INDUSTRIAL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Information Access Method	Maximum Supply Voltage	Screening Level	Address Bus Width	No. of Bits	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Interrupt Capability	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Ultraviolet Erasable	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Minimum Time	Nominal Supply Voltage	PWM Channels	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Volatile	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
MTFC16GJDDQ-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES		3.6 V							GRID ARRAY, LOW PROFILE			2.7 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.4 mm			14 mm						30	260	18 mm			CMOS				3.3 V						1 mm	R-PBGA-B100					e1
XCZU19EG-2FFVC1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.876 V							GRID ARRAY			.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM											30	245				CMOS				.85 V							R-PBGA-B1760	4				e1
XCZU27DR-L2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.742 V							GRID ARRAY			.698 V	100 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM											30	245				CMOS				.72 V							R-PBGA-B1517	4				e1
XCZU27DR-L2FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.742 V							GRID ARRAY			.698 V	100 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM											30	240				CMOS				.72 V							R-PBGA-B1156	4				e1
XCZU7CG-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.876 V							GRID ARRAY			.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM											30	245				CMOS				.85 V							R-PBGA-B900	4				e1
XCZU7CG-1FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.876 V							GRID ARRAY			.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM											30	245				CMOS				.85 V							R-PBGA-B1156	4				e1
XQ7Z100-2RF900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES									GRID ARRAY				100 Cel		-40 Cel				BOTTOM		3.44 mm			31 mm						NOT SPECIFIED	NOT SPECIFIED	31 mm			CMOS										1 mm	S-PBGA-B900
ATSAMHA1E14A-MBT-BVAO	Microchip Technology	SoC	INDUSTRIAL
ATWINC1500-MR210UB	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES		4.2 V							MICROELECTRONIC ASSEMBLY			3 V	85 Cel		-40 Cel	MATTE TIN			UNSPECIFIED		2.113 mm			14.73 mm		SEATED HGT-NOM						21.72 mm			CMOS				3.6 V							R-XXMA-N28					e3
MCP25055-I/P	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		5.5 V	TS 16949		8			3/5	IN-LINE	DIP14,.3		2.7 V	85 Cel		-40 Cel	MATTE TIN			DUAL		4.318 mm			7.62 mm								19.05 mm			CMOS				5 V		Parallel IO Port				2.54 mm	R-PDIP-T14		Not Qualified			e3
MCP25055-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		5.5 V	TS 16949		8			3/5	SMALL OUTLINE	SOP14,.24		2.7 V	85 Cel		-40 Cel	Matte Tin (Sn)			DUAL		1.75 mm			3.9 mm								8.65 mm			CMOS				5 V		Parallel IO Port				1.27 mm	R-PDSO-G14	1	Not Qualified			e3
MCP25055T-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		5.5 V	TS 16949		8			3/5	SMALL OUTLINE	SOP14,.24		2.7 V	85 Cel		-40 Cel	Matte Tin (Sn)			DUAL		1.75 mm			3.9 mm								8.65 mm			CMOS				5 V		Parallel IO Port				1.27 mm	R-PDSO-G14	1	Not Qualified			e3
MKW21Z512VHT4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES		3.6 V							CHIP CARRIER			1.71 V	105 Cel		-40 Cel	NICKEL GOLD			QUAD											40	260				CMOS				3.3 V							S-XQCC-N48	3				e4
SLE952500000XTSA1	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES		1.6 V							GRID ARRAY	SOLCC6,.04,20		1.35 V	85 Cel		-40 Cel				BOTTOM		.4 mm			1.1 mm		ALSO OPERATES WITH 3.8V NOM SUPPLY						1.5 mm			CMOS				1.45 V						.5 mm	R-PBCC-N6	1
XCZU27DR-2FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.876 V							GRID ARRAY			.825 V	100 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM											30	245				CMOS				.85 V							R-PBGA-B1156	4				e1
XCZU2CG-L1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.742 V							GRID ARRAY			.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	250				CMOS				.72 V							R-PBGA-B484	4				e1
XCZU2CG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.742 V							GRID ARRAY			.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	250				CMOS				.72 V							R-PBGA-B625	4				e1
XCZU7CG-1FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.876 V							GRID ARRAY			.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM											30	245				CMOS				.85 V							R-PBGA-B1517	4				e1
