INDUSTRIAL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	ADC Channels	Ultraviolet Erasable	Terminal Position	DMA Channels	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	Technology	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
CY8C4248LQI-BL563	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL																		PURE TIN																							3
CY8C5288LTI-LP090	Infineon Technologies	PSoC	INDUSTRIAL																		NICKEL PALLADIUM GOLD																							3			e4
CY8C5466LTI-063T	Cypress Semiconductor		INDUSTRIAL	NO LEAD	68	QCCN	SQUARE	PLASTIC/EPOXY	YES						3/5	CHIP CARRIER	LCC68,.32SQ,16		85 Cel	-40 Cel			N	QUAD										524288 Bits	CMOS				Other Microprocessor ICs			.4 mm	S-PQCC-N68		Not Qualified
CY8CPLC20-28PVXI	Cypress Semiconductor	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V					5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	85 Cel	-40 Cel	MATTE TIN			DUAL		2 mm	5.3 mm				20	260	10.2 mm		CMOS	14 mA	5 V		Other Microprocessor ICs			.65 mm	R-PDSO-G28	3	Not Qualified		e3
EM3581-RTR	Silicon Labs	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.32 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.18 V	85 Cel	-40 Cel				QUAD		.9 mm	7 mm						7 mm		CMOS		1.25 V					.5 mm	S-PQCC-N48
MTFC64GJVDN-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	169	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.65 V	85 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		1.4 mm	14 mm	IT ALSO OPERATES AT 3.3 VOLTS					18 mm		CMOS		1.8 V					.5 mm	R-PBGA-B169				e1
SI3454-B01-IM	Silicon Labs	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	38	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	3.6 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	85 Cel	-40 Cel	MATTE TIN			QUAD		.9 mm	5 mm				40	260	7 mm		CMOS		3.3 V					.5 mm	R-XQCC-N38	3			e3
SI3459-B02-IM	Silicon Labs	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	85 Cel	-40 Cel				QUAD		.9 mm	8 mm				NOT SPECIFIED	NOT SPECIFIED	8 mm		CMOS		3.3 V					.5 mm	S-XQCC-N56
TMP82C79P-2	Toshiba	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V						IN-LINE		4.5 V	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)			DUAL		4.8 mm	15.24 mm						50.7 mm			5 mA	5 V					2.54 mm	R-PDIP-T40		Not Qualified		e0
XAZU2EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		3.43 mm	21 mm				30	250	21 mm		CMOS		.85 V					.8 mm	S-PBGA-B625	3			e1
XAZU2EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		3.32 mm	23 mm				30	250	23 mm		CMOS		.85 V					.8 mm	S-PBGA-B784	4			e1
XCZU15EG-1FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM							30	245			CMOS		.85 V						R-PBGA-B1156	4			e1
XCZU15EG-L1FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245			CMOS		.72 V						R-PBGA-B1156	4			e1
XCZU17EG-2FFVC1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM							30	245			CMOS		.85 V						R-PBGA-B1760	4			e1
XCZU27DR-2FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM							30	240			CMOS		.85 V						R-PBGA-B1517	4			e1
XCZU49DR-1FSVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM							30	240			CMOS		.85 V						R-PBGA-B1760	4			e1
XCZU49DR-2FSVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM							30	240			CMOS		.85 V						R-PBGA-B1760	4			e1
XCZU49DR-L2FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM							30	245			CMOS		.72 V						R-PBGA-B1760	4			e1
XCZU4EG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM							30	250			CMOS		.85 V						R-PBGA-B784	4			e1
XCZU6CG-2FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM							30	245			CMOS		.85 V						R-PBGA-B900	4			e1
XCZU7CG-2FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM							30	245			CMOS		.85 V						R-PBGA-B1517	4			e1
XCZU7EG-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM							30	245			CMOS		.85 V						R-PBGA-B900	4			e1
HSA2-040SAA/A2320A	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V						SMALL OUTLINE	SOP28,.4	3.135 V	85 Cel	-40 Cel	MATTE TIN			DUAL		2.64 mm	7.49 mm						17.87 mm		CMOS		3.3 V				USB	1.27 mm	R-PDSO-G28	1			e3
HSA2-040SCA/A2324	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28		RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V								3.135 V	85 Cel	-40 Cel	Matte Tin (Sn)			DUAL								250			CMOS		3.3 V						R-PDSO-G28	1			e3
66AK2L06XCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V						GRID ARRAY, FINE PITCH		.95 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM		3.55 mm	25 mm				30	245	25 mm		CMOS		1.05 V					.8 mm	S-PBGA-B900	4			e1
ADSP-SC584CBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel				BOTTOM		1.5 mm	19 mm			500 MHz	30	260	19 mm		CMOS		1.1 V				SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC587BBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel				BOTTOM		1.5 mm	19 mm			500 MHz	30	260	19 mm		CMOS		1.1 V				SPI; UART	.8 mm	S-PBGA-B349	3
