INDUSTRIAL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	No. of Timers	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
MCIMX6Q7CVT08AC	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V							GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.16 mm			21 mm		EACH GPIO MODULE SUPPORTS 32 BITS OF I/O					40	260	21 mm			CMOS			1.4 V								.8 mm		S-PBGA-B624	3				e1
CY8C4248LQI-BL573	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL																						PURE TIN																																	3
CC2541F256RHAT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V						3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm		8	6 mm				TIMER(4)	0		30	260	6 mm		8192	CMOS			3 V				Other uPs/uCs/Peripheral ICs			I2C; SPI; USART; USB	.5 mm		S-PQCC-N40	3	Not Qualified			e4		23
SLB9670XQ20FW740XUMA2	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1.95 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.65 V	85 Cel			-40 Cel			BOTTOM		.9 mm			5 mm		ALSO AVAILABLE WITH 3.3V NOM SUPPLY							5 mm			CMOS			1.8 V								.5 mm		S-PQCC-N32
XCZU2CG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY		YES								GRID ARRAY			100 Cel			-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM												30	250				CMOS			.85 V										S-PBGA-B784	4				e1
MCIMX6Y2CVM05ABR	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.32 mm			14 mm							40	260	14 mm			CMOS											.8 mm		S-PBGA-B289	3				e1
AM4378BZDND100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.378 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			17 mm							30	260	17 mm			CMOS			1.325 V								.65 mm		S-PBGA-B491	3				e1
ATSAM4C16CB-AUR	Microchip Technology	SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.32 V							FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.08 V	85 Cel			-40 Cel	MATTE TIN		QUAD		1.6 mm			14 mm							40	260	14 mm			CMOS			1.2 V								.5 mm		S-PQFP-G100	3				e3
MCIMX286CVM4B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.55 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.37 mm			14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V					40	260	14 mm			CMOS			1.45 V								.8 mm		S-PBGA-B289	3	Not Qualified			e1
CY8C4146LQI-S432T	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL																						PURE TIN																																	3
RN2903A-I/RMSA103	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED		YES	3.6 V							MICROELECTRONIC ASSEMBLY		2.1 V	85 Cel			-40 Cel	NICKEL GOLD		UNSPECIFIED		3.34 mm			17.78 mm		SEATED HGT-CALCULATED						250	26.67 mm			CMOS			3.3 V								1.27 mm		R-XXMA-N47					e4
XCZU4EV-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V							GRID ARRAY		.825 V	100 Cel			-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM												30	245				CMOS			.85 V										R-PBGA-B900	4				e1
XCZU4EV-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.742 V							GRID ARRAY		.698 V	100 Cel			-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY					30	250				CMOS			.72 V										R-PBGA-B784	4				e1
P82B715P	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	12 V							IN-LINE		4.5 V	85 Cel			-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		5.08 mm			7.62 mm		VCCB(Min)(V) is 3, VCCB(Max)(V) is 12			0	.4 MHz	NOT SPECIFIED	NOT SPECIFIED	9.81 mm			BIPOLAR			5 V							I2C	2.54 mm		R-PDIP-T8		Not Qualified			e4
OMAPL138EZWTD4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.35 V							GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			16 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY			32	50 MHz	30	260	16 mm			CMOS			1.3 V							I2C; SPI; UART; USB	.8 mm		S-PBGA-B361	3		456 rpm		e1
MCIMX283CVM4B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.55 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.37 mm			14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V					40	260	14 mm			CMOS			1.45 V								.8 mm		S-PBGA-B289	3	Not Qualified			e1
XCZU7EV-2FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V							GRID ARRAY		.825 V	100 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM												30	245				CMOS			.85 V										R-PBGA-B1517	4				e1
