INDUSTRIAL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
XCZU3EG-1SBVA484I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM															CMOS			.85 V								R-PBGA-B484	4			e1
XCZU4EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	250			CMOS			.85 V								R-PBGA-B784	4			e1
XCZU5CG-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245			CMOS			.85 V								R-PBGA-B900	4			e1
AM4372BZDNA60	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.144 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.056 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			17 mm						30	260	17 mm		CMOS			1.1 V						.65 mm		S-PBGA-B491	3			e1
ATWINC1510-MR210PB1961	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V						MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel			UNSPECIFIED		2.113 mm			14.73 mm		SEATED HGT-NOM						21.72 mm		CMOS			3.6 V								R-XXMA-N28
CC1310F64RHBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			5 mm						NOT SPECIFIED	260	5 mm	28672	CMOS			3.3 V						.5 mm		S-PQCC-N32	3			e4
FXLC95000CLR1	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	24	TFLGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V						GRID ARRAY, THIN PROFILE, FINE PITCH		1.71 V	85 Cel		-40 Cel			BOTTOM		1.1 mm			3 mm						40	260	5 mm		CMOS			1.8 V						.5 mm		R-PBGA-B24	3
MTFC8GLVEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		.8 mm			11.5 mm		IT ALSO OPERATES AT 3.3 VOLTS						13 mm		CMOS			1.8 V						.5 mm		R-PBGA-B153				e1
OMAPL138EZWTA3E	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			16 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	16 mm		CMOS			1.3 V					I2C; SPI; UART; USB	.8 mm		S-PBGA-B361	3		456 rpm	e1
XCZU7EG-L1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS			.72 V								R-PBGA-B900	4			e1
ATSAM4C8CB-AU	Microchip Technology	SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V						FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.08 V	85 Cel		-40 Cel	MATTE TIN		QUAD		1.6 mm			14 mm						40	260	14 mm		CMOS			1.2 V						.5 mm		S-PQFP-G100	3			e3
AX8052F131-2-TB05	Onsemi	SYSTEM ON CHIP	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V						CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG	LCC28,.35X.55	2.2 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			5 mm							260	7 mm		CMOS			3 V						.5 mm		S-PQCC-N28	1			e4
CY8C4025AZI-S413	Infineon Technologies	PSoC	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.89 V						FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	85 Cel		-40 Cel	PURE TIN		QUAD		1.6 mm			7 mm							260	7 mm		CMOS			1.8 V						.5 mm		S-PQFP-G48	3
MCIMX356AJQ5C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			17 mm						40	260	17 mm		CMOS			1.8 V						.8 mm		S-PBGA-B400	3	Not Qualified		e1
MCP2221T-I/ST	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949				3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	3 V	85 Cel		-40 Cel	MATTE TIN		DUAL		1.2 mm			4.4 mm								5 mm		CMOS		15 mA	3.3 V		Serial IO/Communication Controllers				.65 mm		R-PDSO-G14		Not Qualified		e3
MTFC8GLDEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		.8 mm			11.5 mm		IT ALSO OPERATES AT 3.3 VOLTS						13 mm		CMOS			1.8 V						.5 mm		R-PBGA-B153				e1
S32G234MABK0VUCR	NXP Semiconductors	SoC	INDUSTRIAL																																40	260															3
XCZU7EG-2FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS			.85 V								R-PBGA-B1517	4			e1
AM4377BZDNA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			17 mm						30	260	17 mm		CMOS			1.325 V						.65 mm		S-PBGA-B491	3			e1
CC2543RHBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm			5 mm				0		30	260	5 mm		CMOS			3 V		Other uPs/uCs/Peripheral ICs			I2C; SPI; UART; USART	.5 mm		S-PQCC-N32	3	Not Qualified		e4
CY8C5267LTI-LP089	Infineon Technologies	PSoC	INDUSTRIAL																			NICKEL PALLADIUM GOLD													30	260															3	Not Qualified		e4
OMAPL138EZCEA3E	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			13 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY				30	260	13 mm		CMOS			1.3 V						.65 mm		S-PBGA-B361	3			e1
XCZU2EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	250			CMOS			.85 V								R-PBGA-B625	4			e1
XCZU5CG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY			100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	250			CMOS			.85 V								S-PBGA-B784	4			e1
