INDUSTRIAL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	No. of Bits	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
MSP430F6778IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD	1.6 mm	524288	16	14 mm		0	25 MHz	30	260	14 mm		16384	CMOS	11.75 mA	3.3 V	Microcontrollers	FLASH	I2C; SPI; UART	.5 mm	S-PQFP-G100	3	Not Qualified	25 rpm	e4
NT3H1201W0FHKH	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					CHIP CARRIER		1.7 V	95 Cel		-40 Cel				QUAD	.5 mm			1.6 mm					260	1.6 mm			CMOS							S-PQCC-N8	1
OMAPL138EZWTA3R	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	1.4 mm			16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	16 mm			CMOS		1.3 V			I2C; SPI; UART; USB	.8 mm	S-PBGA-B361	3		456 rpm	e1
PIC32MZ1025W104132-I/NX	Microchip Technology	SoC	INDUSTRIAL
ST33GTPMA020FAE5	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		AEC-Q100				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		105 Cel		-40 Cel				DUAL	1.2 mm			4.4 mm	also operates with 3.3v and 5v nominal					6.5 mm			CMOS		1.8 V				.65 mm	R-PDSO-G20
STM32W108HBU61TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES				32	1.25,1.8,2.5/3.3	CHIP CARRIER	LCC40,.24SQ,20		85 Cel	CORTEX-M3	-40 Cel	MATTE TIN			QUAD		131072						30	260			8192	CMOS	150 mA		Microcontrollers	FLASH		.5 mm	S-PQCC-N40	3	Not Qualified	24 rpm	e3
STWBCTR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			105 Cel		-40 Cel				QUAD	1 mm			5 mm						5 mm			CMOS		5 V				.5 mm	S-XQCC-N32
XCZU11EG-1FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM								30	245				CMOS		.85 V					R-PBGA-B1156	4			e1
XCZU11EG-1FFVC1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM								30	245				CMOS		.85 V					R-PBGA-B1760	4			e1
XCZU11EG-2FFVB1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM								30	245				CMOS		.85 V					R-PBGA-B1517	4			e1
XCZU19EG-2FFVE1924I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1924	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM								30	245				CMOS		.85 V					R-PBGA-B1924	4			e1
XCZU3CG-2SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM								30	250				CMOS		.85 V					R-PBGA-B484	4			e1
XCZU3CG-L1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V					GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM					ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250				CMOS		.72 V					R-PBGA-B484	4			e1
XCZU4CG-L1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V					GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM					ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245				CMOS		.72 V					R-PBGA-B900	4			e1
XCZU4EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V					GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM					ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250				CMOS		.72 V					R-PBGA-B784	4			e1
XCZU5CG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES						GRID ARRAY			100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM					IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)			30	250				CMOS		.72 V					S-PBGA-B784	4			e1
XCZU5EG-1FBVB900I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY	BGA900,30X30,40	.825 V	100 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	2.88 mm			31 mm				30	245	31 mm			CMOS		.85 V				1 mm	R-PBGA-B900	4			e1
XCZU5EG-L1SFVC784I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V					GRID ARRAY	BGA784,28X28,32	.698 V	100 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	3.32 mm			23 mm	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250	23 mm			CMOS		.72 V				.8 mm	R-PBGA-B784	4			e1
XCZU7EV-L1FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V					GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM					ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245				CMOS		.72 V					R-PBGA-B1517	4			e1
AT32UC3A4256HHB-C1UR	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	VFBGA	SQUARE	PLASTIC/EPOXY	YES						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA100,10X10,25		85 Cel		-40 Cel				BOTTOM	1 mm			7 mm						7 mm			CMOS		3.3 V				.65 mm	S-PBGA-B100
ATECC608A-TFLXTLSS	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE	SOP8,.23	2 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)			DUAL	1.75 mm			3.9 mm						4.9 mm			CMOS						1.27 mm	R-PDSO-G8				e4
ATECC608B-MAVDA-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	100 Cel		-40 Cel	NICKEL PALLADIUM GOLD			DUAL	.6 mm			2 mm				30	260	3 mm			CMOS					I2C	.5 mm	R-PDSO-N8	1			e4
ATECC608B-TFLXTLSS-PROTO	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE	SOP8,.23	2 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)			DUAL	1.75 mm			3.9 mm		0	1 MHz			4.9 mm			CMOS						1.27 mm	R-PDSO-G8				e4