ADUCM330WFSBCPZ-RL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	18 V	AEC-Q100					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.24SQ,20	3.6 V	115 Cel	-40 Cel				QUAD		1 mm	6 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm		CMOS						SPI	.5 mm	S-XQCC-N32
AGB75LC04-QU-E	Amulet Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V						FLATPACK, FINE PITCH	QFP208,1.2SQ,20	1.08 V	85 Cel	-40 Cel				QUAD		4.1 mm	28 mm						28 mm		CMOS		1.2 V					.5 mm	S-PQFP-G208	3
AT97SC3205-U3A15-20	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES			0	NO	8		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25		85 Cel	-40 Cel	MATTE TIN	NO		DUAL	NO	1.1 mm	4.4 mm		0				9.7 mm		CMOS		3.3 V	NO		EEPROM	I2C	.65 mm	R-PDSO-G28			33 rpm	e3	6
ATECC608A-TNGTLSU-G	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)			DUAL		.6 mm	2 mm						3 mm		CMOS						I2C	.5 mm	R-PDSO-N8				e4
ATSAM4C32CA-AU	Microchip Technology	SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V						FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.08 V	85 Cel	-40 Cel	MATTE TIN			QUAD		1.6 mm	14 mm				40	260	14 mm		CMOS		1.2 V					.5 mm	S-PQFP-G100	3			e3
ATWINC1510B-MU-Y042	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	2.7 V	85 Cel	-40 Cel	MATTE TIN			QUAD		1 mm	5 mm			48 MHz			5 mm		CMOS		3.3 V					.4 mm	S-PQCC-N40				e3
ATWINC3400-MR210CA131-T	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	4.2 V						MICROELECTRONIC ASSEMBLY		2.5 V	85 Cel	-40 Cel				UNSPECIFIED		2.0874 mm	14.732 mm	SEATED HGT-CALCULATED			NOT SPECIFIED	NOT SPECIFIED	22.3774 mm		CMOS		3.6 V					1.204 mm	R-XXMA-N36
CC-WMX-L87C-TE	Digi International	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	400	LGA	SQUARE	UNSPECIFIED	YES							GRID ARRAY			85 Cel	-40 Cel				BOTTOM			50 mm						50 mm		CMOS							2 mm	S-XBGA-N400
CEC1712H-S2-I/SX	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	84	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA84,10X10,25	1.71 V	85 Cel	-40 Cel				BOTTOM		.8 mm	7 mm	3.3V NOM SUPPLY ALSO AVAILABLE					7 mm		CMOS		1.8 V				I2C, QSPI, UART	.65 mm	S-PBGA-B84
CY8C4024LQI-S413	Infineon Technologies	PSoC	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.71 V	85 Cel	-40 Cel	PURE TIN			QUAD		.6 mm	6 mm						6 mm		CMOS		1.8 V					.5 mm	S-XQCC-N40	3
HSA2-040SCA/A2320A	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28		RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V								3.135 V	85 Cel	-40 Cel	MATTE TIN			DUAL								250			CMOS		3.3 V						R-PDSO-G28	1			e3
HSA2-040SCA/A2324TR	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V						SMALL OUTLINE		3.135 V	85 Cel	-40 Cel	Matte Tin (Sn)			DUAL								250			CMOS		3.3 V						R-PDSO-G28	1			e3
LH7A404N0F000B3	NXP Semiconductors		INDUSTRIAL	BALL	324	FBGA	SQUARE	CERAMIC	YES						1.8,3.3	GRID ARRAY, FINE PITCH	BGA324,20X20,32		85 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM							30	260							Other uPs/uCs/Peripheral ICs			.8 mm	S-XBGA-B324	3	Not Qualified		e1
MC68302CAG16VC	NXP Semiconductors		INDUSTRIAL	GULL WING	144	QFP	SQUARE	CERAMIC	YES						5	FLATPACK	QFP144,.87SQ,20		85 Cel	-40 Cel	TIN			QUAD							40	260			CMOS		5 V		Other uPs/uCs/Peripheral ICs			.5 mm	S-XQFP-G144	3	Not Qualified		e3
MCIMX258CJM4A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V					1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	85 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		1.6 mm	17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY			40	260	17 mm		CMOS		1.45 V		Microprocessors			.8 mm	S-PBGA-B400	3	Not Qualified		e1
MCIMX283CVM4CR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel				BOTTOM		1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm		CMOS		1.45 V					.8 mm	S-PBGA-B289	3
MCIMX285AVM4B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V	AEC-Q100				1.4,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm		CMOS		1.45 V		Microprocessors			.8 mm	S-PBGA-B289	3	Not Qualified		e1
MCIMX6D7CZK08AD	NXP Semiconductors	SoC	INDUSTRIAL	BALL	569	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA569,29X29,16	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		1.25 mm	12 mm				40	260	12 mm		CMOS		1.4 V					.4 mm	S-PBGA-B569	3			e1
MCIMX6Q7CZK08AD	NXP Semiconductors	SoC	INDUSTRIAL	BALL	569	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA569,29X29,16	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		1.25 mm	12 mm				40	260	12 mm		CMOS		1.4 V					.4 mm	S-PBGA-B569	3			e1
MEC1418-I/SZ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		.8 mm	9 mm						9 mm		CMOS		3 V					.65 mm	S-PBGA-B144				e1
MEC1705Q-C2-I/SZ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel				BOTTOM		.8 mm	9 mm	ALSO OPERATES AT 3.3V NOMINAL SUPPLY VOLTAGE					9 mm		CMOS		1.8 V					.65 mm	S-PBGA-B144

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.