Samsung Other Function uPs,uCs & Peripheral ICs 39

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

KS6035B

Samsung

MICROPROCESSOR CIRCUIT

NO LEAD

UNSPECIFIED

UNSPECIFIED

YES

UNCASED CHIP

UPPER

CMOS

3 V

X-XUUC-N

Not Qualified

S5L8700X

Samsung

S3C4510B01-QE80

Samsung

COMMERCIAL

GULL WING

208

QFP

SQUARE

PLASTIC/EPOXY

YES

3.3

FLATPACK

QFP208,1.2SQ,20

70 Cel

0 Cel

QUAD

230 mA

3.3 V

Other Microprocessor ICs

.5 mm

S-PQFP-G208

Not Qualified

S3FC9CEX-NC

Samsung

S3FC9DEX-W0

Samsung

KS85C30-2IP

Samsung

INDUSTRIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP40,.6

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T40

Not Qualified

e0

S5PC100X66-YA40

Samsung

S3C4510B01-QER0

Samsung

COMMERCIAL

GULL WING

208

QFP

SQUARE

PLASTIC/EPOXY

YES

3.3

FLATPACK

QFP208,1.2SQ,20

70 Cel

0 Cel

QUAD

230 mA

3.3 V

Other Microprocessor ICs

.5 mm

S-PQFP-G208

Not Qualified

KS6626

Samsung

MICROPROCESSOR CIRCUIT

NO LEAD

UNSPECIFIED

UNSPECIFIED

YES

UNCASED CHIP

UPPER

CMOS

1.5 V

X-XUUC-N

Not Qualified

S3FC9DEX-NC

Samsung

KS6038

Samsung

MICROPROCESSOR CIRCUIT

CMOS

3 V

Not Qualified

S3FS92FX-NC

Samsung

KS85C30-10CL

Samsung

COMMERCIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC44,.7SQ

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

30 mA

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J44

Not Qualified

e0

KS6278

Samsung

MICROPROCESSOR CIRCUIT

CMOS

1.5 V

Not Qualified

S3F49DAXXX-KT

Samsung

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

64

QCCN

SQUARE

PLASTIC/EPOXY

YES

1.8,3.3

CHIP CARRIER

LCC64,.35SQ,20

85 Cel

-25 Cel

QUAD

CMOS

Other Microprocessor ICs

.5 mm

S-PQCC-N64

Not Qualified

KS85C30-2IL

Samsung

INDUSTRIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC44,.7SQ

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J44

Not Qualified

e0

KS85C30-6CP

Samsung

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP40,.6

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

30 mA

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T40

Not Qualified

e0

KS85C30-8CL

Samsung

COMMERCIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC44,.7SQ

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

30 mA

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J44

Not Qualified

e0

KS85C30-2CP

Samsung

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP40,.6

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T40

Not Qualified

e0

SIP007AFS001

Samsung

MICROPROCESSOR CIRCUIT

COMMERCIAL

UNSPECIFIED

271

RECTANGULAR

UNSPECIFIED

NO

5 V

MICROELECTRONIC ASSEMBLY

3.7 V

70 Cel

0 Cel

UNSPECIFIED

3.45 mm

36 mm

49 mm

CMOS

4.2 V

1.13 mm

R-XXMA-X271

KS6078E

Samsung

MICROPROCESSOR CIRCUIT

CMOS

1.5 V

Not Qualified

S3FS92FX-W0

Samsung

KS6034C

Samsung

MICROPROCESSOR CIRCUIT

TIN LEAD

CMOS

3 V

Not Qualified

e0

S3CI9E0X01

Samsung

COMMERCIAL

BALL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8/2.5

GRID ARRAY, FINE PITCH

BGA64,10X10,20

70 Cel

0 Cel

BOTTOM

Other Microprocessor ICs

.5 mm

S-PBGA-B64

Not Qualified

KS85C30-8CP

Samsung

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP40,.6

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

30 mA

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T40

Not Qualified

e0

KS85C30-2CL

Samsung

COMMERCIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC44,.7SQ

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J44

Not Qualified

e0

KS85C30-6CL

Samsung

COMMERCIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC44,.7SQ

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

30 mA

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J44

Not Qualified

e0

S5PC100X66-LA40

Samsung

S5PC100X01-LA40

Samsung

S3C2413XXX-YO8N

Samsung

S5PC100X66-2A40

Samsung

SC32442

Samsung

KS85C30-10CP

Samsung

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP40,.6

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

30 mA

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T40

Not Qualified

e0

S3C2413XXX-YO80

Samsung

KS0152

Samsung

MZ-V7E500BW

Samsung

MICROPROCESSOR CIRCUIT

MZ-V7E51T0BW

Samsung

MICROPROCESSOR CIRCUIT

MZ-V7E52T0BW

Samsung

MICROPROCESSOR CIRCUIT

MZ-V7E250BW

Samsung

MICROPROCESSOR CIRCUIT

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.