Infineon Technologies Other Function uPs,uCs & Peripheral ICs 1,980

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

CY8C4147AZE-S265

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.8 V

125 Cel

-40 Cel

QUAD

1.6 mm

10 mm

10 mm

CMOS

3.3 V

.5 mm

S-PQFP-G64

CY8C4124LQS-S423

Infineon Technologies

PROGRAMMABLE SoC

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

1.89 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

1.71 V

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.6 mm

6 mm

6 mm

CMOS

1.8 V

.5 mm

S-XQCC-N40

3

e4

SLE66CL80PE-C

Infineon Technologies

OTHER

1.8/5

DIE OR CHIP

85 Cel

-25 Cel

CMOS

Other Microprocessor ICs

Not Qualified

CY8C4147AZA-S455T

Infineon Technologies

PSoC

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.8 V

85 Cel

-40 Cel

PURE TIN

QUAD

1.6 mm

10 mm

10 mm

CMOS

3.3 V

.5 mm

S-PQFP-G64

3

CY8C4014LQA-422Z

Infineon Technologies

PROGRAMMABLE SoC

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

1.71 V

85 Cel

-40 Cel

QUAD

.6 mm

4 mm

4 mm

CMOS

3.3 V

.5 mm

S-XQCC-N24

3

CY8C4147AZA-S255

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.8 V

85 Cel

-40 Cel

PURE TIN

QUAD

1.6 mm

10 mm

10 mm

CMOS

3.3 V

.5 mm

S-PQFP-G64

3

CY8C4147LQE-S283

Infineon Technologies

PROGRAMMABLE SoC

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

1.8 V

125 Cel

-40 Cel

QUAD

.6 mm

6 mm

6 mm

CMOS

3.3 V

.5 mm

S-XQCC-N40

SLE66C682PEM5

Infineon Technologies

MICROPROCESSOR CIRCUIT

CY8C4247AZS-M483

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1.89 V

AEC-Q100

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

1.71 V

105 Cel

-40 Cel

PURE TIN

QUAD

1.6 mm

7 mm

7 mm

CMOS

1.8 V

.5 mm

S-PQFP-G48

3

CY8C4126LQS-S453T

Infineon Technologies

PSoC

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

1.8 V

105 Cel

-40 Cel

QUAD

.6 mm

6 mm

6 mm

CMOS

3.3 V

.5 mm

S-XQCC-N40

CY8C624AFNI-S2D43

Infineon Technologies

PROGRAMMABLE SoC

PSB50702

Infineon Technologies

CY8C4147LQE-S243T

Infineon Technologies

PSoC

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

1.8 V

125 Cel

-40 Cel

QUAD

.6 mm

6 mm

6 mm

CMOS

3.3 V

.5 mm

S-XQCC-N40

SLE66CLX640P-M8.4

Infineon Technologies

CY8C4147LQE-S453T

Infineon Technologies

PSoC

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

1.8 V

125 Cel

-40 Cel

QUAD

.6 mm

6 mm

6 mm

CMOS

3.3 V

.5 mm

S-XQCC-N40

SLE6636EC

Infineon Technologies

OTHER

5

DIE OR CHIP

80 Cel

-40 Cel

CMOS

5 V

Other Microprocessor ICs

Not Qualified

CY8C4146LQE-S253T

Infineon Technologies

PSoC

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

1.8 V

125 Cel

-40 Cel

QUAD

.6 mm

6 mm

6 mm

CMOS

3.3 V

.5 mm

S-XQCC-N40

CY8C4125LQA-S413

Infineon Technologies

PROGRAMMABLE SoC

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

1.89 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.27SQ,20

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.9 mm

7 mm

7 mm

CMOS

1.8 V

.5 mm

S-XQCC-N40

3

e4

CY8C4124LQE-S423

Infineon Technologies

PROGRAMMABLE SoC

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

1.89 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

1.71 V

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.6 mm

6 mm

6 mm

CMOS

1.8 V

.5 mm

S-XQCC-N40

3

e4

CY8C4147LQE-S453

Infineon Technologies

PROGRAMMABLE SoC

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

1.8 V

125 Cel

-40 Cel

QUAD

.6 mm

6 mm

6 mm

CMOS

3.3 V

.5 mm

S-XQCC-N40

CY8C4127LQS-S453T

Infineon Technologies

PSoC

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

1.8 V

105 Cel

-40 Cel

QUAD

.6 mm

6 mm

6 mm

CMOS

3.3 V

.5 mm

S-XQCC-N40

CY8C4146LQS-S243

Infineon Technologies

PROGRAMMABLE SoC

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

1.8 V

105 Cel

-40 Cel

QUAD

.6 mm

6 mm

6 mm

CMOS

3.3 V

.5 mm

S-XQCC-N40

CY8C4147AZA-S275

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.8 V

85 Cel

-40 Cel

PURE TIN

QUAD

1.6 mm

10 mm

10 mm

CMOS

3.3 V

.5 mm

S-PQFP-G64

3

CY8C4147AZS-S245T

Infineon Technologies

