Texas Instruments Other Function uPs,uCs & Peripheral ICs 1,456

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Nominal Supply Voltage	PWM Channels	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
P82B715DR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	12 V						SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		1.75 mm			3.9 mm		VCCB(Min)(V) is 3, VCCB(Max)(V) is 12		0	.4 MHz	NOT SPECIFIED	260	4.9 mm		BIPOLAR		5 V					I2C	1.27 mm		R-PDSO-G8	1	Not Qualified		e4
PGA460TPWQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	28 V	AEC-Q100					SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.2 mm			4.4 mm		ALSO OPERATES AT 6V-15V FOR TRANSFORMER TOPOLOGY		0		30	260	5 mm		CMOS		12 V					SPI; UART; USART	.65 mm		R-PDSO-G16	2			e4
XTDA4VHXXXGAALY	Texas Instruments	SoC		BALL	1414	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V						GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA1414,38X38,32	.76 V	70 Cel		0 Cel			BOTTOM		3.341 mm			31 mm								31 mm		CMOS		.8 V						.8 mm		S-PBGA-B1414
P82B715DRG4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	12 V						SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		1.75 mm			3.9 mm		VCCB(Min)(V) is 3, VCCB(Max)(V) is 12		0	.4 MHz	NOT SPECIFIED	260	4.9 mm		BIPOLAR		5 V					I2C	1.27 mm		R-PDSO-G8	1	Not Qualified		e4
TMS320DM368ZCED48F	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V				32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		8192	13 mm				32		30	260	13 mm		CMOS		1.35 V		Digital Signal Processors			I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
CC2541F256RHAR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm		8	6 mm			TIMER(4)	0		30	260	6 mm	8192	CMOS		3 V		Other uPs/uCs/Peripheral ICs			I2C; SPI; USART; USB	.5 mm		S-PQCC-N40	3	Not Qualified		e4		23
CC3220MODASF12MONR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED	YES	3.6 V			NO			CHIP CARRIER		2.3 V	85 Cel		-40 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.41 mm	1024000	256	20.5 mm	0		TIMER(4), WDT	0		30	260	25 mm	262144	CMOS	4-Ch 12-Bit	3.3 V	NO		I2C, I2S, SPI, UART	FLASH	I2C; I2S; SPI; UART	1.27 mm		R-XBCC-B63	3			e4	8	25
PGA460TPWRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	28 V	AEC-Q100					SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.2 mm			4.4 mm		ALSO OPERATES AT 6V-15V FOR TRANSFORMER TOPOLOGY		0		30	260	5 mm		CMOS		12 V					SPI; UART; USART	.65 mm		R-PDSO-G16	2			e4
CC1310F128RHBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			5 mm						NOT SPECIFIED	260	5 mm	28672	CMOS		3.3 V						.5 mm		S-PQCC-N32	3			e4
P82B715D	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	12 V						SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		1.75 mm			3.9 mm		VCCB(Min)(V) is 3, VCCB(Max)(V) is 12		0	.4 MHz	NOT SPECIFIED	260	4.9 mm		BIPOLAR		5 V					I2C	1.27 mm		R-PDSO-G8	1	Not Qualified		e4
PGA460TPWR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	28 V						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.2 mm			4.4 mm		ALSO OPERATES AT 6V-15V FOR TRANSFORMER TOPOLOGY		0		30	260	5 mm		CMOS		12 V					SPI; UART; USART	.65 mm		R-PDSO-G16	2			e4
TMS320DM368ZCEDF	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V				32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		8192	13 mm				32		30	260	13 mm		CMOS		1.35 V		Digital Signal Processors			I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
TMS320DM368ZCED	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V				32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		8192	13 mm				32		30	260	13 mm		CMOS		1.35 V		Digital Signal Processors			I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
CC1310F128RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			7 mm						NOT SPECIFIED	260	7 mm	28672	CMOS		3.3 V						.5 mm		S-PQCC-N48	3			e4
MSP430F67791AIPEUR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	524288	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm	32768	CMOS	6-Ch 10-Bit	3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		R-PQFP-G128	3		25 rpm	e4	8	90
AM4376BZDND100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			17 mm						30	260	17 mm		CMOS		1.325 V						.65 mm		S-PBGA-B491	3			e1
CC1310F128RGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			7 mm						30	260	7 mm	28672	CMOS		3.3 V						.5 mm		S-PQCC-N48	3			e4
P82B715DG4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	12 V						SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		1.75 mm			3.9 mm		VCCB(Min)(V) is 3, VCCB(Max)(V) is 12		0	.4 MHz	NOT SPECIFIED	260	4.9 mm		BIPOLAR		5 V					I2C	1.27 mm		R-PDSO-G8	1	Not Qualified		e4
AM6442BSEFHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V						GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		-40 Cel			BOTTOM		2.652 mm			17.2 mm		ALSO OPERATES AT 0.85V NOMINAL SUPPLY				30	250	17.2 mm		CMOS		.75 V						.8 mm		S-PBGA-B441	3		1000 rpm
AM4376BZDNA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			17 mm						30	260	17 mm		CMOS		1.325 V						.65 mm		S-PBGA-B491	3			e1
CC3200MODR1M2AMOBR	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED	YES	3.6 V			NO			CHIP CARRIER		2.3 V	70 Cel		-20 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.45 mm			17.5 mm	0			0		30	260	20.5 mm		CMOS	4-Ch 12-Bit	3.3 V	NO				I2C; SPI; UART	1.27 mm		R-XBCC-B63	3			e4		25
