INDUSTRIAL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	ROM Words	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	ROM Programmability	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
XCZU27DR-2FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM					30	240				CMOS		.85 V				R-PBGA-B1156	4			e1
XCZU27DR-2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM					30	245				CMOS		.85 V				R-PBGA-B1517	4			e1
MCIMX6U7CVM08AD	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	40	260	21 mm			CMOS					.8 mm	S-PBGA-B624	3			e1
XCZU28DR-L2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM					30	245				CMOS		.72 V				R-PBGA-B1517	4			e1
XCZU29DR-1FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM					30	245				CMOS		.85 V				R-PBGA-B1760	4			e1
CY8C20667S-24LQXI	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	8	1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	85 Cel	M8C	-40 Cel	PURE TIN		QUAD	.6 mm	32768	6 mm		30	260	6 mm		2048	CMOS	4 mA	3.3 V	Microcontrollers	FLASH	.4 mm	S-XQCC-N48	3	Not Qualified	25.2 rpm
XCZU3CG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM				IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)	30	250				CMOS		.72 V				S-PBGA-B784	4			e1
XCZU49DR-1FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM										CMOS		.85 V				R-PBGA-B1760	4			e1
XCZU6CG-1FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM					30	245				CMOS		.85 V				R-PBGA-B1156	4			e1
EM341-RTR	Silicon Labs	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.9 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.18 V	85 Cel		-40 Cel	MATTE TIN		QUAD	.9 mm		7 mm		40	260	7 mm			CMOS		1.25 V			.5 mm	S-PQCC-N48	2			e3
SI1000-E-GM2	Silicon Labs	MICROCONTROLLER	INDUSTRIAL	BUTT	42	HLGA	RECTANGULAR	UNSPECIFIED	YES	3.6 V			GRID ARRAY, HEAT SINK/SLUG		1.8 V	85 Cel		-40 Cel			BOTTOM	.95 mm		5 mm	ALSO WORKING TWO CELL MODE AT 2.4V NOM. SUPPLY.	40	260	7 mm			CMOS		1.9 V			.5 mm	R-XBGA-B42	2
XCZU3EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	250				CMOS		.72 V				R-PBGA-B784	4			e1
XCZU9EG-2FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM					30	245				CMOS		.85 V				R-PBGA-B900	4			e1
88AP270MA2-BHE1E312	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V		1.8/3.3			1.8 V				TIN SILVER COPPER		BOTTOM										CMOS			Graphics Processors					Not Qualified		e1
EM3587-RTR	Silicon Labs	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.32 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.18 V	85 Cel		-40 Cel			QUAD	.9 mm		7 mm				7 mm			CMOS		1.25 V			.5 mm	S-PQCC-N48
MCIMX287CVM4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel		-40 Cel			BOTTOM	1.37 mm		14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm			CMOS		1.45 V			.8 mm	S-PBGA-B289	3
MCIMX6G2CVM05AA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel		-40 Cel			BOTTOM	1.32 mm		14 mm		40	260	14 mm			CMOS					.8 mm	S-PBGA-B289	3
XCZU19EG-1FFVD1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM					30	245				CMOS		.85 V				R-PBGA-B1760	4			e1
XCZU47DR-1FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM					30	245				CMOS		.85 V				R-PBGA-B1517	4			e1
XCZU5EV-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM					30	250				CMOS		.85 V				R-PBGA-B784	4			e1
AT43USB326-AU	Atmel	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES			5	FLATPACK	QFP48,.35SQ,20		85 Cel		-40 Cel			QUAD											40 mA	5 V	Other Microprocessor ICs		.5 mm	S-PQFP-G48		Not Qualified
CY8C20647S-24LQXI	Cypress Semiconductor	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	8	1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	85 Cel	M8C	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	.6 mm	16384	6 mm		30	260	6 mm		2048	CMOS	4 mA	3.3 V	Microcontrollers	FLASH	.4 mm	S-XQCC-N48	3	Not Qualified	25.2 rpm	e4
CY8C3245PVI-134	Infineon Technologies	PSoC	INDUSTRIAL									1.8/5							NICKEL PALLADIUM GOLD	N						20	260		262144 Bits					Other uPs/uCs/Peripheral ICs				3	Not Qualified		e4
