INDUSTRIAL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
MCIMX6X3CVO08AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.53 mm			17 mm					40	260	17 mm		CMOS						.8 mm		S-PBGA-B400	3			e1
S32G254ASBK0VUCR	NXP Semiconductors	SoC	INDUSTRIAL																												40	260												3
STV0991FA	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel		-40 Cel			BOTTOM	1.12 mm			10 mm					NOT SPECIFIED	NOT SPECIFIED	10 mm		CMOS		1.1 V				.65 mm		S-PBGA-B201
STV0991FA/TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel		-40 Cel			BOTTOM	1.12 mm			10 mm					NOT SPECIFIED	NOT SPECIFIED	10 mm		CMOS		1.1 V				.65 mm		S-PBGA-B201
STV0991FAR/TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel		-40 Cel			BOTTOM	1.12 mm			10 mm					NOT SPECIFIED	NOT SPECIFIED	10 mm		CMOS		1.1 V				.65 mm		S-PBGA-B201
XCZU4CG-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM									30	245			CMOS		.85 V						R-PBGA-B900	4			e1
DM355SDZCEA216	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O		32		30	260	13 mm		CMOS		1.3 V	Digital Signal Processors		I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
MSP430F67641AIPNR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm		8	12 mm			0		30	260	12 mm	8192	CMOS		3.3 V			I2C; SPI; UART	.5 mm		S-PQFP-G80	3			e4
MXD1210EWE	Maxim Integrated	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	TIN LEAD		DUAL	1.75 mm			3.9 mm							9.9 mm		CMOS	.5 mA	5 V				1.27 mm		R-PDSO-G16	1	Not Qualified		e0
MXD1210EWE+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL	1.75 mm			3.9 mm					30	260	9.9 mm		CMOS		5 V				1.27 mm		R-PDSO-G16	1	Not Qualified		e3
S32G234MABK0VUCT	NXP Semiconductors	SoC	INDUSTRIAL																												40	260												3
S32G234MSBK0VUCR	NXP Semiconductors	SoC	INDUSTRIAL																												40	260												3
S32G234MSBK0VUCT	NXP Semiconductors	SoC	INDUSTRIAL																												40	260												3
S32G254AABK0CUCR	NXP Semiconductors	SoC	INDUSTRIAL																												40	260												3
S32G254AABK0CUCT	NXP Semiconductors	SoC	INDUSTRIAL																												40	260												3
S32G254AABK0VUCR	NXP Semiconductors	SoC	INDUSTRIAL																												40	260												3
S32G254AABK0VUCT	NXP Semiconductors	SoC	INDUSTRIAL																												40	260												3
S32G254ASBK0VUCT	NXP Semiconductors	SoC	INDUSTRIAL																												40	260												3
TDA8029HL/C207	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	6 V				FLATPACK, LOW PROFILE		2.7 V	90 Cel		-40 Cel			QUAD	1.6 mm			7 mm							7 mm		CMOS		3.3 V				.8 mm		S-PQFP-G32
XCZU48DR-2FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM									30	240			CMOS		.85 V						R-PBGA-B1517	4			e1
ATECC608B-RBHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	3	VBCC	RECTANGULAR	UNSPECIFIED	YES	5.5 V				CHIP CARRIER, VERY THIN PROFILE		2 V	85 Cel		-40 Cel			BOTTOM	.55 mm			2.5 mm							6.5 mm		CMOS					1-WIRE	2 mm		R-XBCC-N3
OMAPL138EZCED4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm			13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	13 mm		CMOS		1.3 V			I2C; SPI; UART; USB	.65 mm		S-PBGA-B361	3		456 rpm	e1
TMS320DM365ZCEF	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.14 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		8192	13 mm			32		30	260	13 mm		CMOS		1.2 V	Digital Signal Processors		I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
ATWINC1510-MR210PB	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel			UNSPECIFIED	2.113 mm			14.73 mm	SEATED HGT-NOM				NOT SPECIFIED	NOT SPECIFIED	21.72 mm		CMOS		3.6 V						R-XXMA-N28
ADSP-21583BBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm			19 mm				500 MHz	30	260	19 mm		CMOS		1.1 V			SPI; UART	.8 mm		S-PBGA-B349	3			e1
AM4376BZDND30	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	.912 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm			17 mm					30	260	17 mm		CMOS		.95 V				.65 mm		S-PBGA-B491	3			e1
AM4378BZDND80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm			17 mm					30	260	17 mm		CMOS		1.26 V				.65 mm		S-PBGA-B491	3			e1
ATWINC3400-MR210CA122-T	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel			UNSPECIFIED	2.087 mm			14.732 mm	SEATED HGT-CALCULATED				NOT SPECIFIED	NOT SPECIFIED	22.428 mm		CMOS		3.6 V				1.204 mm		R-XXMA-N36
C8051F062-GQ	Silicon Labs	SoC	INDUSTRIAL										3							TIN											40	260						Microcontrollers						3	Not Qualified		e3