OMAPL138EZWTD4E	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			16 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	16 mm		CMOS		1.3 V					I2C; SPI; UART; USB	.8 mm		S-PBGA-B361	3		456 rpm	e1
TMS320DM368ZCE	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V				32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		8192	13 mm				32		30	260	13 mm		CMOS		1.35 V		Digital Signal Processors			I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
XCC1312R1F3RGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm			7 mm		DIMENSION CONSIDER BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF				30	260	7 mm		CMOS		3 V						.5 mm		S-PQCC-N48	3			e4
PGA460TPW	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	28 V						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.2 mm			4.4 mm		ALSO OPERATES AT 6V-15V FOR TRANSFORMER TOPOLOGY		0		30	260	5 mm		CMOS		12 V					SPI; UART; USART	.65 mm		R-PDSO-G16	2			e4
CC1310F128RSMR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	NICKEL PALLADIUM GOLD SILVER		QUAD		1 mm			4 mm						30	260	4 mm	28672	CMOS		3.3 V						.4 mm		S-PQCC-N32	3			e4
CC1312R1F3RGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm			7 mm		DIMENSION CONSIDER BASED ON LINKHTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF				30	260	7 mm	81920	CMOS		3 V						.5 mm		S-PQCC-N48	3			e4		30
CC1310F64RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			7 mm						NOT SPECIFIED	260	7 mm	28672	CMOS		3.3 V						.5 mm		S-PQCC-N48	3			e4
CC1310F128RHBT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			5 mm						NOT SPECIFIED	260	5 mm	28672	CMOS		3.3 V						.5 mm		S-PQCC-N32	3			e4
MSP430F6779AIPEUR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	524288	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm	32768	CMOS	6-Ch 10-Bit	3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		R-PQFP-G128	3		25 rpm	e4	8	90
CC1310F32RSMT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			4 mm						NOT SPECIFIED	260	4 mm	28672	CMOS		3.3 V						.4 mm		S-PQCC-N32	3			e4
CC1310F128RSMT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	NICKEL PALLADIUM GOLD SILVER		QUAD		1 mm			4 mm						30	260	4 mm	28672	CMOS		3.3 V						.4 mm		S-PQCC-N32	3			e4
AM6254ATCGGAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel			BOTTOM		.89 mm			13 mm							250	13 mm		CMOS		.75 V						.5 mm		S-PBGA-B425	3		1400 rpm
CC2541F128RHAR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm		8	6 mm			TIMER(4)	0		30	260	6 mm	8192	CMOS		3 V		Other uPs/uCs/Peripheral ICs			I2C; SPI; USART; USB	.5 mm		S-PQCC-N40	3	Not Qualified		e4		23
AM6231ASGGGAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel			BOTTOM		.89 mm			13 mm							250	13 mm		CMOS		.75 V						.5 mm		S-PBGA-B425	3		1400 rpm
CC2541F128RHAT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm		8	6 mm			TIMER(4)	0		30	260	6 mm	8192	CMOS		3 V		Other uPs/uCs/Peripheral ICs			I2C; SPI; USART; USB	.5 mm		S-PQCC-N40	3	Not Qualified		e4		23
CC2541F256RHAT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm		8	6 mm			TIMER(4)	0		30	260	6 mm	8192	CMOS		3 V		Other uPs/uCs/Peripheral ICs			I2C; SPI; USART; USB	.5 mm		S-PQCC-N40	3	Not Qualified		e4		23
AM6231AKGGHHALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	95 Cel		0 Cel			BOTTOM		.89 mm			13 mm								13 mm		CMOS		.75 V						.5 mm		S-PBGA-B425
AM4378BZDND100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			17 mm						30	260	17 mm		CMOS		1.325 V						.65 mm		S-PBGA-B491	3			e1
UCD3138128PFC	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V						FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.2 mm			12 mm						30	260	12 mm		CMOS		3.3 V						.5 mm		S-PQFP-G80	3			e4
AM6234ATCGGAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel			BOTTOM		.89 mm			13 mm							250	13 mm		CMOS		.75 V						.5 mm		S-PBGA-B425	3		1400 rpm
P82B715P	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	12 V						IN-LINE		4.5 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		5.08 mm			7.62 mm		VCCB(Min)(V) is 3, VCCB(Max)(V) is 12		0	.4 MHz	NOT SPECIFIED	NOT SPECIFIED	9.81 mm		BIPOLAR		5 V					I2C	2.54 mm		R-PDIP-T8		Not Qualified		e4
OMAPL138EZWTD4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			16 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	16 mm		CMOS		1.3 V					I2C; SPI; UART; USB	.8 mm		S-PBGA-B361	3		456 rpm	e1
AM5716AABCXEA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V						GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm						30	250	23 mm		CMOS		1.15 V						.8 mm		S-PBGA-B760	3			e1
CC1312R1F3RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm			7 mm		DIMENSION CONSIDER BASED ON LINKHTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF				30	260	7 mm	81920	CMOS		3 V						.5 mm		S-PQCC-N48	3			e4		30
CC1310F64RSMR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			4 mm						NOT SPECIFIED	260	4 mm	28672	CMOS		3.3 V						.4 mm		S-PQCC-N32	3			e4
AM6252ATCGGAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel			BOTTOM		.89 mm			13 mm							250	13 mm		CMOS		.75 V						.5 mm		S-PBGA-B425	3		1400 rpm
AM6232ATCGGAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel			BOTTOM		.89 mm			13 mm							250	13 mm		CMOS		.75 V						.5 mm		S-PBGA-B425	3		1400 rpm

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.