Infineon Technologies Other Function uPs,uCs & Peripheral ICs 1,980

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

SLE952500600XTSA1

Infineon Technologies

CRYPTOGRAPHIC AUTHENTICATOR

INDUSTRIAL

NO LEAD

6

BCC

RECTANGULAR

PLASTIC/EPOXY

YES

1.6 V

GRID ARRAY

SOLCC6,.04,20

1.35 V

85 Cel

-40 Cel

TIN

BOTTOM

.4 mm

1.1 mm

ALSO OPERATES WITH 3.8V NOM SUPPLY

1.5 mm

CMOS

1.45 V

.5 mm

R-PBCC-N6

1

e3

S6J32GEKSMSE2000A

Infineon Technologies

SoC

GULL WING

208

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.3 V

AEC-Q100; TS 16949

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP208,1.2SQ,20

1.1 V

105 Cel

-40 Cel

QUAD

1.7 mm

28 mm

28 mm

CMOS

1.2 V

.5 mm

S-PQFP-G208

SLE95401

Infineon Technologies

CRYPTOGRAPHIC AUTHENTICATOR

S6J32FEKSNSE20000

Infineon Technologies

SoC

GULL WING

208

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.3 V

AEC-Q100; TS 16949

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP208,1.2SQ,20

1.1 V

105 Cel

-40 Cel

QUAD

1.7 mm

28 mm

28 mm

CMOS

1.2 V

.5 mm

S-PQFP-G208

SAB82532N

Infineon Technologies

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC68,1.0SQ

70 Cel

0 Cel

QUAD

CMOS

15 mA

5 V

Other uPs/uCs/Peripheral ICs

1.27 mm

S-PQCC-J68

Not Qualified

SAB82532N4-V12

Infineon Technologies

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC68,1.0SQ

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J68

Not Qualified

e0

SDA5273-3

Infineon Technologies

SLE88CF2920PDSO20

Infineon Technologies

OTHER

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1.8/5

SMALL OUTLINE

SOP20,.4

85 Cel

-25 Cel

DUAL

Other Microprocessor ICs

1.27 mm

R-PDSO-G20

Not Qualified

SAB82C206-N

Infineon Technologies

COMMERCIAL

J BEND

84

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC84,1.2SQ

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

30 mA

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J84

Not Qualified

e0

SAB82C251-N

Infineon Technologies

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC68,1.0SQ

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

20 mA

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J68

Not Qualified

e0

SLM76CF3201PVQFN-8-1

Infineon Technologies

SLE88CNFX5400PMC

Infineon Technologies

OTHER

1.8/5

DIE OR CHIP

85 Cel

-25 Cel

Other Microprocessor ICs

Not Qualified

SLE88CNF6602PMC

Infineon Technologies

OTHER

1.8/5

DIE OR CHIP

85 Cel

-25 Cel

Other Microprocessor ICs

Not Qualified

SLE66C80S-V5-T85M4

Infineon Technologies

S6J32GELSNSC20000

Infineon Technologies

SoC

GULL WING

216

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.3 V

AEC-Q100; TS 16949

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP216,1.02SQ,16

1.1 V

105 Cel

-40 Cel

QUAD

1.7 mm

24 mm

24 mm

CMOS

1.2 V

.4 mm

S-PQFP-G216

SLE88CF4002PVQFN10

Infineon Technologies

OTHER

NO LEAD

10

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1.8/5

SMALL OUTLINE

SOLCC10,.19

85 Cel

-25 Cel

DUAL

Other Microprocessor ICs

1.27 mm

R-PDSO-N10

Not Qualified

S6J32JEKSNSE20000

Infineon Technologies

SoC

GULL WING

208

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.3 V

AEC-Q100; TS 16949

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP208,1.2SQ,20

1.1 V

125 Cel

-40 Cel

QUAD

1.7 mm

28 mm

28 mm

CMOS

1.2 V

.5 mm

S-PQFP-G208

SAB82538N

Infineon Technologies

COMMERCIAL

GULL WING

160

QFP

PLASTIC/EPOXY

YES

5

FLATPACK

QFP160(UNSPEC)

