Texas Instruments Other Function uPs,uCs & Peripheral ICs 1,456

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

TL331DBVR

Texas Instruments

DRA746BPGABCQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

23 mm

64

32 MHz

30

250

23 mm

CMOS

1.15 V

CAN; I2C; SPI; UART; USB

.8 mm

S-PBGA-B760

3

1500 rpm

e1

CC2543RHMR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

2 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.9 mm

5 mm

30

260

5 mm

CMOS

3 V

Other Microprocessor ICs

.5 mm

S-PQCC-N32

3

Not Qualified

e4

TMX320DM6446ZWT

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL EXTENDED

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

85 Cel

0 Cel

BOTTOM

1.4 mm

16384

16 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

16 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B361

Not Qualified

SN54ACT8999JT

Texas Instruments

MICROPROCESSOR CIRCUIT

MILITARY

THROUGH-HOLE

28

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

5.5 V

5

IN-LINE

DIP28,.6

4.5 V

125 Cel

-55 Cel

DUAL

5.08 mm

7.62 mm

NOT SPECIFIED

NOT SPECIFIED

36.83 mm

CMOS

5 V

Other Microprocessor ICs

2.54 mm

R-CDIP-T28

Not Qualified

DRA751BLGABCRQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

BOTTOM

2.96 mm

23 mm

23 mm

CMOS

1.15 V

.8 mm

S-PBGA-B760

TMX320DM6441DZWT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

316

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.1 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1 V