CC430F5145IRGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	16384	2	7 mm	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	TIMER	0	20 MHz	30	260	7 mm	2048	CMOS		3.3 V	Microcontrollers	FLASH	I2C; SPI; UART; USB	.5 mm		S-PQCC-N48	3	Not Qualified	20 rpm	e4	30
CC430F6147IRGCR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD SILVER	YES	QUAD	1 mm	32768	4	9 mm	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY		0	20 MHz	30	260	9 mm	4096	CMOS		3.3 V	Microcontrollers	FLASH	I2C; SPI; UART; USB	.5 mm		S-PQCC-N64	3	Not Qualified	20 rpm	e4
MCIMX357CJQ5C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm			17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V				40	260	17 mm		CMOS		1.8 V				.8 mm		S-PBGA-B400	3	Not Qualified		e1
MSP430F67761IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	262144	16	14 mm			0		30	260	14 mm	16384	CMOS	11.75 mA	3.3 V	Microcontrollers	FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3	Not Qualified	25 rpm	e4
ATWINC1500B-MU-T042	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	2.7 V	85 Cel		-40 Cel	MATTE TIN		QUAD	1 mm			5 mm				48 MHz			5 mm		CMOS		3.3 V				.4 mm		S-PQCC-N40				e3
ATWINC1500B-MU-Y042	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	2.7 V	85 Cel		-40 Cel	MATTE TIN		QUAD	1 mm			5 mm				48 MHz			5 mm		CMOS		3.3 V				.4 mm		S-PQCC-N40				e3
AX-SFUS-API-1-01-TB05	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel		-40 Cel	NICKEL GOLD PALLADIUM		QUAD	1 mm			5 mm					30	260	7 mm		CMOS		3 V				.5 mm		R-XQCC-N40	1
CC430F5123IRGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	8192	2	7 mm	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	TIMER	0	20 MHz	30	260	7 mm	2048	CMOS		3.3 V	Microcontrollers	FLASH	I2C; SPI; UART; USB	.5 mm		S-PQCC-N48	3	Not Qualified	20 rpm	e4	30
CC430F5125IRGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	16384	2	7 mm	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	TIMER	0	20 MHz	30	260	7 mm	2048	CMOS		3.3 V	Microcontrollers	FLASH	I2C; SPI; UART	.5 mm		S-PQCC-N48	3	Not Qualified	20 rpm	e4	30
CC430F5143IRGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	8192	2	7 mm	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	TIMER	0	20 MHz	30	260	7 mm	2048	CMOS		3.3 V	Microcontrollers	FLASH	I2C; SPI; UART	.5 mm		S-PQCC-N48	3	Not Qualified	20 rpm	e4	30
DS8023-RJX+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V			3.3,5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL	1.1 mm			4.4 mm					30	260	9.7 mm		CMOS	215 mA	3.3 V	Other Microprocessor ICs			.65 mm		R-PDSO-G28	1	Not Qualified		e3
DS8023-RJX+T&R	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		2.7 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL	1.1 mm			4.4 mm	ALSO AVAILABLE IN 5V				30	260	9.7 mm		CMOS		3.3 V				.65 mm		R-PDSO-G28	1			e3
DS8023-RRX+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V			3.3,5	SMALL OUTLINE	SOP28,.4	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL	2.65 mm			7.5 mm					30	260	17.9 mm		CMOS	215 mA	3.3 V	Other Microprocessor ICs			1.27 mm		R-PDSO-G28	1	Not Qualified		e3
DS8023-RRX+T&R	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V				SMALL OUTLINE		2.7 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL	2.65 mm			7.5 mm	ALSO AVAILABLE IN 5V				30	260	17.9 mm		CMOS		3.3 V				1.27 mm		R-PDSO-G28	1			e3
LTC4263IDE-1#TRPBF	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		4.5 V	85 Cel		-40 Cel	MATTE TIN		DUAL	.8 mm			3 mm					30	260	4 mm		CMOS		5 V				.5 mm		R-PDSO-N14	1	Not Qualified		e3
LTC4263IS#TRPBF	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	MATTE TIN		DUAL	1.752 mm			3.899 mm					30	260	8.649 mm		CMOS		5 V				1.27 mm		R-PDSO-G14	1	Not Qualified		e3
MCIMX27LMOP4A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	85 Cel		-40 Cel			BOTTOM	1.54 mm			19 mm	ALSO OPERATES WITH 1.3VNOM @266MHZ				40	260	19 mm		CMOS		1.45 V				.8 mm		S-PBGA-B473	3	Not Qualified
MSP430F67491IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	524288	32	14 mm			0		30	260	14 mm	32768	CMOS	11.75 mA	3.3 V	Microcontrollers	FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3	Not Qualified	25 rpm	e4
MSP430F67791IPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	524288	32	14 mm			0		30	260	20 mm	32768	CMOS	11.75 mA	3.3 V	Microcontrollers	FLASH	I2C; SPI; UART	.5 mm		R-PQFP-G128	3	Not Qualified	25 rpm	e4

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.