NXP Semiconductors - LS1043ABE9MQB

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LS1043ABE9MQB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number LS1043ABE9MQB
Description SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B780;
Datasheet LS1043ABE9MQB Datasheet
In Stock1,415
NAME DESCRIPTION
Minimum Supply Voltage: .87 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: .9 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.07 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 780
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B780
Package Shape: SQUARE
Terminal Form: BALL
Package Code: HFBGA
Width: 23 mm
Moisture Sensitivity Level (MSL): 3
Other Names: 568-LS1043ABE9MQB
Peripheral IC Type: SYSTEM ON CHIP
Maximum Supply Voltage: .93 V
JESD-609 Code: e1
Package Equivalence Code: BGA780,28X28,32
Length: 23 mm
Peak Reflow Temperature (C): 250
Terminal Pitch: .8 mm
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