Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Information Access Method | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Interrupt Capability | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | No. of Ports | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Volatile | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
SERIAL, FIXED PROTOCOL |
5.5 V |
3/5 |
SMALL OUTLINE |
SOP14,.25 |
N |
2.7 V |
85 Cel |
-40 Cel |
PURE TIN |
DUAL |
1.75 mm |
3.9 mm |
30 |
260 |
8.64 mm |
CMOS |
SECONDS |
3 V |
Timer or RTC |
1.27 mm |
R-PDSO-G14 |
3 |
Not Qualified |
NO |
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|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
109 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
30 |
260 |
CMOS |
R-PDSO-G14 |
1 |
e3 |
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|
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
GULL WING |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.3/5,5 |
SMALL OUTLINE |
SOP32,.4 |
85 Cel |
-25 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
30 |
250 |
150 mA |
Other Microprocessor ICs |
1.27 mm |
R-PDSO-G32 |
1 |
Not Qualified |
e4 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
16 |
2/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
1.8 V |
85 Cel |
MSP430 |
-40 Cel |
NICKEL PALLADIUM GOLD |
YES |
QUAD |
1.6 mm |
262144 |
32 |
14 mm |
0 |
30 |
260 |
14 mm |
32768 |
CMOS |
11.75 mA |
3.3 V |
Microcontrollers |
FLASH |
I2C; SPI; UART |
.5 mm |
S-PQFP-G100 |
3 |
Not Qualified |
25 rpm |
e4 |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK, LOW PROFILE, FINE PITCH |
1.8 V |
85 Cel |
MSP430 |
-40 Cel |
NICKEL PALLADIUM GOLD |
YES |
QUAD |
1.6 mm |
8 |
14 mm |
0 |
30 |
260 |
14 mm |
8192 |
CMOS |
3.3 V |
I2C; SPI; UART |
.5 mm |
S-PQFP-G100 |
3 |
e4 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
128 |
LFQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
NO |
16 |
FLATPACK, LOW PROFILE, FINE PITCH |
2.4 V |
85 Cel |
MSP430 |
-40 Cel |
NICKEL PALLADIUM GOLD |
YES |
QUAD |
YES |
1.6 mm |
131072 |
16 |
14 mm |
0 |
IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY |
BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT |
0 |
.032768 MHz |
30 |
260 |
20 mm |
16384 |
CMOS |
6-Ch 10-Bit |
3.3 V |
YES |
I2C(2), IRDA(4), SPI(6), UART(4) |
FLASH |
I2C; SPI; UART |
.5 mm |
R-PQFP-G128 |
3 |
25 rpm |
e4 |
8 |
90 |
|||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
128 |
LFQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
NO |
16 |
FLATPACK, LOW PROFILE, FINE PITCH |
2.4 V |
85 Cel |
MSP430 |
-40 Cel |
NICKEL PALLADIUM GOLD |
YES |
QUAD |
YES |
1.6 mm |
131072 |
16 |
14 mm |
0 |
IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY |
BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT |
0 |
.032768 MHz |
30 |
260 |
20 mm |
16384 |
CMOS |
6-Ch 10-Bit |
3.3 V |
YES |
I2C(2), IRDA(4), SPI(6), UART(4) |
FLASH |
I2C; SPI; UART |
.5 mm |
R-PQFP-G128 |
3 |
25 rpm |
e4 |
8 |
90 |
|||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
128 |
LFQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
NO |
16 |
FLATPACK, LOW PROFILE, FINE PITCH |
2.4 V |
85 Cel |
MSP430 |
-40 Cel |
NICKEL PALLADIUM GOLD |
YES |
QUAD |
YES |
1.6 mm |
524288 |
16 |
14 mm |
0 |
IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY |
BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT |
0 |
.032768 MHz |
30 |
260 |
20 mm |
16384 |
CMOS |
6-Ch 10-Bit |
3.3 V |
YES |
I2C(2), IRDA(4), SPI(6), UART(4) |
FLASH |
I2C; SPI; UART |
.5 mm |
R-PQFP-G128 |
3 |
25 rpm |
e4 |
8 |
90 |
|||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
16 |
2/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
1.8 V |
85 Cel |
MSP430 |
-40 Cel |
NICKEL PALLADIUM GOLD |
YES |
QUAD |
1.6 mm |
524288 |
16 |
14 mm |
0 |
25 MHz |
30 |