66AK2G12ABYA60	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES		.945 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32		.855 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.56 mm			21 mm						30	260	21 mm			CMOS				.9 V						.8 mm	S-PBGA-B625	3				e1
ADSP-SC583CBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES		1.15 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32		1.05 V	95 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.5 mm			19 mm					500 MHz	30	260	19 mm			CMOS				1.1 V					SPI; UART	.8 mm	S-PBGA-B349	3				e1
AR1100T-I/SO	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		3.465 V	TS 16949						SMALL OUTLINE	SOP20,.4		3.135 V	85 Cel		-40 Cel	MATTE TIN			DUAL		2.65 mm			7.5 mm		ALSO OPERATES AT 5V SUPPLY						12.8 mm			CMOS				3.3 V						1.27 mm	R-PDSO-G20		Not Qualified			e3
ATECC608B-TNGTLSS-G	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		5.5 V							SMALL OUTLINE	SOP8,.23		2 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)			DUAL		1.75 mm			3.9 mm				0	1 MHz			4.9 mm			CMOS										1.27 mm	R-PDSO-G8					e4
CC430F6147IRGCT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES		3.6 V					16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD SILVER	YES		QUAD		1 mm	32768	4	9 mm		IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY		0	20 MHz	30	260	9 mm		4096	CMOS				3.3 V		Microcontrollers		FLASH	I2C; SPI; UART; USB	.5 mm	S-PQCC-N64	3	Not Qualified	20 rpm		e4
CY8C21323-24LFXI	Cypress Semiconductor	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES		5.25 V						2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		4.75 V	85 Cel		-40 Cel	Matte Tin (Sn)			QUAD		1 mm			4 mm		ALSO OPERATES AT 2.7V AND 3.3V SUPPLY				20	260	4 mm			CMOS				5 V		Microcontrollers				.5 mm	S-XQCC-N24	3	Not Qualified			e3
CY8C3244LTI-123	Infineon Technologies	PSoC	INDUSTRIAL														1.8/5								NICKEL PALLADIUM GOLD		N												20	260		131072 Bits								Other uPs/uCs/Peripheral ICs						3	Not Qualified			e4
CY8C4045LQI-S412	Infineon Technologies	PSoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES		1.89 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		1.71 V	85 Cel		-40 Cel	PURE TIN			QUAD		.6 mm			5 mm								5 mm			CMOS				1.8 V						.5 mm	S-XQCC-N32	3
CYPD3125-40LQXIT	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES		21.5 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			2.7 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD			QUAD		.6 mm			6 mm								6 mm			CMOS				3.3 V						.5 mm	S-XQCC-N40	3				e4
DS2465P+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES		3.63 V							SMALL OUTLINE			2.97 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed			DUAL		1.5 mm			3.76 mm						30	260	3.94 mm			CMOS				3.3 V						1.27 mm	R-PDSO-C6	1				e3
FCM8531RQY	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES		5.5 V							FLATPACK, LOW PROFILE	QFP32,.35SQ,32		4.5 V	85 Cel		-40 Cel				QUAD		1.6 mm			7 mm						NOT SPECIFIED	NOT SPECIFIED	7 mm			CMOS				5 V					I2C; SPI; UART	.8 mm	S-PQFP-G32
FM31256-G	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	SERIAL, FIXED PROTOCOL	5.5 V						3/5	SMALL OUTLINE	SOP14,.25	N	2.7 V	85 Cel		-40 Cel	PURE TIN			DUAL		1.75 mm			3.9 mm						30	260	8.64 mm			CMOS			SECONDS	3 V		Timer or RTC				1.27 mm	R-PDSO-G14	3	Not Qualified		NO
HCTL-2021	Broadcom	MICROPROCESSOR CIRCUIT	INDUSTRIAL	PIN/PEG	20		RECTANGULAR	UNSPECIFIED	NO		5.5 V							MICROELECTRONIC ASSEMBLY			4.5 V	85 Cel		-40 Cel	MATTE TIN			DUAL												260				CMOS				5 V							R-XDMA-P20		Not Qualified			e3
MAXQ1061EUD+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14		RECTANGULAR	PLASTIC/EPOXY	YES													109 Cel		-40 Cel	Matte Tin (Sn) - annealed			DUAL											30	260				CMOS											R-PDSO-G14	1				e3
MCIMX280CVM4B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES		1.55 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32		1.35 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.37 mm			14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm			CMOS				1.45 V						.8 mm	S-PBGA-B289	3	Not Qualified			e1
MCIMX286CVM4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES		1.55 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32		1.35 V	85 Cel		-40 Cel				BOTTOM		1.37 mm			14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm			CMOS				1.45 V						.8 mm	S-PBGA-B289	3
