INDUSTRIAL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Ultraviolet Erasable	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
CC3220MODASF12MONR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED	YES	3.6 V			NO			CHIP CARRIER		2.3 V	85 Cel		-40 Cel	NICKEL GOLD	YES		BOTTOM	NO	2.41 mm	1024000	256	20.5 mm	0		TIMER(4), WDT	0		30	260	25 mm		262144	CMOS	4-Ch 12-Bit		3.3 V	NO		I2C, I2S, SPI, UART	FLASH	I2C; I2S; SPI; UART	1.27 mm		R-XBCC-B63	3			e4	8	25
ATWINC1500-MR210PB1954	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V						MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel		-40 Cel				UNSPECIFIED		2.113 mm			14.73 mm						NOT SPECIFIED	NOT SPECIFIED	21.72 mm			CMOS			3.3 V								R-XXMA-N28
ATWINC1510-MR210PB1952	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949					MICROELECTRONIC ASSEMBLY	MODULE28(UNSPEC)	2.7 V	80 Cel		-40 Cel				UNSPECIFIED		2.11 mm			14.73 mm					48 MHz			21.72 mm			CMOS			3.3 V								R-XXMA-N28
ATWINC1510-MR210UB1961	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949					MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel		-40 Cel				UNSPECIFIED		2.113 mm			14.73 mm								21.72 mm			CMOS			3.3 V								R-XXMA-N28
MCIMX6Q7CVT08AD	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V						GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		2.16 mm			21 mm		EACH GPIO MODULE SUPPORTS 32 BITS OF I/O				40	260	21 mm			CMOS			1.4 V						.8 mm		S-PBGA-B624	3			e1
CC1310F128RHBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)			QUAD		1 mm			5 mm						NOT SPECIFIED	260	5 mm		28672	CMOS			3.3 V						.5 mm		S-PQCC-N32	3			e4
MIMXRT1052CVJ5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel		-40 Cel	TIN SILVER			BOTTOM		1.52 mm			12 mm						40	260	12 mm			CMOS									.8 mm		S-PBGA-B196	3			e2
MIMXRT1064CVL5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel		-40 Cel				BOTTOM		1.43 mm			10 mm						40	260	10 mm			CMOS									.65 mm		S-PBGA-B196	3
ATWINC1500-MR210UB1954	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V						MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel		-40 Cel				UNSPECIFIED		2.113 mm			14.73 mm						NOT SPECIFIED	NOT SPECIFIED	21.72 mm			CMOS			3.3 V								R-XXMA-N28
CY8C3866AXI-040T	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V					2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	PURE TIN		N	QUAD		1.6 mm			14 mm								14 mm	65536 Bits		CMOS			3.3 V		Other uPs/uCs/Peripheral ICs				.5 mm		S-PQFP-G100	3	Not Qualified
FT245RQ-REEL	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.3 V	85 Cel		-40 Cel				QUAD		1 mm			5 mm								5 mm			CMOS									.5 mm		S-XQCC-N32	3	Not Qualified
ATECC608B-MAHCZ-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel		-40 Cel				DUAL		.6 mm			2 mm								3 mm			CMOS								1-WIRE	.5 mm		R-PDSO-N8
P82B715D	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	12 V						SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)			DUAL		1.75 mm			3.9 mm		VCCB(Min)(V) is 3, VCCB(Max)(V) is 12		0	.4 MHz	NOT SPECIFIED	260	4.9 mm			BIPOLAR			5 V					I2C	1.27 mm		R-PDSO-G8	1	Not Qualified		e4
CY8C3866AXI-040	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V					2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		N	QUAD		1.6 mm			14 mm						40	260	14 mm	65536 Bits		CMOS			3.3 V		Other uPs/uCs/Peripheral ICs				.5 mm		S-PQFP-G100	3	Not Qualified		e4
MCIMX6S7CVM08AC	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm			CMOS									.8 mm		S-PBGA-B624	3			e1
DS28CM00R-A00+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	5	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V						SMALL OUTLINE, LOW PROFILE, SHRINK PITCH		1.62 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed			DUAL		1.45 mm			1.625 mm		IT ALSO OPERATE AT 1.8 V SUPPLY				30	260	2.9 mm			CMOS			5 V						.95 mm		R-PDSO-G5	1	Not Qualified		e3
XCZU4CG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY			100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM											30	250				CMOS			.85 V								S-PBGA-B784	4			e1
MCIMX6Q7CVT08AE	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V						GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		2.16 mm			21 mm		EACH GPIO MODULE SUPPORTS 32 BITS OF I/O				40	260	21 mm			CMOS			1.4 V						.8 mm		S-PBGA-B624	3			e1
AX8052F143-3-TX30	Onsemi	SYSTEM ON CHIP	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.28,20	1.8 V	85 Cel		-40 Cel	NICKEL GOLD PALLADIUM			QUAD		1 mm			5 mm						30	260	7 mm			CMOS			3 V						.5 mm		R-PQCC-N40	1
ESP32-WROOM-32UE	Espressif Systems (Shanghai)	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V						MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel				UNSPECIFIED		3.35 mm			18 mm							250	19.2 mm			CMOS			3.3 V						1.27 mm		R-XXMA-N38	3
FT800Q-T	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.97 V	85 Cel		-40 Cel				QUAD		1 mm			7 mm						NOT SPECIFIED	NOT SPECIFIED	7 mm			CMOS			3.3 V						.5 mm		S-XQCC-N48
TMS320DM368ZCEDF	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V				32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.3 mm		8192	13 mm				32		30	260	13 mm			CMOS			1.35 V		Digital Signal Processors			I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