260 |
14 mm |
16384 |
CMOS |
11.75 mA |
3.3 V |
Microcontrollers |
FLASH |
I2C; SPI; UART |
.5 mm |
S-PQFP-G100 |
3 |
Not Qualified |
25 rpm |
e4 |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
AEC-Q100 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
105 Cel |
-40 Cel |
DUAL |
1.2 mm |
4.4 mm |
also operates with 3.3v and 5v nominal |
6.5 mm |
CMOS |
1.8 V |
.65 mm |
R-PDSO-G20 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
SMALL OUTLINE |
SOP8,.25 |
2.5 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.75 mm |
3.9 mm |
4.9 mm |
CMOS |
3.3 V |
1.27 mm |
R-PDSO-G8 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
SMALL OUTLINE |
SOP8,.25 |
2.5 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.75 mm |
3.9 mm |
4.9 mm |
CMOS |
3.3 V |
1.27 mm |
R-PDSO-G8 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
SMALL OUTLINE |
SOP8,.25 |
2.5 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.75 mm |
3.9 mm |
260 |
4.9 mm |
CMOS |
3.3 V |
1.27 mm |
R-PDSO-G8 |
1 |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE |
SOP8,.23 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.75 mm |
3.9 mm |
40 |
260 |
4.9 mm |
CMOS |
1.27 mm |
R-PDSO-G8 |
3 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE |
SOP8,.23 |
2 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
1.75 mm |
3.9 mm |
4.9 mm |
CMOS |
1.27 mm |
R-PDSO-G8 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE |
SOP8,.23 |
2 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
1.75 mm |
3.9 mm |
0 |
1 MHz |
4.9 mm |
CMOS |
1.27 mm |
R-PDSO-G8 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
SYSTEM ON CHIP |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
1.08 V |
85 Cel |
-40 Cel |
QUAD |
1.2 mm |
14 mm |
14 mm |
CMOS |
1.2 V |
.5 mm |
S-PQFP-G100 |
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|
Infineon Technologies |
PROGRAMMABLE SoC |
GULL WING |
80 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP80,.55SQ,20 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
12 mm |
12 mm |
CMOS |
1.8 V |
.5 mm |
S-PQFP-G80 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
SoC |
GULL WING |
64 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
HQFP64,.47SQ,20 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
10 mm |
10 mm |
CMOS |
1.8 V |
.5 mm |
S-PQFP-G64 |
3 |
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|
Infineon Technologies |
SoC |
GULL WING |
64 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
HQFP64,.47SQ,20 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
10 mm |
10 mm |
CMOS |
1.8 V |
.5 mm |
S-PQFP-G64 |
3 |
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|
Renesas Electronics |
MICROPROCESSOR CIRCUIT |
OTHER |
GULL WING |
128 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.9 V |
FLATPACK, LOW PROFILE, FINE PITCH |
1.7 V |
85 Cel |
-10 Cel |
MATTE TIN |
QUAD |
1.6 mm |
14 mm |
30 |
260 |
14 mm |
CMOS |
1.8 V |
.4 mm |
S-PQFP-G128 |
3 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
FTDI |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
FLATPACK, LOW PROFILE |
4.35 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
1.6 mm |
7 mm |
250 |
7 mm |
CMOS |
5 V |
.8 mm |
S-PQFP-G32 |
3 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Qualcomm |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2.7 V |
FLATPACK |
2.3 V |
85 Cel |
-40 Cel |
QUAD |
3.4 mm |
14 mm |
NOT SPECIFIED |
NOT SPECIFIED |
20 mm |
CMOS |
2.5 V |
.8 mm |
R-PQFP-G80 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE |
4.5 V |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1.752 mm |
3.9 mm |
8.649 mm |
CMOS |
5 V |
1.27 mm |
R-PDSO-G14 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE |
4.5 V |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
1.752 mm |
3.9 mm |