85 Cel

0 Cel

BOTTOM

1.4 mm

16 mm

ALSO OPERATES AT 1.2 V AND 1.1 V TYP

16 mm

CMOS

1.05 V

.8 mm

S-PBGA-B316

CP3SP33SMSX/NOPB

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

224

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.98 V

16

1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA224,15X15,32

1.62 V

85 Cel

CR16C

-40 Cel

TIN LEAD

BOTTOM

1.4 mm

13 mm

32

30

260

13 mm

32768

CMOS

200 mA

1.8 V

Microcontrollers

I2C; I2S; SPI; UART; USB

.8 mm

S-PBGA-B224

3

Not Qualified

96 rpm

e0

SN74BCT2423AFN

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.25 V

CHIP CARRIER

4.75 V

70 Cel

0 Cel

QUAD

4.57 mm

24.2316 mm

NOT SPECIFIED

NOT SPECIFIED

24.2316 mm

BICMOS

5 V

1.27 mm

S-PQCC-J68

Not Qualified

SM320DM6446AZWTA

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

20480

16 mm

ITS ALSO OPERATES AT 1.8/3.3 V SUPPLY

48

27 MHz

30

260

16 mm

CMOS

1.2 V

Digital Signal Processors

I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

e1

AWR1443FQIGABLQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

161

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

AEC-Q100

GRID ARRAY, THIN PROFILE, FINE PITCH

1.14 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.17 mm

10.4 mm

30

260

10.4 mm

589824

CMOS

1.2 V

.65 mm

S-PBGA-B161

3

e1

SN74ABT8996DWR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

5

SMALL OUTLINE

SOP24,.4

4.5 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2.65 mm

7.5 mm

30

260

15.4 mm

BICMOS

18 mA

5 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G24

1

Not Qualified

e4

TMS9902JDL

Texas Instruments

COMMERCIAL

THROUGH-HOLE

18

DIP

RECTANGULAR

CERAMIC

NO

IN-LINE

DIP18,.3

70 Cel

0 Cel

DUAL

MOS

Other Microprocessor ICs

2.54 mm

R-XDIP-T18

Not Qualified

TACT83441

Texas Instruments

COMMERCIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

5

FLATPACK

QFP100,1.1SQ

70 Cel

0 Cel

QUAD

CMOS

.1 mA

5 V

Other Microprocessor ICs

.635 mm

S-PQFP-G100

Not Qualified

SNJ54ACT8999JT

Texas Instruments

MICROPROCESSOR CIRCUIT

MILITARY

THROUGH-HOLE

28

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

5.5 V

38535Q/M;38534H;883B

5

IN-LINE

DIP28,.3

4.5 V

125 Cel

-55 Cel

DUAL

5.08 mm

7.62 mm

NOT SPECIFIED

NOT SPECIFIED

36.83 mm

CMOS

5 V

Other Microprocessor ICs

2.54 mm

R-CDIP-T28

Not Qualified

AWR1642ABIGABLRQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

161

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

AEC-Q100

GRID ARRAY, THIN PROFILE, FINE PITCH

1.14 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.17 mm

10.4 mm

30

260

10.4 mm

1572864

CMOS

1.2 V

.65 mm

S-PBGA-B161

3

e1

SC3900A

Texas Instruments

5962-9323901Q3X

Texas Instruments

MICROPROCESSOR CIRCUIT

MILITARY

NO LEAD

28

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

MIL-PRF-38535 Class Q

CHIP CARRIER

4.5 V

125 Cel

-55 Cel

QUAD

2.03 mm

11.43 mm

0

NOT SPECIFIED

NOT SPECIFIED

11.43 mm

CMOS

5 V

1.27 mm

S-CQCC-N28

Qualified

SN74ACT8990FN

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

5

CHIP CARRIER

LDCC44,.7SQ

4.5 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

4.57 mm

16.5862 mm

16

30

260

16.5862 mm

CMOS

.45 mA

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J44

3

Not Qualified

e4

TMS9902A-40NL

Texas Instruments

COMMERCIAL

THROUGH-HOLE

18

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

IN-LINE

DIP18,.3

70 Cel

0 Cel

DUAL

MOS

Other Microprocessor ICs

2.54 mm

R-PDIP-T18

Not Qualified

SN74LS612JDP4

Texas Instruments

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

CERAMIC

NO

5

IN-LINE

DIP40,.6

70 Cel

0 Cel

DUAL

TTL

5 V

Other Microprocessor ICs

2.54 mm

R-XDIP-T40

DM505LRBABFR

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

367

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.11 V

AEC-Q100

GRID ARRAY, HEAT SINK/SLUG

1.02 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.82 mm

15 mm

32

32 MHz

30

250

15 mm

CMOS

1.06 V

I2C; SPI; UART

.65 mm

S-PBGA-B367

3

e1

SN74AS856NTP1

Texas Instruments

COMMERCIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

IN-LINE

DIP24,.3

70 Cel

0 Cel

DUAL

TTL

Other uPs/uCs/Peripheral ICs

2.54 mm

R-PDIP-T24

Not Qualified

SN74LS610NP1

Texas Instruments

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

IN-LINE

DIP40,.6

70 Cel

0 Cel

DUAL

TTL

Other Microprocessor ICs

2.54 mm

R-PDIP-T40

Not Qualified

SN74AS856DWP3

Texas Instruments

COMMERCIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

SMALL OUTLINE

SOP24,.4

70 Cel

0 Cel

DUAL

TTL

Other uPs/uCs/Peripheral ICs

1.27 mm

R-PDSO-G24

TNETC4800ZDWGU

Texas Instruments

MICROPROCESSOR CIRCUIT

TIN SILVER COPPER

30

250

4

e1

SNJ54ABT32318HT

Texas Instruments

