIFIED |
YES |
5.5 V |
GRID ARRAY |
LGA127,21X30,20 |
3 V |
85 Cel |
-40 Cel |
BOTTOM |
1.1 mm |
10.5 mm |
16 mm |
CMOS |
3.8 V |
.5 mm |
R-XBGA-N127 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SYSTEM ON CHIP |
INDUSTRIAL |
BALL |
289 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.55 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA289,17X17,32 |
1.35 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.37 mm |
14 mm |
IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V |
40 |
260 |
14 mm |
CMOS |
1.45 V |
.8 mm |
S-PBGA-B289 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
176 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
MICROELECTRONIC ASSEMBLY |
MODULE,176LEAD |
3 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.8 mm |
38 mm |
UPTO 4 FLEXCOMM AVAILABLE |
NOT SPECIFIED |
NOT SPECIFIED |
40 mm |
CMOS |
3.3 V |
CAN(2), I2C, I2S, QSPI, SSC, SDMMC, SPI, UART(4) |
.8 mm |
R-XXMA-N176 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.6 mm |
2 mm |
260 |
3 mm |
CMOS |
I2C |
.5 mm |
R-PDSO-N8 |
1 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.95 mm |
5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
CMOS |
3 V |
.5 mm |
S-XQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
12 V |
SMALL OUTLINE |
4.5 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.75 mm |
3.9 mm |
30 |
260 |
4.9 mm |
BIPOLAR |
5 V |
1.27 mm |
R-PDSO-G8 |
1 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSoC |
INDUSTRIAL |
PURE TIN |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
SMALL OUTLINE |
SOP14,.24 |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1.75 mm |
3.9 mm |
8.65 mm |
CMOS |
3.3 V |
1.27 mm |
R-PDSO-G14 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.465 V |
TS 16949 |
SMALL OUTLINE, SHRINK PITCH |
3.135 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
2 mm |
5.3 mm |
ALSO OPERATES AT 5V SUPPLY |
40 |
260 |
7.2 mm |
CMOS |
3.3 V |
.65 mm |
R-PDSO-G20 |
2 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.95 mm |
6 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.6 mm |
2 mm |
30 |
260 |
3 mm |
CMOS |
.5 mm |
R-PDSO-N8 |
1 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.465 V |
TS 16949 |
SMALL OUTLINE |
SOP20,.4 |
3.135 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
2.65 mm |
7.5 mm |
ALSO OPERATES AT 5V SUPPLY |
260 |
12.8 mm |
CMOS |
3.3 V |
1.27 mm |
R-PDSO-G20 |
1 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.95 mm |
5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
CMOS |
3 V |
.5 mm |
S-XQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
12 V |
SMALL OUTLINE |
4.5 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
1.75 mm |
3.9 mm |
VCCB(Min)(V) is 3, VCCB(Max)(V) is 12 |
0 |
.4 MHz |
NOT SPECIFIED |
260 |
4.9 mm |
BIPOLAR |
5 V |
I2C |
1.27 mm |
R-PDSO-G8 |
1 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.95 mm |
6 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
2/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
N |
QUAD |
1.6 mm |
14 mm |
40 |
260 |
14 mm |
65536 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
.5 mm |
S-PQFP-G100 |
3 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSoC |
INDUSTRIAL |
PURE TIN |
30 |
260 |
3 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE |
SOP8,.23 |
2 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1.75 mm |
3.9 mm |
30 |
260 |
4.9 mm |
CMOS |
I2C |
1.27 mm |
R-PDSO-G8 |
1 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SoC |
INDUSTRIAL |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196,14X14,31 |
1.15 V |
105 Cel |
-40 Cel |
BOTTOM |
1.52 mm |
12 mm |
40 |
260 |
12 mm |
CMOS |
.8 mm |
S-PBGA-B196 |
3 |
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|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
3.3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1.2 mm |
4.4 mm |
5 mm |
CMOS |
15 mA |
3.3 V |
Serial IO/Communication Controllers |
.65 mm |
R-PDSO-G14 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SoC |
INDUSTRIAL |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196,14X14,25 |
1.15 V |
105 Cel |
-40 Cel |
BOTTOM |
1.43 mm |
10 mm |
40 |
260 |
10 mm |
CMOS |
.65 mm |