8.649 mm |
CMOS |
5 V |
1.27 mm |
R-PDSO-G14 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
8 |
3/5 |
SMALL OUTLINE |
SOP14,.24 |
2.7 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
DUAL |
1.75 mm |
3.9 mm |
8.65 mm |
CMOS |
5 V |
Parallel IO Port |
1.27 mm |
R-PDSO-G14 |
1 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
8 |
3/5 |
SMALL OUTLINE |
SOP14,.24 |
2.7 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
DUAL |
1.75 mm |
3.9 mm |
8.65 mm |
CMOS |
5 V |
Parallel IO Port |
1.27 mm |
R-PDSO-G14 |
1 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
NO |
16 |
FLATPACK, LOW PROFILE, FINE PITCH |
2.4 V |
85 Cel |
MSP430 |
-40 Cel |
NICKEL PALLADIUM GOLD |
YES |
QUAD |
YES |
1.6 mm |
262144 |
32 |
14 mm |
0 |
IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY |
BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT |
0 |
.032768 MHz |
30 |
260 |
14 mm |
32768 |
CMOS |
6-Ch 10-Bit |
3.3 V |
YES |
I2C(2), IRDA(4), SPI(6), UART(4) |
FLASH |
I2C; SPI; UART |
.5 mm |
S-PQFP-G100 |
3 |
25 rpm |
e4 |
8 |
62 |
|||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
16 |
2/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
1.8 V |
85 Cel |
MSP430 |
-40 Cel |
NICKEL PALLADIUM GOLD |
YES |
QUAD |
1.6 mm |
262144 |
32 |
14 mm |
0 |
25 MHz |
30 |
260 |
14 mm |
32768 |
CMOS |
11.75 mA |
3.3 V |
Microcontrollers |
FLASH |
I2C; SPI; UART |
.5 mm |
S-PQFP-G100 |
3 |
Not Qualified |
25 rpm |
e4 |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
128 |
LFQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
16 |
2/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP128,.63X.87,20 |
1.8 V |
85 Cel |
MSP430 |
-40 Cel |
NICKEL PALLADIUM GOLD |
YES |
QUAD |
1.6 mm |
524288 |
32 |
14 mm |
0 |
30 |
260 |
20 mm |
32768 |
CMOS |
11.75 mA |
3.3 V |
Microcontrollers |
FLASH |
I2C; SPI; UART |
.5 mm |
R-PQFP-G128 |
3 |
Not Qualified |
25 rpm |
e4 |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
TS 16949 |
SMALL OUTLINE, SHRINK PITCH |
SSOP28,.3 |
1.8 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
2 mm |
5.3 mm |
40 |
260 |
10.2 mm |
CMOS |
3 V |
.65 mm |
R-PDSO-G28 |
2 |
e3 |
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|
STMicroelectronics |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
AEC-Q100 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
105 Cel |
-40 Cel |
DUAL |
1.2 mm |
4.4 mm |
also operates with 3.3v and 5v nominal |
6.5 mm |
CMOS |
1.8 V |
.65 mm |
R-PDSO-G20 |
1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
GULL WING |
80 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
NO |
FLATPACK, THIN PROFILE, FINE PITCH |
3 V |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
YES |
QUAD |
NO |
1.2 mm |
65536 |
12 mm |
2K |
COMPARATOR(7) |
0 |
2 MHz |
30 |
260 |
12 mm |
CMOS |
3.3 V |
NO |
I2C; SPI; UART |
.5 mm |
S-PQFP-G80 |
3 |
e4 |
8 |
43 |
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|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
80 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3.3 |
FLATPACK |
QFP80,.7SQ |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
3.4 mm |
14 mm |
260 |
14 mm |
CMOS |
3.3 V |
DSP Peripherals |
.65 mm |
S-PQFP-G80 |
3 |
Not Qualified |
e3 |
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|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
SMALL OUTLINE |
SOP8,.25 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.75 mm |
3.9 mm |
40 |
260 |
4.9 mm |
CMOS |
1.27 mm |
R-PDSO-G8 |
3 |
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|
Microchip Technology |
CAPACITIVE TOUCH SCREEN CONTROLLERS |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.47 V |
AEC-Q100 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
3.14 V |
105 Cel |
-40 Cel |
QUAD |
1.6 mm |
20 mm |
20 mm |
CMOS |
3.3 V |