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

15 mA

5 V

Other Microprocessor ICs

Not Qualified

e0

SLE88CF4002PDSO20

Infineon Technologies

OTHER

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1.8/5

SMALL OUTLINE

SOP20,.4

85 Cel

-25 Cel

DUAL

Other Microprocessor ICs

1.27 mm

R-PDSO-G20

Not Qualified

SLE88CFX5400PC

Infineon Technologies

OTHER

1.8/5

DIE OR CHIP

85 Cel

-25 Cel

Other Microprocessor ICs

Not Qualified

TBB278N

Infineon Technologies

GRAPHICS PROCESSOR

OTHER

J BEND

28

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC28,.4X.6

70 Cel

-25 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

Other Microprocessor ICs

1.27 mm

R-PQCC-J28

Not Qualified

e0

SAB82532N-V12

Infineon Technologies

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC68,1.0SQ

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J68

Not Qualified

e0

S6J32EELTPSC20000

Infineon Technologies

SoC

GULL WING

216

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.3 V

AEC-Q100; TS 16949

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP216,1.02SQ,16

1.1 V

105 Cel

-40 Cel

QUAD

1.7 mm

24 mm

24 mm

CMOS

1.2 V

.4 mm

S-PQFP-G216

SLM97CNFX1M00PE

Infineon Technologies

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

UNCASED CHIP

105 Cel

-40 Cel

UPPER

CMOS

X-XUUC-N

SLE88CFX4000PDSO20

Infineon Technologies

OTHER

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1.8/5

SMALL OUTLINE

SOP20,.4

85 Cel

-25 Cel

DUAL

Other Microprocessor ICs

1.27 mm

R-PDSO-G20

Not Qualified

SLE66C80S-V5-F7M4

Infineon Technologies

SLE88CNF5400PC

Infineon Technologies

OTHER

1.8/5

DIE OR CHIP

85 Cel

-25 Cel

Other Microprocessor ICs

Not Qualified

SLE95250

Infineon Technologies

CRYPTOGRAPHIC AUTHENTICATOR

INDUSTRIAL

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,20

2 V

85 Cel

-40 Cel

BOTTOM

.4 mm

1.1 mm

1.5 mm

CMOS

3.8 V

.5 mm

R-PDSO-N6

SLE66C80S-T85M4

Infineon Technologies

SAB82532N-10

Infineon Technologies

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC68,1.0SQ

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

15 mA

5 V

Other uPs/uCs/Peripheral ICs

1.27 mm

S-PQCC-J68

Not Qualified

e0

SLE88CFX4001PVQFN-10

Infineon Technologies

OTHER

NO LEAD

10

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1.8/5

SMALL OUTLINE

SOLCC10,.19

85 Cel

-25 Cel

DUAL

CMOS

Other Microprocessor ICs

1.27 mm

R-PDSO-N10

Not Qualified

S6J32GELTPSC20000

Infineon Technologies

SoC

GULL WING

216

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.3 V

AEC-Q100; TS 16949

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP216,1.02SQ,16

1.1 V

105 Cel

-40 Cel

QUAD

1.7 mm

24 mm

24 mm

CMOS

1.2 V

.4 mm

S-PQFP-G216

SLE88CNF6600PMC

Infineon Technologies

OTHER

1.8/5

DIE OR CHIP

85 Cel

-25 Cel

Other Microprocessor ICs

Not Qualified

SLM76CF3601P

Infineon Technologies

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.62 V

105 Cel

-40 Cel

DUAL

.9 mm

5 mm

6 mm

CMOS

1.27 mm

R-PDSO-N8

SLE95415

Infineon Technologies

CRYPTOGRAPHIC AUTHENTICATOR

SLE88CF3520PDSO20

Infineon Technologies

OTHER

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1.8/5

SMALL OUTLINE

SOP20,.4

85 Cel

-25 Cel

DUAL

Other Microprocessor ICs

1.27 mm

R-PDSO-G20

Not Qualified

SLE88CFX4000PVQFN10

Infineon Technologies

OTHER

NO LEAD

10

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1.8/5

SMALL OUTLINE

SOLCC10,.19

85 Cel

-25 Cel

DUAL

Other Microprocessor ICs

1.27 mm

R-PDSO-N10

Not Qualified

SLE88CF4000PVQFN10

Infineon Technologies

OTHER

NO LEAD

10

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1.8/5

SMALL OUTLINE

SOLCC10,.19

85 Cel

-25 Cel

DUAL

Other Microprocessor ICs

1.27 mm

R-PDSO-N10

Not Qualified

SLE88CFX1M00P

Infineon Technologies

SAB82538N-4

Infineon Technologies

COMMERCIAL

GULL WING

160

QFP

PLASTIC/EPOXY

YES

5

FLATPACK

QFP160(UNSPEC)

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

15 mA

5 V

Other Microprocessor ICs

Not Qualified

e0

SLE88CFX3521PDSO-20

Infineon Technologies

SLM9670AQ2.0

Infineon Technologies

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1.95 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

1.65 V

105 Cel

-40 Cel

QUAD

.9 mm

5 mm

ALSO OPERATES WITH 3.3V SUPPLY

5 mm

CMOS

1.8 V

.5 mm

S-XQCC-N32

S6J32GELTNSC20000

Infineon Technologies

SoC

GULL WING

216

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.3 V

AEC-Q100; TS 16949

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP216,1.02SQ,16

1.1 V

105 Cel

-40 Cel

QUAD

1.7 mm

24 mm

24 mm

CMOS

1.2 V

.4 mm

S-PQFP-G216

SLE95405

Infineon Technologies

CRYPTOGRAPHIC AUTHENTICATOR

SLE88CNF6602PC

Infineon Technologies

OTHER

1.8/5

DIE OR CHIP

85 Cel

-25 Cel

Other Microprocessor ICs

Not Qualified

SAB82556-N

Infineon Technologies

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC68,1.0SQ

Tin/Lead (Sn/Pb)

QUAD

CMOS

60 mA

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J68

Not Qualified

e0

SLM76CF2562P(VQFN-8)

Infineon Technologies

INDUSTRIAL

NO LEAD

8

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1.8/5

SMALL OUTLINE

SOLCC8,.25

105 Cel

-40 Cel

DUAL

CMOS

10 mA

Other Microprocessor ICs

1.27 mm

R-PDSO-N8

Not Qualified

S6J32HELTNSC20000

Infineon Technologies

SoC

GULL WING

216

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.3 V

AEC-Q100; TS 16949

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP216,1.02SQ,16

1.1 V

105 Cel

-40 Cel

QUAD

1.7 mm

24 mm

24 mm

CMOS

1.2 V

.4 mm

S-PQFP-G216

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.