Infineon Technologies Other Function uPs,uCs & Peripheral ICs 1,980

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
CY8C6245AZI-S3D12	Infineon Technologies	SoC		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.7 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	14 mm				14 mm	CMOS	1.8 V		.5 mm	S-PQFP-G100	3
CYPM1111-40LQXIT	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2.75 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm				6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40	3
CY8C4147LQS-S273	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm				6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4147AZS-S475T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm		30	260	10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147AZE-S465	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm				10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64
CY8C4147LQA-S243	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm				6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4127AZS-S455	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm				10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147AZA-S265T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm				10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4146AZA-S455	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm		30	260	10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4124PVE-S412	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm				10.2 mm	CMOS	1.8 V		.65 mm	R-PDSO-G28	3		e4
CY8C4146AZS-S275	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm				10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147LQE-S263	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.6 mm	6 mm				6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4127LQA-S443T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm				6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
SLE66C680PEM5	Infineon Technologies	MICROPROCESSOR CIRCUIT
SBV525	Infineon Technologies
CY8C4146LQA-S243	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm				6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4147LQE-S473	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel	PURE TIN	QUAD	.6 mm	6 mm				6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40	3
SLE66C161PEM5	Infineon Technologies	MICROPROCESSOR CIRCUIT
SLE76CF5120PC	Infineon Technologies		OTHER									1.8/5		DIE OR CHIP		85 Cel	-25 Cel									CMOS		Other Microprocessor ICs				Not Qualified
CY8C4126AZS-S455	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm				10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4146AZE-S275T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm				10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64
CY8C4247LWA-M464	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.9 mm	8 mm				8 mm	CMOS	1.8 V		.5 mm	S-XQCC-N56	3		e4
CY8C4014SXA-421Z	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		SMALL OUTLINE	SOP16,.25	1.71 V	85 Cel	-40 Cel		DUAL	1.727 mm	3.8985 mm				9.893 mm	CMOS	3.3 V		1.27 mm	R-PDSO-G16	3
CY8C4147AZS-S285T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm		30	260	10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
SLE76CF1560PC	Infineon Technologies
CY8C4124PVS-S432	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm				10.2 mm	CMOS	1.8 V		.65 mm	R-PDSO-G28	3		e4
CY8C4125PVA-S422	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm				10.2 mm	CMOS	1.8 V		.65 mm	R-PDSO-G28	3		e4
CY8C6245AZI-S3D02	Infineon Technologies	SoC		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.7 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	14 mm				14 mm	CMOS	1.8 V		.5 mm	S-PQFP-G100	3
CY8C6248FNI-S2D43	Infineon Technologies	PROGRAMMABLE SoC
CY8C4147LQE-S443	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel	PURE TIN	QUAD	.6 mm	6 mm				6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40	3
CY8C4126AZS-M443	Infineon Technologies	PSoC		GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	7 mm		30	260	7 mm	CMOS	3.3 V		.5 mm	S-PQFP-G48	3
CY8C4147AZA-S245	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm				10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C6245FNI-S3D11	Infineon Technologies	SoC		BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA49,9X11,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.467 mm	2.8819 mm				3.1024 mm	CMOS	1.8 V		.42 mm	R-PBGA-B49
SLE76CF4000PC	Infineon Technologies		OTHER									1.8/5		DIE OR CHIP		85 Cel	-25 Cel									CMOS		Other Microprocessor ICs				Not Qualified
CY8C4147AZA-S255T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm		30	260	10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147LQS-S293T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm				6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4014LQS-422Z	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	1.71 V	105 Cel	-40 Cel		QUAD	.6 mm	4 mm				4 mm	CMOS	3.3 V		.5 mm	S-XQCC-N24	3
CY8C21223-24SXIT	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V			SMALL OUTLINE	SOP16,.4	4.75 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1.727 mm	3.8985 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY	40	260	9.893 mm	CMOS	5 V		1.27 mm	R-PDSO-G16	3		e4
CY8C4146PVE-S422	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm				10.2 mm	CMOS	1.8 V		.65 mm	R-PDSO-G28	3		e4
CY8C4126LQS-S453	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm				6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4245AZS-M443	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	7 mm				7 mm	CMOS	3 V		.5 mm	S-PQFP-G48	3
CY8C4147AZA-S445	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm				10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
SLE66CLX800M-C	Infineon Technologies		OTHER									1.8/5		DIE OR CHIP		85 Cel	-25 Cel									CMOS		Other Microprocessor ICs				Not Qualified
CY8C4147LQA-S443T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm				6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
SAB-R2010-20QJ	Infineon Technologies
CY8C4125PVA-S412	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm				10.2 mm	CMOS	1.8 V		.65 mm	R-PDSO-G28	3		e4
CY8C4146LQA-S453T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm				6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4146LQE-S273	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.6 mm	6 mm				6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.