Texas Instruments Other Function uPs,uCs & Peripheral ICs 1,456

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
CC2540TF256RHAT	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm		8	6 mm					30	260	6 mm	8192	CMOS		3 V			SPI; USART; USB	.5 mm		S-PQCC-N40	3			e4	21
DLPC900AZPC	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V				GRID ARRAY	BGA516,26X26,40	1.1 V	55 Cel		0 Cel			BOTTOM	2.42 mm			27 mm			16	20 MHz			27 mm		CMOS		1.15 V			I2C; SPI; UART; USB	1 mm		S-PBGA-B516					9
HPA01216RHAR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm			6 mm		TIMER(4)			30	260	6 mm	8192	CMOS		3 V				.5 mm		S-PQCC-N40	3			e4	23
TMS320DM365ZCEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm			13 mm			32		30	260	13 mm		CMOS		1.35 V			I2C; SPI; UART; USB	.65 mm		S-PBGA-B338	3			e1
66AK2L06XCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V				GRID ARRAY, FINE PITCH		.95 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.55 mm			25 mm					30	245	25 mm		CMOS		1.05 V				.8 mm		S-PBGA-B900	4			e1
DLPC350ZFF	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	419	BGA	SQUARE	PLASTIC/EPOXY	YES	3.465 V				GRID ARRAY		3.135 V	85 Cel		0 Cel			BOTTOM	2.36 mm			23 mm					NOT SPECIFIED	NOT SPECIFIED	23 mm		CMOS		3.3 V				1 mm		S-PBGA-B419					14
DM505MRBABF	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	2.82 mm			15 mm			32	32 MHz	30	250	15 mm		CMOS		1.06 V			I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
RF430F5978IRGCR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		32	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	2 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	32768		9 mm			0		30	260	9 mm	4096	CMOS	5.1 mA	3 V	Microcontrollers	FLASH	I2C; SPI; UART	.5 mm		S-PQCC-N64	3	Not Qualified	20 rpm	e4
UCD3138ARJAR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel		-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	YES	QUAD	1 mm			6 mm					30	260	6 mm		CMOS		3.3 V				.5 mm		S-PQCC-N40	2			e4
SN74ABT8996PWR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	4.5 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL	1.2 mm			4.4 mm					30	260	7.8 mm		BICMOS		5 V	Other Microprocessor ICs			.65 mm		R-PDSO-G24	1	Not Qualified		e4
DRA756BPGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm			23 mm			64	32 MHz	30	250	23 mm		CMOS		1.15 V			CAN; I2C; PCI; SPI; UART; USB	.8 mm		S-PBGA-B760	3		1500 rpm	e1
VCBUP7CCUT6	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	3.3 mm			19 mm					30	245	19 mm		CMOS		1.2 V				.8 mm		S-PBGA-B529	4			e1
SM32DM355GCEM216EP	Texas Instruments	MICROPROCESSOR CIRCUIT	MILITARY	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	125 Cel		-55 Cel	TIN LEAD		BOTTOM	1.3 mm		8192	13 mm			32			260	13 mm		CMOS		1.3 V	Digital Signal Processors		I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3			e0
SN74S428NP3	Texas Instruments		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO				5	IN-LINE	DIP28,.6		70 Cel		0 Cel			DUAL													BIPOLAR		5 V	Other Microprocessor ICs			2.54 mm		R-PDIP-T28
SBP9965NJ	Texas Instruments
TIM8228N	Texas Instruments		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO				5	IN-LINE	DIP28,.6		70 Cel		0 Cel			DUAL													BIPOLAR		5 V	Other uPs/uCs/Peripheral ICs			2.54 mm		R-PDIP-T28		Not Qualified
TACT83442	Texas Instruments
SN54LVT8996FKR	Texas Instruments	MICROPROCESSOR CIRCUIT	MILITARY	J BEND	28	QCCJ	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	3.6 V				CHIP CARRIER		2.7 V	125 Cel		-55 Cel			QUAD													CMOS		3 V						S-CQCC-J28		Not Qualified
PAM1806BZCE4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V						BOTTOM	1.3 mm			13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY						13 mm		CMOS		1.3 V				.65 mm		S-PBGA-B361		Not Qualified
SN74LS610N3	Texas Instruments		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO					IN-LINE	DIP40,.6		70 Cel		0 Cel			DUAL													TTL			Other Microprocessor ICs			2.54 mm		R-PDIP-T40
TMSDM6467TCUT1TAN	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V				GRID ARRAY, FINE PITCH		1.235 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	3.3 mm			19 mm					30	245	19 mm		CMOS		1.3 V				.8 mm		S-PBGA-B529	4			e1
SN74AS852JT4	Texas Instruments		COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	CERAMIC	NO					IN-LINE	DIP24,.3		70 Cel		0 Cel			DUAL													TTL			Other Microprocessor ICs			2.54 mm		R-XDIP-T24
XAM1806BZWT3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V						BOTTOM	1.4 mm			16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY						16 mm		CMOS		1.3 V				.8 mm		S-PBGA-B361		Not Qualified
SN74ALS6300DWR	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V				SMALL OUTLINE		4.75 V	70 Cel		0 Cel			DUAL	2.65 mm			7.5 mm							15.4 mm		CMOS	185 mA	5 V				1.27 mm		R-PDSO-G24		Not Qualified
DRA782BDGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY		1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	2.82 mm			15 mm			48	32 MHz	30	250	15 mm		CMOS		1.06 V			CAN; I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
