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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | LS1043ASE8MQLB |
| Description | SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE; |
| Datasheet | LS1043ASE8MQLB Datasheet |
| In Stock | 3,568 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .87 V |
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | SYSTEM ON CHIP |
| Nominal Supply Voltage: | .9 V |
| Maximum Supply Voltage: | .93 V |
| Maximum Seated Height: | 2.07 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | 0 Cel |
| No. of Terminals: | 780 |
| Package Equivalence Code: | BGA780,28X28,32 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
| Length: | 23 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B780 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 105 Cel |
| Package Code: | HFBGA |
| Width: | 23 mm |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | INDUSTRIAL |