CY8C3445AXI-104	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	N	QUAD	1.6 mm		14 mm		40	260	14 mm	32768 Bits		CMOS		3.3 V	Other uPs/uCs/Peripheral ICs		.5 mm	S-PQFP-G100	3	Not Qualified		e4
CY8C4146AZI-S433	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL																PURE TIN																			3
CYAT81688-100AA77	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES	1.95 V			FLATPACK		1.71 V	85 Cel		-40 Cel			QUAD				IT ALSO OPERATES IN 3V TO 5.5V ANALOG SUPPLY						CMOS						S-PQFP-G100
CYPD3123-40LQXI	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.7 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm		6 mm				6 mm			CMOS		3.3 V			.5 mm	S-XQCC-N40	3			e4
MCIMX6DP7CVT8AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	2.16 mm		21 mm		40	260	21 mm			CMOS		1.4 V			.8 mm	S-PBGA-B624	3			e1
XAZU5EV-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH			100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	3.32 mm		23 mm		30	250	23 mm			CMOS		.72 V			.8 mm	S-PBGA-B784	4			e1
XCZU27DR-1FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM					30	245				CMOS		.85 V				R-PBGA-B1517	4			e1
XCZU2EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	250				CMOS		.72 V				R-PBGA-B784	4			e1
XCZU3EG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM					30	250				CMOS		.85 V				R-PBGA-B784	4			e1
XCZU47DR-2FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM					30	245				CMOS		.85 V				R-PBGA-B1156	4			e1
XCZU48DR-2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM					30	245				CMOS		.85 V				R-PBGA-B1517	4			e1
XCZU9CG-2FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM					30	245				CMOS		.85 V				R-PBGA-B1156	4			e1
XQ7Z020-1CL484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32		100 Cel		-40 Cel	TIN LEAD	N	BOTTOM	1.6 mm		19 mm		30	225	19 mm			CMOS			Other uPs/uCs/Peripheral ICs		.8 mm	S-PBGA-B484	3	Not Qualified		e0
88AP270MA2-BHE1E416	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V		1.8/3.3			1.8 V				TIN SILVER COPPER		BOTTOM										CMOS			Graphics Processors					Not Qualified		e1
88AP320-C0-BGR2C624-TN20	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V					1.8 V	85 Cel		-25 Cel			BOTTOM										CMOS
88AP320-C0-BGR2C624-TN21	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V					1.8 V	85 Cel		-25 Cel	TIN SILVER COPPER		BOTTOM										CMOS										e1
88AP320-C0-BGR2C806-TN21	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V					1.8 V	85 Cel		-25 Cel	TIN SILVER COPPER		BOTTOM										CMOS										e1
88AP320-C0-BGR2C806-TN31	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V					1.8 V	85 Cel		-25 Cel			BOTTOM										CMOS
CY8C20347-24LQXI	Cypress Semiconductor	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	8	1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	1.71 V	85 Cel	M8C	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	.6 mm	16384	4 mm		30	260	4 mm		2048	CMOS	4 mA	3.3 V	Microcontrollers	FLASH	.5 mm	S-XQCC-N24	3	Not Qualified	25.2 rpm	e4
CY8C24533-24PVXI	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V			SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	3 V	85 Cel		-40 Cel			DUAL	2 mm		5.3 mm				10.2 mm			CMOS		3.3 V			.65 mm	R-PDSO-G28
CY8C3246LTI-128	Infineon Technologies	PSoC	INDUSTRIAL									1.8/5							NICKEL PALLADIUM GOLD	N						30	260		524288 Bits					Other uPs/uCs/Peripheral ICs				3	Not Qualified		e4
CY8C4024LQI-S401	Infineon Technologies	PSoC	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm		4 mm		30	260	4 mm			CMOS		1.8 V			.5 mm	S-XQCC-N24	3			e4
CY8C4124AZI-S433	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL																PURE TIN																			3
CY8C4125FNI-S433T	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL																TIN SILVER COPPER																			1			e1
CY8C4127LQI-BL473	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL																Nickel/Palladium/Gold (Ni/Pd/Au)																			3			e4

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.