.5 mm |
S-PQFP-G144 |
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|
Microchip Technology |
CAPACITIVE TOUCH SCREEN CONTROLLERS |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.47 V |
AEC-Q100 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
3.14 V |
105 Cel |
-40 Cel |
QUAD |
1.6 mm |
20 mm |
20 mm |
CMOS |
3.3 V |
.5 mm |
S-PQFP-G144 |
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|
Microchip Technology |
CAPACITIVE TOUCH SCREEN CONTROLLERS |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.47 V |
AEC-Q100 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
3.14 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
20 mm |
20 mm |
CMOS |
3.3 V |
.5 mm |
S-PQFP-G144 |
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|
Microchip Technology |
CAPACITIVE TOUCH SCREEN CONTROLLERS |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.47 V |
AEC-Q100 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
3.14 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
20 mm |
20 mm |
CMOS |
3.3 V |
.5 mm |
S-PQFP-G144 |
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|
Microchip Technology |
CAPACITIVE TOUCH SCREEN CONTROLLERS |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.47 V |
AEC-Q100 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
3.14 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
20 mm |
20 mm |
CMOS |
3.3 V |
.5 mm |
S-PQFP-G144 |
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Microchip Technology |
SYSTEM ON CHIP |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
1.08 V |
85 Cel |
-40 Cel |
QUAD |
1.2 mm |
14 mm |
14 mm |
CMOS |
1.2 V |
.5 mm |
S-PQFP-G100 |
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|
NXP Semiconductors |
COMMERCIAL |
GULL WING |
132 |
BQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
FLATPACK |
SPQFP132,1.1SQ |
70 Cel |
0 Cel |
TIN |
QUAD |
40 |
260 |
CMOS |
Other uPs/uCs/Peripheral ICs |
.635 mm |
S-PQFP-G132 |
3 |
Not Qualified |
e3 |
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Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE |
4.5 V |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
1.75 mm |
3.9 mm |
9.9 mm |
CMOS |
.5 mA |
5 V |
1.27 mm |
R-PDSO-G16 |
1 |
Not Qualified |
e0 |
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|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE |
4.5 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1.75 mm |
3.9 mm |
9.9 mm |
CMOS |
.5 mA |
5 V |
1.27 mm |
R-PDSO-G16 |
1 |
Not Qualified |
e3 |
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NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
1.67 V |
105 Cel |
-40 Cel |
DUAL |
1.1 mm |
3 mm |
3 mm |
CMOS |
1.8 V |
.65 mm |
S-PDSO-G8 |
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|
NXP Semiconductors |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
20 |
SMALL OUTLINE |
SOP8,.25 |
DUAL |
20 V |
Other Microprocessor ICs |
1.27 mm |
R-PDSO-G8 |
Not Qualified |
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|
Analog Devices |
CRYPTOGRAPHIC AUTHENTICATOR |
GULL WING |
3 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2.8 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
30 |
260 |
CMOS |
3.3 V |
R-PDSO-G3 |
1 |
e3 |
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|
Renesas Electronics |
MICROPROCESSOR CIRCUIT |
OTHER |
GULL WING |
128 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.9 V |
FLATPACK, LOW PROFILE, FINE PITCH |
1.7 V |
85 Cel |
-10 Cel |
MATTE TIN |
QUAD |
1.6 mm |
14 mm |
30 |
260 |
14 mm |
CMOS |
1.8 V |
.4 mm |
S-PQFP-G128 |
3 |
e3 |
Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.
Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.
Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.
Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.