S-PBGA-B196 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.95 mm |
5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
CMOS |
3 V |
.5 mm |
S-XQCC-N32 |
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|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE |
SOP8,.23 |
2 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1.75 mm |
3.9 mm |
30 |
260 |
4.9 mm |
CMOS |
I2C |
1.27 mm |
R-PDSO-G8 |
1 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
2/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
PURE TIN |
N |
QUAD |
1.6 mm |
14 mm |
14 mm |
524288 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
.5 mm |
S-PQFP-G100 |
3 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||
|
FTDI |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
SMALL OUTLINE, SHRINK PITCH |
3.3 V |
85 Cel |
-40 Cel |
DUAL |
2 mm |
5.3 mm |
40 |
260 |
10.2 mm |
CMOS |
.65 mm |
R-PDSO-G28 |
3 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
SMALL OUTLINE |
SOP8,.23 |
2 V |
85 Cel |
-40 Cel |
DUAL |
1.75 mm |
3.9 mm |
4.9 mm |
CMOS |
1.27 mm |
R-PDSO-G8 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
.55 mm |
4 mm |
Capacitive Touch Sense Controller |
4 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N24 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.95 mm |
6 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
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|
NXP Semiconductors |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.12SQ,16 |
1.62 V |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
.33 mm |
3 mm |
30 |
260 |
3 mm |
CMOS |
1.8 V |
.4 mm |
S-PQCC-N20 |
1 |
e4 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
338 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.42 V |
32 |
1.35,1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA338,19X19,25 |
1.28 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.3 mm |
8192 |
13 mm |
32 |
30 |
260 |
13 mm |
CMOS |
1.35 V |
Digital Signal Processors |
I2C; SPI; UART; USB |
.65 mm |
FIXED POINT |
S-PBGA-B338 |
3 |
Not Qualified |
e1 |
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|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
47 |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
MICROELECTRONIC ASSEMBLY |
2.1 V |
85 Cel |
-40 Cel |
NICKEL GOLD |
UNSPECIFIED |
3.34 mm |
17.8 mm |
250 |
26.7 mm |
CMOS |
3.3 V |
1.27 mm |
R-XXMA-N47 |
e4 |
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|
Infineon Technologies |
PSoC |
INDUSTRIAL |
PURE TIN |
30 |
260 |
3 |
Not Qualified |
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|
NXP Semiconductors |
SoC |
INDUSTRIAL |
TIN |
40 |
260 |
3 |
e3 |
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|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.6 mm |
2 mm |
260 |
3 mm |
CMOS |
I2C |
.5 mm |
R-PDSO-N8 |
1 |
e4 |
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|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
SMALL OUTLINE |
SOP8,.23 |
2 V |
85 Cel |
-40 Cel |
DUAL |
1.75 mm |
3.9 mm |
4.9 mm |
CMOS |
1.27 mm |
R-PDSO-G8 |
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|
NXP Semiconductors |
SYSTEM ON CHIP |
INDUSTRIAL |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196,14X14,32 |
1.15 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.52 mm |
10 mm |
24MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE |
40 |
260 |
10 mm |
CMOS |
.65 mm |
S-PBGA-B196 |
3 |
e1 |
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|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.465 V |
TS 16949 |
SMALL OUTLINE, SHRINK PITCH |
SSOP20,.3 |
3.135 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
2 mm |
5.3 mm |
ALSO OPERATES AT 5V SUPPLY |
40 |
260 |
7.2 mm |
CMOS |
3.3 V |
.65 mm |
R-PDSO-G20 |
2 |
Not Qualified |
e3 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
8 |
6 mm |
TIMER(4) |
0 |
30 |
260 |
6 mm |
8192 |
CMOS |
3 V |
Other uPs/uCs/Peripheral ICs |
I2C; SPI; USART; USB |
.5 mm |
S-PQCC-N40 |
3 |
Not Qualified |
e4 |
23 |
Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.
Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.
Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.
Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.