BALL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MCIMX253CJM4A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V		1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY	40	260	17 mm	CMOS	1.45 V	Microprocessors	.8 mm	S-PBGA-B400	3	Not Qualified	e1
LS1043ASE7KNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm		30	250	21 mm	CMOS	.9 V		.8 mm	S-PBGA-B621	3		e1
LS1043AXN8QNLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V		.8 mm	S-PBGA-B780
LS1043ASE8MQLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V		.8 mm	S-PBGA-B780
LS1088AXN7QTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	23 mm				23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780
LS1043AXN8MQLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V		.8 mm	S-PBGA-B780
LS1088ASN7P1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel		BOTTOM	2.61 mm	23 mm				23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780
LS1048ASE7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
LS1043AXE7QQLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	21 mm				21 mm	CMOS	.9 V		.8 mm	S-PBGA-B621
MCIMX508CVK8BR2	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	416	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA416,24X24,20	.95 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	13 mm		40	260	13 mm	CMOS	1.05 V		.5 mm	S-PBGA-B416	3	Not Qualified	e1
LS1088ASE7MTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel		BOTTOM	2.61 mm	23 mm				23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780
LS1043ASE7QNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	21 mm				21 mm	CMOS	.9 V		.8 mm	S-PBGA-B621
LS1023AXE7PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm	ALSO OPERATES AT 1V SUPPLY NOM	30	250	21 mm	CMOS	1 V		.8 mm	S-PBGA-B621	3		e1
MCIMX285AVM4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V	AEC-Q100		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V		.8 mm	S-PBGA-B289	3
LS1043ASN7MNLA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	21 mm		30	250	21 mm	CMOS	.9 V		.8 mm	S-PBGA-B621	3
LS1043ASE7PNLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	21 mm				21 mm	CMOS	.9 V		.8 mm	S-PBGA-B621
LS1043AXE8QNLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V		.8 mm	S-PBGA-B780
LS1048ASN7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
MCIMX27VOP4-LF	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	404	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA404,24X24,25	1.38 V	85 Cel	-20 Cel		BOTTOM	1.4 mm	17 mm	ALSO OPERATES 1.3V AT 266MHZ			17 mm	CMOS	1.45 V		.65 mm	S-PBGA-B404
MIMX8QX1AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	2.52 mm	21 mm		40	260	21 mm	CMOS	1.1 V		.8 mm	S-PBGA-B609	3		e2
LS1048ASE7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
LS1088AXN7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
LS1043AXN7KQLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	21 mm				21 mm	CMOS	.9 V		.8 mm	S-PBGA-B621
MCIMX6D4AVT08ACR	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
MCIMX6Q4AVT08AC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH		1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX6Q5EZK08AD	NXP Semiconductors	SoC	OTHER	BALL	569	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA569,29X29,16	1.275 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.25 mm	12 mm		40	260	12 mm	CMOS	1.4 V		.4 mm	S-PBGA-B569	3		e1
MCIMX6D4AVT08AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
MCIMX351AVM4BR2	NXP Semiconductors	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.22 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400	3		e1
MCIMX507CVM1BR2	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.2 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.275 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
LS1043AXN8QQLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V		.8 mm	S-PBGA-B780
MCIMX6U6AVM08ADR	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
LS1043AXE8KNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V		.8 mm	S-PBGA-B780
MCIMX507CVM1B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.2 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.275 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX513CJM6C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	19 mm		40	260	19 mm	CMOS	1 V	Graphics Processors	.8 mm	S-PBGA-B529	3	Not Qualified	e1
LS1021ASN7HNB	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	525	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm		40	260	19 mm	CMOS	1 V		.8 mm	S-PBGA-B525	3		e1
MCIMX356AVM5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
LS1043ASE8MNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm		30	250	23 mm	CMOS	.9 V		.8 mm	S-PBGA-B780	3		e1
LS1043ASN7PQLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	21 mm				21 mm	CMOS	.9 V		.8 mm	S-PBGA-B621
MCIMX6Y7DVM09AA	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.375 V	95 Cel	0 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3
LS1043AXN7KNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	21 mm				21 mm	CMOS	.9 V		.8 mm	S-PBGA-B621
MCIMX355AJQ5C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX6Y1CVK05AB	NXP Semiconductors	SoC		BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.275 V	105 Cel	-40 Cel		BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS			.5 mm	S-PBGA-B272	3
LS1043ABE9MQB	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V			TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm		30	250	23 mm	CMOS	.9 V		.8 mm	S-PBGA-B780	3		e1
MCIMX6Q5EYM12AE	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
LS1044AXE7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	23 mm			250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3
MCIMX280CVM4BR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		1.4,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V	Microprocessors	.8 mm	S-PBGA-B289	3	Not Qualified	e1
LS1043ASN7QNLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	21 mm				21 mm	CMOS	.9 V		.8 mm	S-PBGA-B621
LS1088ASN7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.