XCZU9CG-1FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS			.85 V								R-PBGA-B1156	4			e1
ATECC608B-TNGTLSU-C	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		.6 mm			2 mm				0	1 MHz			3 mm		CMOS									.5 mm		R-PDSO-N8				e4
XCZU5EV-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245			CMOS			.85 V								R-PBGA-B900	4			e1
CC430F5147IRGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm	32768	4	7 mm		IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	TIMER		20 MHz	30	260	7 mm	4096	CMOS			3.3 V		Microcontrollers		FLASH	I2C; SPI; UART; USB	.5 mm		S-PQCC-N48	3	Not Qualified	20 rpm	e4		30
OMAPL138EZCEA3	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			13 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	13 mm		CMOS			1.3 V					I2C; SPI; UART; USB	.65 mm		S-PBGA-B361	3		456 rpm	e1
XCZU11EG-L1FFVC1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS			.72 V								R-PBGA-B1760	4			e1
XCZU15EG-2FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS			.85 V								R-PBGA-B900	4			e1
XCZU9EG-1FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS			.85 V								R-PBGA-B1156	4			e1
CC1310F32RHBT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			5 mm						NOT SPECIFIED	260	5 mm	28672	CMOS			3.3 V						.5 mm		S-PQCC-N32	3			e4
MSP430F67641AIPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V						FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm		8	14 mm				0		30	260	14 mm	8192	CMOS			3.3 V					I2C; SPI; UART	.5 mm		S-PQFP-G100	3			e4
ST33HTPH2E28AAF0	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES							SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25		105 Cel		-40 Cel			DUAL		1.2 mm			4.4 mm		ALSO OPERATES AT 3.3V NOMINAL VOLATGE						9.7 mm		CMOS			1.8 V						.65 mm		R-PDSO-G28
CC1310F32RSMR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			4 mm						NOT SPECIFIED	260	4 mm	28672	CMOS			3.3 V						.4 mm		S-PQCC-N32	3			e4
LTC4263IDE-1#PBF	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		4.5 V	85 Cel		-40 Cel	MATTE TIN		DUAL		.8 mm			3 mm						30	260	4 mm		CMOS			5 V						.5 mm		R-PDSO-N14	1	Not Qualified		e3
MC13212	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	71	VFLGA	SQUARE	PLASTIC/EPOXY	YES	3.4 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel		-40 Cel	NICKEL GOLD		BOTTOM		1 mm			9 mm						30	250	9 mm		CMOS			2.7 V						.5 mm		S-PBGA-B71	3	Not Qualified		e4
MIMXRT1051CVL5A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel		-40 Cel			BOTTOM		1.43 mm			10 mm								10 mm		CMOS									.65 mm		S-PBGA-B196
MSP430F6779AIPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	524288	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	14 mm	32768	CMOS	6-Ch 10-Bit		3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3		25 rpm	e4	8	62
MSP430F6779IPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	524288	32	14 mm				0	25 MHz	30	260	20 mm	32768	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		R-PQFP-G128	3	Not Qualified	25 rpm	e4
MSP430F6779IPEUR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	524288	32	14 mm				0	25 MHz	30	260	20 mm	32768	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		R-PQFP-G128	3	Not Qualified	25 rpm	e4
OMAPL138EZCED4E	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			13 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	13 mm		CMOS			1.3 V					I2C; SPI; UART; USB	.65 mm		S-PBGA-B361	3		456 rpm	e1
XCZU7EV-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245			CMOS			.85 V								R-PBGA-B900	4			e1
CMX7341Q3	Cml Microcircuits	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	85 Cel		-40 Cel			QUAD		1 mm			6 mm								6 mm		CMOS			3.3 V						.5 mm		S-XQCC-N48
CY8C4247LQI-BL453	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL																			NICKEL PALLADIUM GOLD													30	260															3			e4
TDA8029HL/C207,151	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES						1.8/5,3/5	FLATPACK	QFP32,.35SQ,32		90 Cel		-40 Cel			QUAD												260								Other Microprocessor ICs				.8 mm		S-PQFP-G32	1	Not Qualified
TMS320DM6446AZWTA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		16384	16 mm		DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY		48		30	260	16 mm		CMOS			1.2 V		Digital Signal Processors			I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.