INDUSTRIAL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
P82B715PE4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	12 V				IN-LINE		4.5 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL	5.08 mm			7.62 mm	VCCB(Min)(V) is 3, VCCB(Max)(V) is 12		0	.4 MHz	NOT SPECIFIED	260	9.81 mm		BIPOLAR		5 V			I2C	2.54 mm		R-PDIP-T8	1	Not Qualified		e4
AM4378BZDNA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm			17 mm					30	260	17 mm		CMOS		1.325 V				.65 mm		S-PBGA-B491	3			e1
AM5718AABCXEA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V				GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm			23 mm					30	250	23 mm		CMOS		1.15 V				.8 mm		S-PBGA-B760	3		1500 rpm	e1
MCIMX31CVMN4CR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V			1.3,1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA473,23X23,32	1.22 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.54 mm			19 mm					40	260	19 mm		CMOS		1.4 V	Microprocessors			.8 mm		S-PBGA-B473	3	Not Qualified		e1
MTFC4GLDDQ-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V				GRID ARRAY, LOW PROFILE		2.7 V	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	1.4 mm			14 mm					30	260	18 mm		CMOS		3.3 V				1 mm		R-PBGA-B100				e1
NRF9160-SIAA-R	Nordic Semiconductor Asa	MICROCONTROLLER, CISC	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V				GRID ARRAY	LGA127,21X30,20	3 V	85 Cel		-40 Cel			BOTTOM	1.1 mm			10.5 mm							16 mm		CMOS		3.8 V				.5 mm		R-XBGA-N127
MCIMX6S7CVM08AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm			21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm		CMOS						.8 mm		S-PBGA-B624	3			e1
NRF9160-SIAA-R7	Nordic Semiconductor Asa	MICROCONTROLLER, CISC	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V				GRID ARRAY	LGA127,21X30,20	3 V	85 Cel		-40 Cel			BOTTOM	1.1 mm			10.5 mm							16 mm		CMOS		3.8 V				.5 mm		R-XBGA-N127
XCZU5CG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM									30	250			CMOS		.85 V						S-PBGA-B784	4			e1
BM94801KUT-Z	ROHM	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1.65 V				FLATPACK, THIN PROFILE, FINE PITCH		1.5 V	85 Cel		-40 Cel			QUAD	1.2 mm			14 mm					NOT SPECIFIED	NOT SPECIFIED	14 mm		CMOS		1.55 V				.4 mm		S-PQFP-G128
CC1310F32RGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm			7 mm					NOT SPECIFIED	260	7 mm	28672	CMOS		3.3 V				.5 mm		S-PQCC-N48	3			e4
CP2108-B02-GM	Silicon Labs	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	85 Cel		-40 Cel			QUAD	.9 mm			9 mm					NOT SPECIFIED	NOT SPECIFIED	9 mm		CMOS		3.3 V				.5 mm		S-XQCC-N64
MSP430F6779IPZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	524288	32	14 mm			0	25 MHz	30	260	14 mm	32768	CMOS	11.75 mA	3.3 V	Microcontrollers	FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3	Not Qualified	25 rpm	e4
SCANSTA112VS/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			3.3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	3 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1.2 mm			14 mm			0		NOT SPECIFIED	260	14 mm		CMOS		3.3 V	Other Microprocessor ICs			.5 mm		S-PQFP-G100	3	Not Qualified		e4
XCZU25DR-L1FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V				GRID ARRAY		.698 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM					ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS		.72 V						R-PBGA-B1517	4			e1
XCZU25DR-L1FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V				GRID ARRAY		.698 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM					ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	240			CMOS		.72 V						R-PBGA-B1517	4			e1
XCZU25DR-L2FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V				GRID ARRAY		.698 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM									30	240			CMOS		.72 V						R-PBGA-B1156	4			e1
XCZU5EV-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM									30	245			CMOS		.85 V						R-PBGA-B900	4			e1
AX8052F151-2-TB05	Onsemi	SYSTEM ON CHIP	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.35X.55	2.2 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm			5 mm						260	7 mm		CMOS		3 V				.5 mm		R-PQCC-N40	1			e4
MTFC4GMDEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	.8 mm			11.5 mm	IT ALSO OPERATES AT 3.3 VOLTS						13 mm		CMOS		1.8 V				.5 mm		R-PBGA-B153				e1
XCZU4EV-L1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V				GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM					ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS		.72 V						R-PBGA-B900	4			e1
CC430F5147IRGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	32768	4	7 mm	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	TIMER		20 MHz	30	260	7 mm	4096	CMOS		3.3 V	Microcontrollers	FLASH	I2C; SPI; UART; USB	.5 mm		S-PQCC-N48	3	Not Qualified	20 rpm	e4	30
CY8C4248LQI-BL483	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel		-40 Cel			QUAD	.6 mm			7 mm							7 mm		CMOS		3.3 V				.4 mm		S-XQCC-N56
