INDUSTRIAL Other Function uPs,uCs & Peripheral ICs 2,400+

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	No. of Bits	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	No. of Timers	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
CY8CPLC10-28PVXI	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V							5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	85 Cel			-40 Cel	MATTE TIN		DUAL		2 mm			5.3 mm							20	260	10.2 mm			CMOS			5 V				Other uPs/uCs/Peripheral ICs				.65 mm		R-PDSO-G28	3	Not Qualified			e3
AM4372BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.326 V								GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			17 mm							30	260	17 mm			CMOS			1.26 V								.65 mm		S-PBGA-B491	3				e1
ATSHA204A-MAHDA-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVQCCN	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V		TS 16949						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.08,20	2 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD		DUAL		.6 mm			2 mm							30	260	3 mm			CMOS			3.3 V								.5 mm		R-PQCC-N8	1				e4
MCIMX6X4CVM08AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V								GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.275 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.52 mm			19 mm							40	260	19 mm			CMOS											.8 mm		S-PBGA-B529	3				e1
CC1310F64RHBT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.8 V								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			5 mm							NOT SPECIFIED	260	5 mm		28672	CMOS			3.3 V								.5 mm		S-PQCC-N32	3				e4
MCIMX6X1CVK08AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V								GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			14 mm							40	260	14 mm			CMOS											.8 mm		S-PBGA-B400	3				e1
ZL30250LDG1	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	1.89 V								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.71 V	85 Cel			-40 Cel			QUAD		1 mm			5 mm		IT ALSO OPERATES AT 3.3V NOMINAL SUPPLY							5 mm			CMOS			1.8 V								.5 mm		S-XQCC-N32
AX-SFUS-1-01-TB05	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	UNSPECIFIED		YES	3.6 V								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel			-40 Cel	NICKEL GOLD PALLADIUM		QUAD		1 mm			5 mm							30	260	7 mm			CMOS			3 V								.5 mm		R-XQCC-N40	1
AM5716AABCX	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V								GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm							30	250	23 mm			CMOS			1.15 V								.8 mm		S-PBGA-B760	3				e1
LTC4263IS#PBF	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V								SMALL OUTLINE		4.5 V	85 Cel			-40 Cel	MATTE TIN		DUAL		1.752 mm			3.899 mm							30	260	8.649 mm			CMOS			5 V								1.27 mm		R-PDSO-G14	1	Not Qualified			e3
ATWINC1500-MR210PB1140	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED		YES	4.2 V								MICROELECTRONIC ASSEMBLY		3 V	85 Cel			-40 Cel			UNSPECIFIED		2.113 mm			14.73 mm		SEATED HGT-NOM					NOT SPECIFIED	NOT SPECIFIED	21.72 mm			CMOS			3.6 V										R-XXMA-N28
CY8C4248LQI-BL543	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL																							PURE TIN																																	3
S32G274AABK0VUCT	NXP Semiconductors	SoC	INDUSTRIAL																																					40	260																		3
SCANSTA112SMX	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V							3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA100,10X10,32	3 V	85 Cel			-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM		1.5 mm			10 mm					0		NOT SPECIFIED	235	10 mm			CMOS			3.3 V				Other Microprocessor ICs				.8 mm		S-PBGA-B100	3	Not Qualified			e0
ATECC608A-SSHCZ-B	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V		TS 16949						SMALL OUTLINE	SOP8,.23	2 V	85 Cel			-40 Cel			DUAL		1.75 mm			3.9 mm									4.9 mm			CMOS											1.27 mm		R-PDSO-G8
XCZU11EG-2FFVC1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM												30	245				CMOS			.85 V										R-PBGA-B1760	4				e1
AM5716AABCXA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V								GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm							30	250	23 mm			CMOS			1.15 V								.8 mm		S-PBGA-B760	3				e1
MCIMX6Y2CVM08AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V								GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.325 V	105 Cel			-40 Cel			BOTTOM		1.32 mm			14 mm							40	260	14 mm			CMOS											.8 mm		S-PBGA-B289
SLS32AIA020X2USON10XTMA4	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY		YES	5.5 V								SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.12,20	1.62 V	105 Cel			-40 Cel	NICKEL GOLD PALLADIUM SILVER		DUAL		.6 mm			3 mm									3 mm			CMOS			5 V								.5 mm		S-PDSO-N10	1
XCZU4CG-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM												30	245				CMOS			.85 V										R-PBGA-B900	4				e1
XCZU5EV-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM												30	250				CMOS			.85 V										R-PBGA-B784	4				e1
DS8007-ENG	Maxim Integrated	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	6 V							3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	2.7 V	85 Cel			-40 Cel	TIN LEAD		QUAD		1.6 mm			7 mm									7 mm			CMOS		325 mA	3.3 V				Other Microprocessor ICs				.5 mm		S-PQFP-G48	1	Not Qualified			e0
DS8007-ENG+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	6 V							3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	2.7 V	85 Cel			-40 Cel	Matte Tin (Sn) - annealed		QUAD		1.6 mm			7 mm							30	260	7 mm			CMOS		325 mA	3.3 V				Other Microprocessor ICs				.5 mm		S-PQFP-G48	1	Not Qualified			e3
MCP25050T-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V		TS 16949		8			3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel			-40 Cel	Matte Tin (Sn)		DUAL		1.75 mm			3.9 mm									8.65 mm			CMOS			5 V				Parallel IO Port				1.27 mm		R-PDSO-G14	1	Not Qualified			e3
MKW41Z512VHT4R	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED		YES	3.6 V								CHIP CARRIER		1.71 V	105 Cel			-40 Cel	NICKEL GOLD		QUAD												40	260				CMOS			3.3 V										S-XQCC-N48	3				e4
