INDUSTRIAL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	No. of Bits	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Ultraviolet Erasable	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
MCP25025T-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949		8			3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn)			DUAL		1.75 mm			3.9 mm								8.65 mm			CMOS			5 V		Parallel IO Port				1.27 mm		R-PDSO-G14	1	Not Qualified		e3
MSP430F6747AIPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		0		NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD	YES	1.6 mm	262144	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	14 mm		32768	CMOS	6-Ch 10-Bit		3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3		25 rpm	e4	8	62
MSP430F6767IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V					16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD		1.6 mm	262144	32	14 mm				0	25 MHz	30	260	14 mm		32768	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3	Not Qualified	25 rpm	e4
MSP430F67791IPEUR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V					16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD		1.6 mm	524288	32	14 mm				0		30	260	20 mm		32768	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		R-PQFP-G128	3	Not Qualified	25 rpm	e4
MTCH6102-I/SS	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	TS 16949						SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.8 V	85 Cel		-40 Cel	MATTE TIN			DUAL		2 mm			5.3 mm						40	260	10.2 mm			CMOS			3 V						.65 mm		R-PDSO-G28	2			e3
MTFC64GJDDN-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	169	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V							GRID ARRAY, LOW PROFILE, FINE PITCH		1.65 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.4 mm			14 mm		IT ALSO OPERATES AT 3.3 VOLTS						18 mm			CMOS			1.8 V						.5 mm		R-PBGA-B169				e1
MTFC8GLDDQ-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V							GRID ARRAY, LOW PROFILE		2.7 V	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM		1.4 mm			14 mm						30	260	18 mm			CMOS			3.3 V						1 mm		R-PBGA-B100				e1
OMAPL138CZWTA3RW	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V							GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.4 mm			16 mm						30	260	16 mm			CMOS			1.2 V						.8 mm		S-PBGA-B361	3			e1
S32G233AABK0VUCR	NXP Semiconductors	SoC	INDUSTRIAL																																		40	260																3
SI1002-E-GM2	Silicon Labs	MICROCONTROLLER	INDUSTRIAL	BUTT	42	HLGA	RECTANGULAR	UNSPECIFIED	YES	3.6 V							GRID ARRAY, HEAT SINK/SLUG		1.8 V	85 Cel		-40 Cel				BOTTOM		.95 mm			5 mm		ALSO WORKING TWO CELL MODE AT 2.4V NOM. SUPPLY.				NOT SPECIFIED	NOT SPECIFIED	7 mm			CMOS			1.9 V						.5 mm		R-XBGA-B42
ST33GTPMA020FAE6	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		AEC-Q100						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		105 Cel		-40 Cel				DUAL		1.2 mm			4.4 mm		also operates with 3.3v and 5v nominal						6.5 mm			CMOS			1.8 V						.65 mm		R-PDSO-G20	1
TMS320DM369ZCEDF	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES						32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25		85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.3 mm		32768	13 mm				32		30	260	13 mm			CMOS					Digital Signal Processors			ETHERNET; I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
XCZU11EG-L1FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V							GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245				CMOS			.72 V								R-PBGA-B1517	4			e1
XCZU19EG-1FFVB1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM											30	245				CMOS			.85 V								R-PBGA-B1517	4			e1
XCZU2EG-L1SBVA484I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V							GRID ARRAY		.698 V	100 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY									CMOS			.72 V								R-PBGA-B484	4			e1
XCZU3CG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM											30	250				CMOS			.85 V								R-PBGA-B625	4			e1
XCZU49DR-2FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM											30	245				CMOS			.85 V								R-PBGA-B1760	4			e1
XCZU5EG-2SFVC784I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY	BGA784,28X28,32	.825 V	100 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		3.32 mm			23 mm						30	250	23 mm			CMOS			.85 V						.8 mm		R-PBGA-B784	4			e1
XCZU7CG-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM											30	245				CMOS			.85 V								R-PBGA-B900	4			e1
XCZU7EG-2FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM											30	245				CMOS			.85 V								R-PBGA-B1156	4			e1
XCZU7EV-L1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V							GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245				CMOS			.72 V								R-PBGA-B900	4			e1
XCZU9CG-2FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM											30	245				CMOS			.85 V								R-PBGA-B900	4			e1
XCZU9EG-L1FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V							GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245				CMOS			.72 V								R-PBGA-B900	4			e1
Z16C3010VEC	IXYS Corporation		INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES							5	CHIP CARRIER	LDCC68,1.0SQ		85 Cel		-40 Cel				QUAD																CMOS		50 mA	5 V		Other uPs/uCs/Peripheral ICs				1.27 mm		S-PQCC-J68		Not Qualified