MCIMX353CVM5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		1.47 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32		1.33 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.6 mm			17 mm		IT ALSO OPERATES AT 1.22 TO 1.47 V				40	260	17 mm			CMOS				1.8 V						.8 mm	S-PBGA-B400	3	Not Qualified			e1
MCIMX357CVM5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		1.47 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32		1.33 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.6 mm			17 mm		IT ALSO OPERATES AT 1.22 TO 1.47 V				40	260	17 mm			CMOS				1.8 V						.8 mm	S-PBGA-B400	3	Not Qualified			e1
MCIMX6D7CVT08AE	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES		1.5 V							GRID ARRAY, FINE PITCH	BGA624,25X25,32		1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		2.16 mm			21 mm		EACH GPIO MODULE SUPPORTS 32 BITS OF I/O				40	260	21 mm			CMOS				1.4 V						.8 mm	S-PBGA-B624	3				e1
MCIMX6X1CVO08AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		1.5 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32		1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.53 mm			17 mm						40	260	17 mm			CMOS										.8 mm	S-PBGA-B400	3				e1
MEC1521H-B0-I/SZ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES		1.89 V							GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA144,13X13,25		1.71 V	85 Cel		-40 Cel				BOTTOM		.8 mm			9 mm		ALSO OPERATES AT 3.3V NOMINAL VOLATGE		0	.032768 MHz			9 mm			CMOS				1.8 V					I2C, ESPI, UART	.65 mm	S-PBGA-B144
MEC1521H-B0-I/SZ-TR	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES		1.89 V							GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA144,13X13,25		1.71 V	85 Cel		-40 Cel				BOTTOM		.8 mm			9 mm		ALSO OPERATES AT 3.3V NOMINAL VOLATGE		0	.032768 MHz			9 mm			CMOS				1.8 V					I2C, ESPI, UART	.65 mm	S-PBGA-B144
MKW41Z256VHT4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES		3.6 V							CHIP CARRIER			1.71 V	105 Cel		-40 Cel	NICKEL GOLD			QUAD											40	260				CMOS				3.3 V							S-XQCC-N48	3				e4
MPC8548ECHXAQG	Freescale Semiconductor	SoC	INDUSTRIAL	BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES		1.155 V						1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA783,28X28,40		1.045 V	105 Cel		-40 Cel	Tin/Lead/Silver (Sn/Pb/Ag)			BOTTOM		3.38 mm			29 mm						40	260	29 mm			CMOS				1.1 V		Microprocessors				1 mm	S-CBGA-B783	1	Not Qualified			e0
MPC8548ECHXAUJ	Freescale Semiconductor	SoC	INDUSTRIAL	BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES		1.155 V						1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA783,28X28,40		1.045 V	105 Cel		-40 Cel	Tin/Lead/Silver (Sn/Pb/Ag)			BOTTOM		3.38 mm			29 mm						40	260	29 mm			CMOS				1.1 V		Microprocessors				1 mm	S-CBGA-B783	1	Not Qualified			e0
MSP430F67471IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES		3.6 V					16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD		1.6 mm	262144	32	14 mm				0		30	260	14 mm		32768	CMOS		11.75 mA		3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm	S-PQFP-G100	3	Not Qualified	25 rpm		e4
MSP430F67641AIPZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES		3.6 V							FLATPACK, LOW PROFILE, FINE PITCH			1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD		1.6 mm		8	14 mm				0		30	260	14 mm		8192	CMOS				3.3 V					I2C; SPI; UART	.5 mm	S-PQFP-G100	3				e4
MSP430F67651AIPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES		3.6 V		0		NO	16		FLATPACK, LOW PROFILE, FINE PITCH			2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD	YES	1.6 mm	131072	16	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm		16384	CMOS	6-Ch 10-Bit			3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm	R-PQFP-G128	3		25 rpm		e4	8	90
MSP430F67751AIPEUR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES		3.6 V		0		NO	16		FLATPACK, LOW PROFILE, FINE PITCH			2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD	YES	1.6 mm	131072	16	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm		16384	CMOS	6-Ch 10-Bit			3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm	R-PQFP-G128	3		25 rpm		e4	8	90
MSP430F67781AIPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES		3.6 V		0		NO	16		FLATPACK, LOW PROFILE, FINE PITCH			2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD	YES	1.6 mm	524288	16	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm		16384	CMOS	6-Ch 10-Bit			3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm	R-PQFP-G128	3		25 rpm		e4	8	90

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.