AM5716AABCXEA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V							GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm							30	250	23 mm			CMOS			1.15 V								.8 mm		S-PBGA-B760	3				e1
SLB9670XQ20FW763XUMA1	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1.95 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.65 V	85 Cel			-40 Cel			BOTTOM		.9 mm			5 mm		ALSO AVAILABLE WITH 3.3V NOM SUPPLY							5 mm			CMOS			1.8 V								.5 mm		S-PQCC-N32
CC1312R1F3RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.8 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm			7 mm		DIMENSION CONSIDER BASED ON LINKHTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF					30	260	7 mm		81920	CMOS			3 V								.5 mm		S-PQCC-N48	3				e4		30
ATECC608A-MAHCZ-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V		TS 16949					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel			-40 Cel			DUAL		.6 mm			2 mm									3 mm			CMOS											.5 mm		R-PDSO-N8
ATWINC1500-MR210PB1172	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED		YES	3.6 V							MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel			-40 Cel			UNSPECIFIED		2.113 mm			14.73 mm									21.72 mm			CMOS			3.3 V										R-XXMA-N28
CC1310F64RSMR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.8 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			4 mm							NOT SPECIFIED	260	4 mm		28672	CMOS			3.3 V								.4 mm		S-PQCC-N32	3				e4
ATWINC1500-MR210PB1961-T	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED		YES	4.2 V							MICROELECTRONIC ASSEMBLY		3 V	85 Cel			-40 Cel			UNSPECIFIED		2.113 mm			14.73 mm		SEATED HGT-NOM					NOT SPECIFIED	NOT SPECIFIED	21.72 mm			CMOS			3.6 V										R-XXMA-N28
XCZU5EG-1SFVC784I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V							GRID ARRAY	BGA784,28X28,32	.825 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm							30	250	23 mm			CMOS			.85 V								.8 mm		R-PBGA-B784	4				e1
XCZU7EV-1FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V							GRID ARRAY		.825 V	100 Cel			-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM												30	245				CMOS			.85 V										R-PBGA-B1156	4				e1
XCZU7EV-2FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V							GRID ARRAY		.825 V	100 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM												30	245				CMOS			.85 V										R-PBGA-B1156	4				e1
ATWINC1500-MR210PB	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED		YES	4.2 V							MICROELECTRONIC ASSEMBLY		3 V	85 Cel			-40 Cel			UNSPECIFIED		2.113 mm			14.73 mm		SEATED HGT-NOM					NOT SPECIFIED	NOT SPECIFIED	21.72 mm			CMOS			3.6 V										R-XXMA-N28
CC3220MODSF12MOBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED	NO	YES	3.6 V	8		0	NO			CHIP CARRIER		2.3 V	85 Cel	CORTEX-M4	0	-40 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.45 mm	1024000	256	17.5 mm	0		YES	TIMER(4), WDT	0		30	260	20.5 mm	4	262144	CMOS	4-Ch 12-Bit		3.3 V	2	NO	2		I2C, I2S, SD, SPI, UART	FLASH		1.27 mm	FIXED POINT	R-XBCC-B63	3		2400 rpm	YES	e4	8	25
MCIMX6D7CVT08AD	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V							GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.16 mm			21 mm		EACH GPIO MODULE SUPPORTS 32 BITS OF I/O					40	260	21 mm			CMOS			1.4 V								.8 mm		S-PBGA-B624	3				e1
XCZU7EV-L1FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.742 V							GRID ARRAY		.698 V	100 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY					30	245				CMOS			.72 V										R-PBGA-B1156	4				e1
CY8C21434-24LFXI	Cypress Semiconductor	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	5.25 V						2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD		QUAD		.93 mm			5 mm		ALSO OPERATES AT 2.7V AND 3.3V SUPPLY					40	260	5 mm			CMOS			5 V				Microcontrollers				.5 mm		S-XQCC-N32	3	Not Qualified			e4
TMS320DM365ZCED30	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.42 V					32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		8192	13 mm					32		30	260	13 mm			CMOS			1.35 V				Digital Signal Processors			I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified			e1