MCIMX233CAG4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.55 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16	1 V	85 Cel		-40 Cel	TIN		QUAD	1.6 mm			14 mm					40	260	14 mm		CMOS		1.35 V				.4 mm		S-PQFP-G128	3			e3
SCANSTA111MTX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.3,20	3 V	85 Cel		-40 Cel	MATTE TIN		DUAL	1.2 mm			6.1 mm					30	260	12.5 mm		CMOS		3.3 V	Other Microprocessor ICs			.5 mm		R-PDSO-G48	2	Not Qualified		e3
ST33HTPH2032AAF3	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		105 Cel		-40 Cel			QUAD	1 mm			5 mm	ALSO OPERATES AT 3.3V NOMINAL VOLATGE				NOT SPECIFIED	NOT SPECIFIED	5 mm		CMOS		1.8 V				.5 mm		S-XQCC-N32
XCZU7EV-3FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	3.51 mm			35 mm							35 mm		CMOS		.9 V				1 mm		S-PBGA-B1156	4			e1
CY8C4025LQI-S412	Infineon Technologies	PSoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm			5 mm							5 mm		CMOS		1.8 V				.5 mm		S-XQCC-N32	3			e4
MCIMX286CVM4BR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V			1.4,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.37 mm			14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm		CMOS		1.45 V	Microprocessors			.8 mm		S-PBGA-B289	3	Not Qualified		e1
MCIMX351AJQ5C	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25	1.33 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm			17 mm					40	260	17 mm		CMOS						.8 mm		S-PBGA-B400	3	Not Qualified		e1
MIMXRT1064CVJ5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,31	1.15 V	105 Cel		-40 Cel			BOTTOM	1.52 mm			12 mm					40	260	12 mm		CMOS						.8 mm		S-PBGA-B196	3
TMS320DM365ZCE30	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V		32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		8192	13 mm			32		30	260	13 mm		CMOS		1.35 V	Digital Signal Processors		I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
OMAPL138EZCEA3R	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm			13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	13 mm		CMOS		1.3 V			I2C; SPI; UART; USB	.65 mm		S-PBGA-B361	3		456 rpm	e1
OMAPL138EZWTA3	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm			16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	16 mm		CMOS		1.3 V			I2C; SPI; UART; USB	.8 mm		S-PBGA-B361	3		456 rpm	e1
XCZU15EG-2FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM									30	245			CMOS		.85 V						R-PBGA-B1156	4			e1
AM5718AABCXA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V				GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm			23 mm					30	250	23 mm		CMOS		1.15 V				.8 mm		S-PBGA-B760	3		1500 rpm	e1
ATECC608A-SSHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949			SMALL OUTLINE	SOP8,.23	2 V	85 Cel		-40 Cel			DUAL	1.75 mm			3.9 mm							4.9 mm		CMOS						1.27 mm		R-PDSO-G8
C8051F064-GQ	Silicon Labs	SoC	INDUSTRIAL										3							MATTE TIN												260						Microcontrollers						3	Not Qualified		e3
MSP430F6748IPEUR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm	524288		14 mm			0	25 MHz	30	260	20 mm	16384	CMOS	11.75 mA	3.3 V	Microcontrollers	FLASH	I2C; SPI; UART	.5 mm		R-PQFP-G128	3	Not Qualified	25 rpm	e4
SCANSTA112SM/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA100,10X10,32	3 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm			10 mm			0		30	260	10 mm		CMOS		3.3 V	Other Microprocessor ICs			.8 mm		S-PBGA-B100	4	Not Qualified		e1
CC1310F64RSMT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm			4 mm					NOT SPECIFIED	260	4 mm	28672	CMOS		3.3 V				.4 mm		S-PQCC-N32	3			e4
MC13213R2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	71	VFLGA	SQUARE	PLASTIC/EPOXY	YES	3.4 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel		-40 Cel	NICKEL GOLD		BOTTOM	1 mm			9 mm					30	250	9 mm		CMOS		2.7 V				.5 mm		S-PBGA-B71	3	Not Qualified		e4
ATWINC1500B-MU-T	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	2.7 V	85 Cel		-40 Cel	MATTE TIN		QUAD	1 mm			5 mm				48 MHz			5 mm		CMOS		3.3 V				.4 mm		S-PQCC-N40				e3
CY8C4045AZI-S413	Infineon Technologies	PSoC	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.89 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	85 Cel		-40 Cel	PURE TIN		QUAD	1.6 mm			7 mm							7 mm		CMOS		1.8 V				.5 mm		S-PQFP-G48	3
XCZU3EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM									30	250			CMOS		.85 V						R-PBGA-B784	4			e1
XCZU48DR-2FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM									30	245			CMOS		.85 V						R-PBGA-B1156	4			e1
MKW41Z512VHT4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V				CHIP CARRIER		1.71 V	105 Cel		-40 Cel	NICKEL GOLD		QUAD									40	260			CMOS		3.3 V						S-XQCC-N48	3			e4
XCZU25DR-1FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM									30	240			CMOS		.85 V						R-PBGA-B1517	4			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.