MSP430F67791AIPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V			0		NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	524288	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY		BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm		32768	CMOS	6-Ch 10-Bit		3.3 V		YES			I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		R-PQFP-G128	3		25 rpm		e4	8	90
MSP430F67791AIPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V			0		NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	524288	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY		BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	14 mm		32768	CMOS	6-Ch 10-Bit		3.3 V		YES			I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3		25 rpm		e4	8	62
XAZU2EG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY		YES									GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.43 mm			21 mm							30	250	21 mm			CMOS			.72 V								.8 mm		S-PBGA-B625	3				e1
CY8C4146LQI-S432	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL																							PURE TIN																																	3
XCZU2EG-1SBVA484I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM																	CMOS			.85 V										R-PBGA-B484	4				e1
CC3220MODASM2MONR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED		YES	3.6 V					NO			CHIP CARRIER		2.3 V	85 Cel			-40 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.41 mm	1024000	256	20.5 mm	0			TIMER(4), WDT	0		30	260	25 mm		262144	CMOS	4-Ch 12-Bit		3.3 V		NO			I2C, I2S, SPI, UART	FLASH	I2C; I2S; SPI; UART	1.27 mm		R-XBCC-B63	3				e4	8	25
MSP430F67791IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V						16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	524288	32	14 mm					0		30	260	14 mm		32768	CMOS		11.75 mA	3.3 V				Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3	Not Qualified	25 rpm		e4
MSP430F6779AIPZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V			0		NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	524288	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY		BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	14 mm		32768	CMOS	6-Ch 10-Bit		3.3 V		YES			I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3		25 rpm		e4	8	62
XCZU25DR-1FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM												30	245				CMOS			.85 V										R-PBGA-B1156	4				e1
XCZU25DR-L1FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.742 V								GRID ARRAY		.698 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY					30	245				CMOS			.72 V										R-PBGA-B1156	4				e1
FCM8531QY	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V								FLATPACK, LOW PROFILE	QFP32,.35SQ,32	4.5 V	85 Cel			-40 Cel			QUAD		1.6 mm			7 mm							NOT SPECIFIED	NOT SPECIFIED	7 mm			CMOS			5 V							I2C; SPI; UART	.8 mm		S-PQFP-G32
LTC4263IDE#PBF	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V								SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		4.5 V	85 Cel			-40 Cel	MATTE TIN		DUAL		.8 mm			3 mm							30	260	4 mm			CMOS			5 V								.5 mm		R-PDSO-N14	1	Not Qualified			e3
CC2540F256RHAR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V							3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm		8	6 mm				COMPARATORS, TIMER(4)			30	260	6 mm		8192	CMOS			3 V				Other uPs/uCs/Peripheral ICs			SPI; USART; USB	.5 mm		S-PQCC-N40	3	Not Qualified			e4		21
CC3220MODSM2MOBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED	NO	YES	3.6 V	8		0		NO			CHIP CARRIER		2.3 V	85 Cel	CORTEX-M4	0	-40 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.45 mm	1024000	256	17.5 mm	0		YES	TIMER(4), WDT	0		30	260	20.5 mm	4	262144	CMOS	4-Ch 12-Bit		3.3 V	2	NO	2		I2C, I2S, SD, SPI, UART	FLASH		1.27 mm	FIXED POINT	R-XBCC-B63	3		2400 rpm	YES	e4	8	25
MSP430F6779IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V						16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	524288	32	14 mm					0	25 MHz	30	260	14 mm		32768	CMOS		11.75 mA	3.3 V				Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3	Not Qualified	25 rpm		e4
NT3H2111W0FHK	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	SQUARE	UNSPECIFIED		YES	3.6 V								CHIP CARRIER		1.67 V	105 Cel			-40 Cel			QUAD		.5 mm			1.6 mm									1.6 mm			CMOS			1.8 V										S-XQCC-N8
XAM6442ASFGGAALV	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY		YES	.79 V								GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.652 mm			17.2 mm		ALSO OPERATES AT 0.85V NOMINAL SUPPLY						250	17.2 mm			CMOS			.75 V								.8 mm		S-PBGA-B441	3		1000 rpm		e1
MCIMX283CVM4BR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.55 V							1.4,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.37 mm			14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V					40	260	14 mm			CMOS			1.45 V				Microprocessors				.8 mm		S-PBGA-B289	3	Not Qualified			e1
XCZU25DR-2FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM												30	245				CMOS			.85 V										R-PBGA-B1156	4				e1
MCIMX6Y2CVM05AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V								GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel			-40 Cel			BOTTOM		1.32 mm			14 mm							40	260	14 mm			CMOS											.8 mm		S-PBGA-B289
MCIMX357CJQ5CR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.47 V								GRID ARRAY, LOW PROFILE, FINE PITCH		1.22 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			17 mm							40	260	17 mm						1.8 V								.8 mm		S-PBGA-B400	3				e1
MIMXRT1051CVJ5BR	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V								GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel			-40 Cel			BOTTOM		1.52 mm			12 mm									12 mm			CMOS											.8 mm		S-PBGA-B196
AM4376BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.326 V								GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			17 mm							30	260	17 mm			CMOS			1.26 V								.65 mm		S-PBGA-B491	3				e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.