TMS320F28PLC84PNT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY		YES	3.63 V							FLATPACK, LOW PROFILE, FINE PITCH		2.97 V	105 Cel			-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1.6 mm			12 mm							30	260	12 mm			CMOS			3.3 V								.5 mm		S-PQFP-G80	3				e4
SCANSTA112VSX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V						3.3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	3 V	85 Cel			-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1.2 mm			14 mm					0		NOT SPECIFIED	260	14 mm			CMOS			3.3 V				Other Microprocessor ICs				.5 mm		S-PQFP-G100	3	Not Qualified			e4
SLB9670XQ20FW762XUMA1	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1.95 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.65 V	85 Cel			-40 Cel			BOTTOM		.9 mm			5 mm		ALSO AVAILABLE WITH 3.3V NOM SUPPLY							5 mm			CMOS			1.8 V								.5 mm		S-PQCC-N32
CY8C21434-24LFXIT	Cypress Semiconductor	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	5.25 V						2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD		QUAD		.93 mm			5 mm		ALSO OPERATES AT 2.7V AND 3.3V SUPPLY					40	260	5 mm			CMOS			5 V				Microcontrollers				.5 mm		S-XQCC-N32	3	Not Qualified			e4
ATECC608A-MAHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V		TS 16949					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel			-40 Cel			DUAL		.6 mm			2 mm									3 mm			CMOS											.5 mm		R-PDSO-N8
CY8C21434-24LKXI	Cypress Semiconductor	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	5.25 V						2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD		QUAD		.6 mm			5 mm		ALSO OPERATES AT 2.7V AND 3.3V SUPPLY					40	260	5 mm			CMOS			5 V				Microcontrollers				.5 mm		S-XQCC-N32	3	Not Qualified			e4
CY8C21434-24LKXIT	Cypress Semiconductor	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	5.25 V						2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD		QUAD		.6 mm			5 mm		ALSO OPERATES AT 2.7V AND 3.3V SUPPLY					40	260	5 mm			CMOS			5 V				Microcontrollers				.5 mm		S-XQCC-N32	3	Not Qualified			e4
MCIMX6G1CVM05AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.3 V							GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.32 mm			14 mm							40	260	14 mm			CMOS											.8 mm		S-PBGA-B289	3				e1
MIMXRT1061CVL5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.43 mm			10 mm							40	260	10 mm			CMOS											.65 mm		S-PBGA-B196	3				e1
AM4376BZDND80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.326 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			17 mm							30	260	17 mm			CMOS			1.26 V								.65 mm		S-PBGA-B491	3				e1
CC1310F32RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.8 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			7 mm							NOT SPECIFIED	260	7 mm		28672	CMOS			3.3 V								.5 mm		S-PQCC-N48	3				e4
USB2660I-JZX-03-TR	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	64	QCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		TS 16949				3.3	CHIP CARRIER	LCC64,.30SQ,16	3 V	85 Cel			-40 Cel	MATTE TIN		QUAD		.9 mm			7.5 mm									7.5 mm					275 mA	3.3 V				Bus Controllers				.4 mm		S-PQCC-N64		Not Qualified			e3
AX8052F143-3-TX40	Onsemi	SYSTEM ON CHIP	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V							CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG	LCC40,.2X.28,20	1.8 V	85 Cel			-40 Cel	NICKEL GOLD PALLADIUM		QUAD		1 mm			5 mm							30	260	7 mm			CMOS			3 V								.5 mm		R-PQCC-N40	1
CY8CPLC10-28PVXIT	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V						5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	85 Cel			-40 Cel	MATTE TIN		DUAL		2 mm			5.3 mm							20	260	10.2 mm			CMOS			5 V				Other uPs/uCs/Peripheral ICs				.65 mm		R-PDSO-G28	3	Not Qualified			e3
SCANSTA112SMX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V						3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA100,10X10,32	3 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm			10 mm					0		30	260	10 mm			CMOS			3.3 V				Other Microprocessor ICs				.8 mm		S-PBGA-B100	4	Not Qualified			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.