PSoC

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.8 V

105 Cel

-40 Cel

PURE TIN

QUAD

1.6 mm

10 mm

10 mm

CMOS

3.3 V

.5 mm

S-PQFP-G64

3

C161U-LM

Infineon Technologies

CY8C4127AZA-S445

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.8 V

85 Cel

-40 Cel

PURE TIN

QUAD

1.6 mm

10 mm

10 mm

CMOS

3.3 V

.5 mm

S-PQFP-G64

3

CY8C4245AZA-M445

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.8 V

85 Cel

-40 Cel

PURE TIN

QUAD

1.6 mm

10 mm

10 mm

CMOS

3 V

.5 mm

S-PQFP-G64

3

CY8C6016BZI-F04

Infineon Technologies

PROGRAMMABLE SoC

BALL

124

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA124,13X13,25

1.7 V

85 Cel

-40 Cel

BOTTOM

1 mm

9 mm

9 mm

CMOS

1.8 V

.65 mm

S-PBGA-B124

3

CY8C4146AZA-S455T

Infineon Technologies

PSoC

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.8 V

85 Cel

-40 Cel

PURE TIN

QUAD

1.6 mm

10 mm

10 mm

CMOS

3.3 V

.5 mm

S-PQFP-G64

3

CY8C4127AZE-S455

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.8 V

125 Cel

-40 Cel

QUAD

1.6 mm

10 mm

10 mm

CMOS

3.3 V

.5 mm

S-PQFP-G64

PEF20532-FV1.2

Infineon Technologies

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

3.3

FLATPACK

QFP100,.63SQ,20

85 Cel

-40 Cel

QUAD

CMOS

50 mA

3.3 V

Other uPs/uCs/Peripheral ICs

.5 mm

S-PQFP-G100

Not Qualified

SLE76CF3201PC

Infineon Technologies

OTHER

1.8/5

DIE OR CHIP

85 Cel

-25 Cel

CMOS

Other Microprocessor ICs

Not Qualified

CY8C4127AZS-S455T

Infineon Technologies

PSoC

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.8 V

105 Cel

-40 Cel

PURE TIN

QUAD

1.6 mm

10 mm

10 mm

CMOS

3.3 V

.5 mm

S-PQFP-G64

3

CY8C6136FDI-F42

Infineon Technologies

PROGRAMMABLE SoC

BALL

80

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA80,11X15,14

1.7 V

85 Cel

-40 Cel

BOTTOM

.467 mm

3.19 mm

3.676 mm

CMOS

1.8 V

.35 mm

R-PBGA-B80

CY8C6036BZI-F04

Infineon Technologies

PROGRAMMABLE SoC

BALL

124

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA124,13X13,25

1.7 V

85 Cel

-40 Cel

BOTTOM

1 mm

9 mm

9 mm

CMOS

1.8 V

.65 mm

S-PBGA-B124

3

ADM5120P

Infineon Technologies

CY8C4127AZS-M485

Infineon Technologies

PSoC

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.71 V

105 Cel

-40 Cel

PURE TIN

QUAD

1.6 mm

10 mm

10 mm

CMOS

3.3 V

.5 mm

S-PQFP-G64

3

SLE66CX680PEC

Infineon Technologies

MICROPROCESSOR CIRCUIT

CY8C6248AZI-S2D14

Infineon Technologies

PROGRAMMABLE SoC

PURE TIN

3

SLE66C46PEC

Infineon Technologies

OTHER

1.8/5

DIE OR CHIP

85 Cel

-25 Cel

CMOS

Other Microprocessor ICs

Not Qualified

CY8C4147LQE-S293

Infineon Technologies

PROGRAMMABLE SoC

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

1.8 V

125 Cel

-40 Cel

QUAD

.6 mm

6 mm

6 mm

CMOS

3.3 V

.5 mm

S-XQCC-N40

CY8C4125PVE-S432

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1.89 V

AEC-Q100

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

1.71 V

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2 mm

5.3 mm

10.2 mm

CMOS

1.8 V

.65 mm

R-PDSO-G28

3

e4

CY8C4147LQA-S253T

Infineon Technologies

PSoC

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

1.8 V

85 Cel

-40 Cel

QUAD

.6 mm

6 mm

6 mm

CMOS

3.3 V

.5 mm

S-XQCC-N40

CY8C4147AZS-S285

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.8 V

105 Cel

-40 Cel

PURE TIN

QUAD

1.6 mm

10 mm

10 mm

CMOS

3.3 V

.5 mm

S-PQFP-G64

3

IR3521MPBF

Infineon Technologies

MICROPROCESSOR CIRCUIT

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

QUAD

.9 mm

5 mm

5 mm

CMOS

.5 mm

S-XQCC-N32

Not Qualified

CY8C4147AZA-S475

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.8 V

85 Cel

-40 Cel

PURE TIN

QUAD

1.6 mm

10 mm

10 mm

CMOS

3.3 V

.5 mm

S-PQFP-G64

3

CY8C4147LQS-S463

Infineon Technologies

PROGRAMMABLE SoC

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

1.8 V

105 Cel

-40 Cel

QUAD

.6 mm

6 mm

6 mm

CMOS

3.3 V

.5 mm

S-XQCC-N40

SLE66CLX1440PE(M/S)-C

Infineon Technologies

OTHER

1.8/5

DIE OR CHIP

85 Cel

-25 Cel

CMOS

Other Microprocessor ICs

Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.