TUSB2136PM	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	3 V	70 Cel		0 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm			10 mm					30	260	10 mm		CMOS	45 mA	3.3 V	Bus Controllers			.5 mm		S-PQFP-G64	3	Not Qualified		e4
TSB12LV23	Texas Instruments
CACT8997DWRG4	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			5	SMALL OUTLINE	SOP28,.4	4.5 V	70 Cel		0 Cel	NICKEL PALLADIUM GOLD		DUAL	2.65 mm			7.5 mm					30	260	17.9 mm		CMOS		5 V	Other Microprocessor ICs			1.27 mm		R-PDSO-G28	1	Not Qualified		e4
TMS9903JDL	Texas Instruments		COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	CERAMIC	NO					IN-LINE	DIP20,.3		70 Cel		0 Cel			DUAL													MOS			Other Microprocessor ICs			2.54 mm		R-XDIP-T20		Not Qualified
SN54ACT8997FK	Texas Instruments	MICROPROCESSOR CIRCUIT	MILITARY	NO LEAD	28	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	5.5 V			5	CHIP CARRIER	LCC28,.45SQ	4.5 V	125 Cel		-55 Cel			QUAD	2.03 mm			11.43 mm					NOT SPECIFIED	NOT SPECIFIED	11.43 mm		CMOS	100 mA	5 V	Other Microprocessor ICs			1.27 mm		S-CQCC-N28		Not Qualified
TFB2002BM	Texas Instruments	MICROPROCESSOR CIRCUIT	MILITARY	FLAT	256	QFF	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES					FLATPACK			125 Cel		-55 Cel			QUAD													CMOS		5 V						S-CQFP-F256		Not Qualified
SN74LS611NP1	Texas Instruments		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO					IN-LINE	DIP40,.6		70 Cel		0 Cel			DUAL													TTL			Other uPs/uCs/Peripheral ICs			2.54 mm		R-PDIP-T40		Not Qualified
DBB03AIPM	Texas Instruments																			NICKEL PALLADIUM GOLD											30	260												3			e4
UC1903Q	Texas Instruments
DM505LRBABF	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	2.82 mm			15 mm			32	32 MHz	30	250	15 mm		CMOS		1.06 V			I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
SN54ABT8996JT	Texas Instruments	MICROPROCESSOR CIRCUIT	MILITARY	THROUGH-HOLE	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	5.5 V			5	IN-LINE	DIP24,.3	4.5 V	125 Cel		-55 Cel			DUAL	5.08 mm			7.62 mm					NOT SPECIFIED	NOT SPECIFIED	32.005 mm		BICMOS	18 mA	5 V	Other Microprocessor ICs			2.54 mm		R-GDIP-T24		Not Qualified
TFB2022AIMFP	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	240	FQFP	SQUARE	METAL	YES	5.25 V				FLATPACK, FINE PITCH		4.75 V	85 Cel		-20 Cel			QUAD	4.2 mm			31.64 mm							31.64 mm		CMOS		5 V				.5 mm		S-MQFP-G240		Not Qualified
DP84902MS	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, SHRINK PITCH		4.5 V	70 Cel		0 Cel			DUAL	2.05 mm			5.3 mm							7.2 mm		CMOS		5 V				.65 mm		R-PDSO-G20
SN74LVT8980ADW	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			3.3	SMALL OUTLINE	SOP24,.4	2.7 V	85 Cel	LVT	-40 Cel	NICKEL PALLADIUM GOLD		DUAL	2.65 mm			7.5 mm			8		30	260	15.4 mm		CMOS	7 mA	3 V	Other Microprocessor ICs			1.27 mm		R-PDSO-G24	1	Not Qualified		e4
SN74AS8839GB	Texas Instruments		COMMERCIAL	PIN/PEG	84	PGA	SQUARE	CERAMIC	NO					GRID ARRAY	PGA84M,11X11		70 Cel		0 Cel			PERPENDICULAR													TTL	150 mA		Other uPs/uCs/Peripheral ICs			2.54 mm		S-XPGA-P84		Not Qualified
TSS400CFN-S1	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.5 V				CHIP CARRIER		2.6 V	70 Cel		0 Cel			QUAD	4.57 mm			16.5862 mm					NOT SPECIFIED	NOT SPECIFIED	16.5862 mm		CMOS	1.1 mA	3 V				1.27 mm		S-PQCC-J44		Not Qualified
SN74LS613N1	Texas Instruments		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO					IN-LINE	DIP40,.6		70 Cel		0 Cel			DUAL													TTL			Other uPs/uCs/Peripheral ICs			2.54 mm		R-PDIP-T40		Not Qualified
SN74LVT8980AIDWREP	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			3/3.3	SMALL OUTLINE	SOP24,.4	2.7 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL	2.65 mm			7.5 mm			8		30	260	15.4 mm		BICMOS		3.3 V	Other Microprocessor ICs			1.27 mm		R-PDSO-G24	1	Not Qualified		e4
DM8147BCIS0	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	684	HBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V				GRID ARRAY, HEAT SINK/SLUG		3.14 V				TIN SILVER COPPER		BOTTOM	3.06 mm			23 mm	IT ALSO OPERATES IN 1.71V MINIMUM SUPPLY				30	250	23 mm		CMOS		3.3 V				.8 mm		S-PBGA-B684	4			e1
SN74AS877ANT	Texas Instruments		COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO					IN-LINE	DIP24,.3		70 Cel		0 Cel			DUAL													TTL			Other uPs/uCs/Peripheral ICs			2.54 mm		R-PDIP-T24		Not Qualified
SN74AS852JT	Texas Instruments		COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	CERAMIC	NO					IN-LINE	DIP24,.3		70 Cel		0 Cel			DUAL													TTL			Other Microprocessor ICs			2.54 mm		R-XDIP-T24		Not Qualified
SN74CBT3283DW	Texas Instruments
XAM1806BZWTA4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V						BOTTOM	1.4 mm			16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY						16 mm		CMOS		1.3 V				.8 mm		S-PBGA-B361		Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.