MIMXRT1051CVJ5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel		-40 Cel	TIN SILVER			BOTTOM		1.52 mm			12 mm						40	260	12 mm			CMOS									.8 mm		S-PBGA-B196	3			e2
ATECC608B-SSHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V						SMALL OUTLINE	SOP8,.23	2 V	85 Cel		-40 Cel				DUAL		1.75 mm			3.9 mm								4.9 mm			CMOS								1-WIRE	1.27 mm		R-PDSO-G8
FT245RL	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	SQUARE	PLASTIC/EPOXY	YES	5.25 V						SMALL OUTLINE, SHRINK PITCH		3.3 V	85 Cel		-40 Cel				DUAL		2 mm			5.3 mm						40	260	10.2 mm			CMOS									.65 mm		S-PDSO-G28	3
TMS320DM368ZCED	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V				32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.3 mm		8192	13 mm				32		30	260	13 mm			CMOS			1.35 V		Digital Signal Processors			I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
ATECC608A-MAHDA-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD			DUAL		.6 mm			2 mm						30	260	3 mm			CMOS									.5 mm		R-PDSO-N8	1			e4
ATECC608B-SSHCZ-B	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V						SMALL OUTLINE	SOP8,.23	2 V	85 Cel		-40 Cel				DUAL		1.75 mm			3.9 mm								4.9 mm			CMOS								1-WIRE	1.27 mm		R-PDSO-G8
CY8C4146LQI-S422	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL																			PURE TIN																															3
MIMXRT1021CAF4A	NXP Semiconductors	SoC	INDUSTRIAL																			TIN														40	260																3			e3
RN2903A-I/RM103	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949					MICROELECTRONIC ASSEMBLY		2.1 V	85 Cel		-40 Cel	NICKEL GOLD			UNSPECIFIED		3.34 mm			17.78 mm							250	26.67 mm			CMOS			3.3 V						1.27 mm		R-XXMA-N47				e4
FT245RL-TUBE	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V						SMALL OUTLINE, SHRINK PITCH		3.3 V	85 Cel		-40 Cel				DUAL		2 mm			5.3 mm								10.2 mm			CMOS									.65 mm		R-PDSO-G28		Not Qualified
CC1310F128RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)			QUAD		1 mm			7 mm						NOT SPECIFIED	260	7 mm		28672	CMOS			3.3 V						.5 mm		S-PQCC-N48	3			e4
MIMXRT1051CVL5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.43 mm			10 mm						40	260	10 mm			CMOS									.65 mm		S-PBGA-B196	3			e1
MSP430F67791AIPEUR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD	YES	1.6 mm	524288	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm		32768	CMOS	6-Ch 10-Bit		3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		R-PQFP-G128	3		25 rpm	e4	8	90
MCP2221-I/P	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	TS 16949				3.3/5	IN-LINE	DIP14,.3	3 V	85 Cel		-40 Cel	MATTE TIN			DUAL		5.334 mm			7.62 mm								19.05 mm			CMOS		15 mA	3.3 V		Serial IO/Communication Controllers				2.54 mm		R-PDIP-T14		Not Qualified		e3
AM4376BZDND100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.3 mm			17 mm						30	260	17 mm			CMOS			1.325 V						.65 mm		S-PBGA-B491	3			e1
CC1310F128RGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)			QUAD		1 mm			7 mm						30	260	7 mm		28672	CMOS			3.3 V						.5 mm		S-PQCC-N48	3			e4
CY8C5268LTI-LP030	Infineon Technologies	PSoC	INDUSTRIAL																			NICKEL PALLADIUM GOLD														30	260																3	Not Qualified		e4
MC-10105F1-821-FNA-M1-A	Renesas Electronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V					1,3.3	GRID ARRAY	BGA196,14X14,40	.9 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.71 mm			15 mm		ALSO OPERATES AT 3.3 V						15 mm			CMOS			1 V		Other uPs/uCs/Peripheral ICs				1 mm		S-PBGA-B196		Not Qualified		e1
P82B715DG4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	12 V						SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)			DUAL		1.75 mm			3.9 mm		VCCB(Min)(V) is 3, VCCB(Max)(V) is 12		0	.4 MHz	NOT SPECIFIED	260	4.9 mm			BIPOLAR			5 V					I2C	1.27 mm		R-PDSO-G8	1	Not Qualified		e4
CY8C21434-24LTXI	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD			QUAD		1 mm			5 mm		ALSO OPERATES AT 2.7V AND 3.3V SUPPLY				40	260	5 mm			CMOS			5 V						.5 mm		S-XQCC-N32	3	Not Qualified		e4
MCIMX6U7CVM08AC	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm			CMOS									.8 mm		S-PBGA-B624	3			e1
NRF9160-SIBA-R	Nordic Semiconductor Asa	MICROCONTROLLER, CISC	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V						GRID ARRAY	LGA127,21X30,20	3 V	85 Cel		-40 Cel				BOTTOM		1.1 mm			10.5 mm								16 mm			CMOS			3.8 V						.5 mm		R-XBGA-N127
AM4376BZDNA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.3 mm			17 mm						30	260	17 mm			CMOS			1.325 V						.65 mm		S-PBGA-B491	3			e1
CY8C4146LQI-S422T	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL																			PURE TIN																															3
FT245RQ	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	3.3 V	85 Cel		-40 Cel				QUAD		1 mm			5 mm				8	12.02 MHz	40	260	5 mm			CMOS			5 V					USB	.5 mm		S-XQCC-N32	3
MCIMX6G2CVM05AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.32 mm			14 mm						40	260	14 mm			CMOS									.8 mm		S-PBGA-B289	3			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.