Micron Technology Other Function uPs,uCs & Peripheral ICs 27

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

MTFC4GLDDQ-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

100

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

GRID ARRAY, LOW PROFILE

2.7 V

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1.4 mm

14 mm

30

260

18 mm

CMOS

3.3 V

1 mm

R-PBGA-B100

e1

MTFC4GMDEA-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.95 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.65 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

.8 mm

11.5 mm

IT ALSO OPERATES AT 3.3 VOLTS

13 mm

CMOS

1.8 V

.5 mm

R-PBGA-B153

e1

MTFC4GMDEA-4MIT/TR

Micron Technology

MICROPROCESSOR CIRCUIT

TIN SILVER COPPER

MTFC8GLVEA-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.95 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.65 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

.8 mm

11.5 mm

IT ALSO OPERATES AT 3.3 VOLTS

13 mm

CMOS

1.8 V

.5 mm

R-PBGA-B153

e1

MTFC8GLDEA-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.95 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.65 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

.8 mm

11.5 mm

IT ALSO OPERATES AT 3.3 VOLTS

13 mm

CMOS

1.8 V

.5 mm

R-PBGA-B153

e1

MTFC4GMVEA-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.95 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.65 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

.8 mm

11.5 mm

IT ALSO OPERATES AT 3.3 VOLTS

13 mm

CMOS

1.8 V

.5 mm

R-PBGA-B153

e1

MTFC16GJDDQ-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

100

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

GRID ARRAY, LOW PROFILE

2.7 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

14 mm

30

260

18 mm

CMOS

3.3 V

1 mm

R-PBGA-B100

e1

MTFC64GJDDN-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

169

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.95 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.65 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

14 mm

IT ALSO OPERATES AT 3.3 VOLTS

18 mm

CMOS

1.8 V

.5 mm

R-PBGA-B169

e1

MTFC8GLDDQ-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

100

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

GRID ARRAY, LOW PROFILE

2.7 V

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1.4 mm

14 mm

30

260

18 mm

CMOS

3.3 V

1 mm

R-PBGA-B100

e1

MTFC8GLCDM-1MWT

Micron Technology

MICROPROCESSOR CIRCUIT

OTHER

BALL

153

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.95 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.65 V

85 Cel

-25 Cel

BOTTOM

1.2 mm

11.5 mm

IT ALSO REQUIRES 2.7V TO 3.6V FOR NAND FLASH POWER SUPPLY

30

260

13 mm

CMOS

1.8 V

.5 mm

R-PBGA-B153

MTFC16GJGDQ-AITZ

Micron Technology

MICROPROCESSOR CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

MTFC64GJVDN-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

169

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.95 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.65 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

14 mm

IT ALSO OPERATES AT 3.3 VOLTS

18 mm

CMOS

1.8 V

.5 mm

R-PBGA-B169

e1

MT5TL4L32T-90IT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE

3 V

85 Cel

-40 Cel

QUAD

1.6 mm

14 mm

20 mm

CMOS

3.3 V

.65 mm

R-PQFP-G100

Not Qualified

MT5TL4L32T-70IT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE

3 V

85 Cel

-40 Cel

QUAD

1.6 mm

14 mm

20 mm

CMOS

3.3 V

.65 mm

R-PQFP-G100

Not Qualified

MT5TL8L32T-40IT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE

3 V

85 Cel

-40 Cel

QUAD

1.6 mm

14 mm

20 mm

CMOS

3.3 V

.65 mm

R-PQFP-G100

Not Qualified

MT75L8L32MLQ-90IT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE

3 V

85 Cel

-40 Cel

TIN LEAD

QUAD

1.6 mm

14 mm

20 mm

CMOS

3.3 V

.65 mm

R-PQFP-G100

Not Qualified

e0

MT5TL8L32T-70IT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE

3 V

85 Cel

-40 Cel

QUAD

1.6 mm

14 mm

20 mm

CMOS

3.3 V

.65 mm

R-PQFP-G100

Not Qualified

MT5TL8L32T-50IT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE

3 V

85 Cel

-40 Cel

QUAD

1.6 mm

14 mm

20 mm

CMOS

3.3 V

.65 mm

R-PQFP-G100

Not Qualified

MTFC32GJDED-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

169

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.95 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.65 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1 mm

14 mm

IT ALSO OPERATES AT 3.3 VOLTS

18 mm

CMOS

1.8 V

.5 mm

R-PBGA-B169

e1

MTFC4GGQDI-IT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

169

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

GRID ARRAY, THIN PROFILE, FINE PITCH

2.7 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.2 mm

12 mm

ALSO OPERATES BETWEEN 1.65 TO 1.95 V

16 mm

CMOS

.5 mm

R-PBGA-B169

Not Qualified

e1

MTFC4GMCDM-1MWTES

Micron Technology

MICROPROCESSOR CIRCUIT

OTHER

BALL

153

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.95 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.65 V

85 Cel

-25 Cel

BOTTOM

1.2 mm

11.5 mm

IT ALSO REQUIRES 2.7V TO 3.6V FOR NAND FLASH POWER SUPPLY

30

260

13 mm

CMOS

1.8 V

.5 mm

R-PBGA-B153

MTFC32GJGDQ-AITZ

Micron Technology

MICROPROCESSOR CIRCUIT

MTFC8GLGDQ-AITZ

Micron Technology

MICROPROCESSOR CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

MTFC4GMCDM-1MWT

Micron Technology

MICROPROCESSOR CIRCUIT

OTHER

BALL

153

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.95 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.65 V

85 Cel

-25 Cel

BOTTOM

1.2 mm

11.5 mm

IT ALSO REQUIRES 2.7V TO 3.6V FOR NAND FLASH POWER SUPPLY

30

260

13 mm

CMOS

1.8 V

.5 mm

R-PBGA-B153

MTFC8GACAANA-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

TIN SILVER COPPER

30

260

CMOS

e1

MTFC8GLCDM-1MWTES

Micron Technology

MICROPROCESSOR CIRCUIT

OTHER

BALL

153

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.95 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.65 V

85 Cel

-25 Cel

BOTTOM

1.2 mm

11.5 mm

IT ALSO REQUIRES 2.7V TO 3.6V FOR NAND FLASH POWER SUPPLY

30

260

13 mm

CMOS

1.8 V

.5 mm

R-PBGA-B153

MTFC32GJVED-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

169

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.95 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.65 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1 mm

14 mm

IT ALSO OPERATES AT 3.3 VOLTS

18 mm

CMOS

1.8 V

.5 mm

R-PBGA-B169

e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.