DRA829VMTGBALFRQ1

Texas Instruments

SoC

BALL

827

FBGA

SQUARE

PLASTIC/EPOXY

YES

.84 V

AEC-Q100

GRID ARRAY, FINE PITCH

BGA827,29X29,32

.76 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.8 mm

24 mm

250

24 mm

CMOS

.8 V

.8 mm

S-PBGA-B827

3

2000 rpm

e1

DRA821U4TCBALMQ1

Texas Instruments

SoC

BALL

433

FBGA

SQUARE

PLASTIC/EPOXY

YES

.84 V

AEC-Q100

GRID ARRAY, FINE PITCH

BGA433,21X21,32

.76 V

125 Cel

-40 Cel

BOTTOM

2.57 mm

17.2 mm

250

17.2 mm

CMOS

.8 V

.8 mm

S-PBGA-B433

3

2000 rpm

XAM62A74AUMHAAMB

Texas Instruments

SoC

BALL

484

FBGA

SQUARE

PLASTIC/EPOXY

YES

.79 V

GRID ARRAY, FINE PITCH

BGA484,22X22,32

.715 V

105 Cel

-40 Cel

BOTTOM

2.556 mm

18 mm

18 mm

CMOS

.75 V

.8 mm

S-PBGA-B484

AM69A98ATNGHAALYR

Texas Instruments

SoC

BALL

1414

FBGA

SQUARE

PLASTIC/EPOXY

YES

.84 V

GRID ARRAY, FINE PITCH

BGA1414,38X38,32

.76 V

105 Cel

-40 Cel

BOTTOM

3.341 mm

31 mm

31 mm

CMOS

.8 V

.8 mm

S-PBGA-B1414

AM69A94ATMGHAALYR

Texas Instruments

SoC

BALL

1414

FBGA

SQUARE

PLASTIC/EPOXY

YES

.84 V

GRID ARRAY, FINE PITCH

BGA1414,38X38,32

.76 V

105 Cel

-40 Cel

BOTTOM

3.341 mm

31 mm

31 mm

CMOS

.8 V

.8 mm

S-PBGA-B1414

XAM62A74AUMHIAMB

Texas Instruments

SoC

BALL

484

FBGA

SQUARE

PLASTIC/EPOXY

YES

.79 V

GRID ARRAY, FINE PITCH

BGA484,22X22,32

.715 V

125 Cel

-40 Cel

BOTTOM

2.556 mm

18 mm

18 mm

CMOS

.75 V

.8 mm

S-PBGA-B484

XAM69A98ATNGHAALY

Texas Instruments

SoC

BALL

1414

FBGA

SQUARE

PLASTIC/EPOXY

YES

.84 V

GRID ARRAY, FINE PITCH

BGA1414,38X38,32

.76 V

105 Cel

-40 Cel

BOTTOM

3.341 mm

31 mm

31 mm

CMOS

.8 V

.8 mm

S-PBGA-B1414

XAM62A34ASMHIAMB

Texas Instruments

SoC

BALL

484

FBGA

SQUARE

PLASTIC/EPOXY

YES

.79 V

GRID ARRAY, FINE PITCH

BGA484,22X22,32

.715 V

125 Cel

-40 Cel

BOTTOM

2.556 mm

18 mm

18 mm

CMOS

.75 V

.8 mm

S-PBGA-B484

XAM62A34ASMHAAMB

Texas Instruments

SoC

BALL

484

FBGA

SQUARE

PLASTIC/EPOXY

YES

.79 V

GRID ARRAY, FINE PITCH

BGA484,22X22,32

.715 V

105 Cel

-40 Cel

BOTTOM

2.556 mm

18 mm

18 mm

CMOS

.75 V

.8 mm

S-PBGA-B484

AM69A54ANMGHAALYR

Texas Instruments

SoC

BALL

1414

FBGA

SQUARE

PLASTIC/EPOXY

YES

.84 V

GRID ARRAY, FINE PITCH

BGA1414,38X38,32

.76 V

105 Cel

-40 Cel

BOTTOM

3.341 mm

31 mm

31 mm

CMOS

.8 V

.8 mm

S-PBGA-B1414

AM69A34AHMGHAALYR

Texas Instruments

SoC

BALL

1414

FBGA

SQUARE

PLASTIC/EPOXY

YES

.84 V

GRID ARRAY, FINE PITCH

BGA1414,38X38,32

.76 V

105 Cel

-40 Cel

BOTTOM

3.341 mm

31 mm

31 mm

CMOS

.8 V

.8 mm

S-PBGA-B1414

AM69A78ATMGHAALYR

Texas Instruments

SoC

BALL

1414

FBGA

SQUARE

PLASTIC/EPOXY

YES

.84 V

GRID ARRAY, FINE PITCH

BGA1414,38X38,32

.76 V

105 Cel

-40 Cel

BOTTOM

3.341 mm

31 mm

31 mm

CMOS

.8 V

.8 mm

S-PBGA-B1414

SN74LS610NP3

Texas Instruments

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

IN-LINE

DIP40,.6

70 Cel

0 Cel

DUAL

TTL

Other Microprocessor ICs

2.54 mm

R-PDIP-T40

SNJ54LVT8980JT

Texas Instruments

MICROPROCESSOR CIRCUIT

MILITARY

THROUGH-HOLE

24

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

3.6 V

38535Q/M;38534H;883B

3.3

IN-LINE

DIP24,.3

2.7 V

125 Cel

-55 Cel

DUAL

5.08 mm

7.62 mm

32.005 mm

CMOS

7 mA

3.3 V

Other Microprocessor ICs

2.54 mm

R-GDIP-T24

Not Qualified

SN74LS613NP3

Texas Instruments

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

IN-LINE

DIP40,.6

70 Cel

0 Cel

DUAL

TTL

Other uPs/uCs/Peripheral ICs

2.54 mm

R-PDIP-T40

TSB83AA22AZAJ

Texas Instruments

TIN SILVER COPPER

30

260

3

e1

TMS9902NL

Texas Instruments

COMMERCIAL

THROUGH-HOLE

18

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

IN-LINE

DIP18,.3

70 Cel

0 Cel

DUAL

MOS

Other uPs/uCs/Peripheral ICs

2.54 mm

R-PDIP-T18

Not Qualified

TMS9903JL

Texas Instruments

COMMERCIAL

THROUGH-HOLE

20

DIP

RECTANGULAR

CERAMIC

NO

IN-LINE

DIP20,.3

70 Cel

0 Cel

DUAL

MOS

Other Microprocessor ICs

2.54 mm

R-XDIP-T20

Not Qualified

DRA785BSGABFRQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

367

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.11 V

AEC-Q100

GRID ARRAY, FINE PITCH

BGA167,22X22,26

1.02 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.82 mm

15 mm

32

32 MHz

30

250

15 mm

CMOS

1.06 V

I2C(2), SPI(4), UART(3),

.65 mm

S-PBGA-B367

3

e1

SN54ACT8990GB

Texas Instruments

MICROPROCESSOR CIRCUIT

MILITARY

PIN/PEG

68

PGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

NO

5.5 V

GRID ARRAY

4.5 V

125 Cel

-55 Cel

PERPENDICULAR

CMOS

.45 mA

5 V

S-CPGA-P68

Not Qualified

SN74AS877DW3

Texas Instruments

COMMERCIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

SMALL OUTLINE

SOP24,.4

70 Cel

0 Cel

DUAL

TTL

Other uPs/uCs/Peripheral ICs

1.27 mm

R-PDSO-G24

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.