ATECC608B-TFLXTLSU	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)			DUAL	.6 mm			2 mm		0	1 MHz			3 mm			CMOS						.5 mm	R-PDSO-N8				e4
ATTPM20P-H6MA1-10	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES		TS 16949				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20		85 Cel		-40 Cel				DUAL	.6 mm			2 mm						3 mm			CMOS		3.3 V			SPI	.5 mm	R-PDSO-N8
ATTPM20P-H6MA1-10-B	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES		TS 16949				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20		85 Cel		-40 Cel				DUAL	.6 mm			2 mm						3 mm			CMOS		3.3 V			SPI	.5 mm	R-PDSO-N8
ATWINC1510-MR210PB1944	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V					MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel		-40 Cel				UNSPECIFIED	2.113 mm			14.73 mm						21.72 mm			CMOS		3.3 V					R-XXMA-N28
ATWINC1510-MR210PB1954	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V					MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel		-40 Cel				UNSPECIFIED	2.113 mm			14.73 mm						21.72 mm			CMOS		3.3 V					R-XXMA-N28
ATWINC1510-MR210PB1963	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V					MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel				UNSPECIFIED	2.113 mm			14.73 mm	SEATED HGT-NOM					21.72 mm			CMOS		3.6 V					R-XXMA-N28
ATWINC1510-MR210PB1963-T	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949				MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel		-40 Cel				UNSPECIFIED													CMOS		3.3 V			I2C, SPI		R-XXMA-N28
ATWINC1510B-MU-Y	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	2.7 V	85 Cel		-40 Cel	MATTE TIN			QUAD	1 mm			5 mm			48 MHz			5 mm			CMOS		3.3 V				.4 mm	S-PQCC-N40				e3
ATWINC3400-MR210UA122	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	4.2 V					MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel				UNSPECIFIED	2.087 mm			14.732 mm	SEATED HGT-CALCULATED			NOT SPECIFIED	NOT SPECIFIED	22.428 mm			CMOS		3.6 V				1.204 mm	R-XXMA-N36
C8051F061-GQ	Silicon Labs	SoC	INDUSTRIAL																		MATTE TIN											40	260												3	Not Qualified		e3
CP2130-F01-GM	Silicon Labs	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	85 Cel		-40 Cel				QUAD	.8 mm			4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm			CMOS		3.3 V				.5 mm	S-XQCC-N24
CY8C3246AXI-131	Infineon Technologies	PSoC	INDUSTRIAL											1.8/5							NICKEL PALLADIUM GOLD		N									40	260		524288 Bits					Other uPs/uCs/Peripheral ICs					3	Not Qualified		e4
CY8C3246AXI-138	Infineon Technologies	PSoC	INDUSTRIAL											1.8/5							NICKEL PALLADIUM GOLD		N									40	260		524288 Bits					Other uPs/uCs/Peripheral ICs					3	Not Qualified		e4
CY8C4124LQI-S432	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL																		PURE TIN																								3
CY8C4124LQI-S432T	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL																		PURE TIN																								3
CY8C4146AZI-S423	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL																		PURE TIN																								3
CY8C5266FNI-LP205T	Infineon Technologies	PSoC	INDUSTRIAL																		NICKEL PALLADIUM GOLD																								1			e4
CYPD3125-40LQXI	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.7 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD			QUAD	.6 mm			6 mm						6 mm			CMOS		3.3 V				.5 mm	S-XQCC-N40	3			e4
DS2465P+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V					SMALL OUTLINE		2.97 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed			DUAL	1.5 mm			3.76 mm				30	260	3.94 mm			CMOS		3.3 V				1.27 mm	R-PDSO-C6	1			e3
IP2022/PQ80-120U	Qualcomm	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	2.7 V					FLATPACK		2.3 V	85 Cel		-40 Cel				QUAD	3.4 mm			14 mm				NOT SPECIFIED	NOT SPECIFIED	20 mm			CMOS		2.5 V				.8 mm	R-PQFP-G80
LTC4263IDE	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	14	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE, VERY THIN PROFILE		4.5 V	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)			DUAL	.8 mm			3 mm						4 mm			CMOS		5 V				.5 mm	R-PDSO-N14	1	Not Qualified		e0
LTC4263IS	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)			DUAL	1.752 mm			3.9 mm						8.649 mm			CMOS		5 V				1.27 mm	R-PDSO-G14	1	Not Qualified		e0
LTC4263IS#TR	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	TIN LEAD			DUAL	1.752 mm			3.9 mm						8.649 mm			CMOS		5 V				1.27 mm	R-PDSO-G14	1	Not Qualified		e0
MCIMX6Y2CVM05AAR	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	1.32 mm			14 mm				40	260	14 mm			CMOS						.8 mm	S-PBGA-B289	3			e1
MCP25025-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8		3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn)			DUAL	1.75 mm			3.9 mm						8.65 mm			CMOS		5 V	Parallel IO Port			1.27 mm	R-PDSO-G14	1	Not Qualified		e3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.