ZL30250LDF1	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.71 V	85 Cel		-40 Cel				QUAD		1 mm			5 mm		IT ALSO OPERATES AT 3.3V NOMINAL SUPPLY						5 mm			CMOS			1.8 V						.5 mm		S-XQCC-N32
AD6620ASZ	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V						3.3	FLATPACK	QFP80,.7SQ	3 V	85 Cel		-40 Cel	MATTE TIN			QUAD		3.4 mm			14 mm							260	14 mm			CMOS			3.3 V		DSP Peripherals				.65 mm		S-PQFP-G80	3	Not Qualified		e3
CY8C20237-24LKXI	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	16	VQCCN	SQUARE	UNSPECIFIED	YES	5.5 V					8	1.8/5	CHIP CARRIER, VERY THIN PROFILE	LCC16,.12SQ,20	1.71 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD			QUAD		.6 mm	8192		3 mm						30	260	3 mm		1024	CMOS		4 mA	3.3 V		Microcontrollers		FLASH		.5 mm		S-XQCC-N16	3	Not Qualified	25.2 rpm	e4
CY8C3245AXI-158	Infineon Technologies	PSoC	INDUSTRIAL													1.8/5							NICKEL PALLADIUM GOLD		N												40	260		262144 Bits							Other uPs/uCs/Peripheral ICs							3	Not Qualified		e4
CY8C3246LTI-149	Infineon Technologies	PSoC	INDUSTRIAL													1.8/5							NICKEL PALLADIUM GOLD		N												30	260		524288 Bits							Other uPs/uCs/Peripheral ICs							3	Not Qualified		e4
CY8C4247LQI-BL473	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL																				PURE TIN														30	260																3
HPA01216RHAR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD			QUAD		1 mm			6 mm			TIMER(4)			30	260	6 mm		8192	CMOS			3 V						.5 mm		S-PQCC-N40	3			e4		23
MC13211	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	71	VFLGA	SQUARE	PLASTIC/EPOXY	YES	3.4 V							GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel		-40 Cel	NICKEL GOLD			BOTTOM		1 mm			9 mm						30	250	9 mm			CMOS			2.7 V						.5 mm		S-PBGA-B71	3	Not Qualified		e4
MPC8247CVRTIEA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V						1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.425 V	105 Cel		-40 Cel	TIN SILVER			BOTTOM		2.55 mm			27 mm						30	245	27 mm			CMOS			1.5 V		Other uPs/uCs/Peripheral ICs				1 mm		S-PBGA-B516	3	Not Qualified		e2
MXD1210EWE-T	Maxim Integrated	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V							SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	TIN LEAD			DUAL		1.75 mm			3.9 mm								9.9 mm			CMOS		.5 mA	5 V						1.27 mm		R-PDSO-G16	1	Not Qualified		e0
MXD1210EWE+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V							SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed			DUAL		1.75 mm			3.9 mm								9.9 mm			CMOS		.5 mA	5 V						1.27 mm		R-PDSO-G16	1	Not Qualified		e3
NT3H1101W0FHKH	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V							CHIP CARRIER		1.7 V	95 Cel		-40 Cel				QUAD		.5 mm			1.6 mm							260	1.6 mm			CMOS											S-PQCC-N8	1
NT3H2211W0FTT	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V							SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		1.67 V	105 Cel		-40 Cel				DUAL		1.1 mm			3 mm								3 mm			CMOS			1.8 V						.65 mm		S-PDSO-G8
T1024NXN7PQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V							GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		2.07 mm			23 mm						30	250	23 mm			CMOS			1 V						.8 mm		S-PBGA-B780	3			e1
XCZU17EG-2FFVB1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM											30	245				CMOS			.85 V								R-PBGA-B1517	4			e1
XCZU19EG-2FFVD1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM											30	245				CMOS			.85 V								R-PBGA-B1760	4			e1
XCZU27DR-1FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM											30	245				CMOS			.85 V								R-PBGA-B1156	4			e1
XCZU4EG-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM											30	245				CMOS			.85 V								R-PBGA-B900	4			e1
XCZU5EG-L1FBVB900I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V							GRID ARRAY	BGA900,30X30,40	.698 V	100 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		2.88 mm			31 mm		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245	31 mm			CMOS			.72 V						1 mm		R-PBGA-B900	4			e1
XCZU6EG-2FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM											30	245				CMOS			.85 V								R-PBGA-B900	4			e1
ATWINC1500-MR210UB1140	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V							MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel				UNSPECIFIED		2.113 mm			14.73 mm		SEATED HGT-NOM				NOT SPECIFIED	NOT SPECIFIED	21.72 mm			CMOS			3.6 V								R-XXMA-N28
NT3H1101W0FHK	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	VQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V							CHIP CARRIER, VERY THIN PROFILE		1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD			QUAD		.5 mm			1.6 mm								1.6 mm			CMOS									.5 mm		S-PQCC-N8	1			e4
XCZU11EG-1FFVB1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM											30	245				CMOS			.85 V								R-PBGA-B1517	4			e1
SP1ML-868	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	16		RECTANGULAR	UNSPECIFIED	NO	3.6 V							MICROELECTRONIC ASSEMBLY		1.8 V	85 Cel		-40 Cel				DUAL		2.5 mm			13.4 mm						NOT SPECIFIED	NOT SPECIFIED	14 mm			CMOS			3 V						1.5 mm		R-XDMA-N16

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.