Texas Instruments Other Function uPs,uCs & Peripheral ICs 1,456

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	No. of Ports	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
CC430F5125IRGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD		QUAD			1 mm	16384	2	7 mm		IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	TIMER	0	20 MHz	30	260	7 mm	2048	CMOS			3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		S-PQCC-N48	3	Not Qualified	20 rpm	e4		30
CC430F5143IRGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD		QUAD			1 mm	8192	2	7 mm		IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	TIMER	0	20 MHz	30	260	7 mm	2048	CMOS			3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		S-PQCC-N48	3	Not Qualified	20 rpm	e4		30
MSP430F67491IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD			1.6 mm	524288	32	14 mm				0		30	260	14 mm	32768	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3	Not Qualified	25 rpm	e4
MSP430F67791IPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD			1.6 mm	524288	32	14 mm				0		30	260	20 mm	32768	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		R-PQFP-G128	3	Not Qualified	25 rpm	e4
OMAPL138EZCE4	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			1.3 mm			13 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	13 mm		CMOS			1.3 V					I2C; SPI; UART; USB	.65 mm		S-PBGA-B361	3		456 rpm	e1
RF430FRL154HCRGER	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	24	VQCCN	SQUARE	PLASTIC/EPOXY	YES							CHIP CARRIER, VERY THIN PROFILE			70 Cel		0 Cel	NICKEL PALLADIUM GOLD		QUAD			1 mm			4 mm		IT REQUIRES 1.45V TO 1.65V LOW SUPPLY VOLTAGE		0		30	260	4 mm		CMOS								I2C; SPI	.5 mm		S-PQCC-N24	2			e4
TCI6630K2LSCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V						GRID ARRAY		.902 V				TIN SILVER COPPER		BOTTOM												30	245			CMOS			.95 V								S-PBGA-B900	4			e1
TCI6630K2LSCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V						GRID ARRAY		.902 V				TIN SILVER COPPER		BOTTOM												30	245			CMOS			.95 V								S-PBGA-B900	4			e1
66AK2G12ABYA60	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.945 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.855 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM			1.56 mm			21 mm						30	260	21 mm		CMOS			.9 V						.8 mm		S-PBGA-B625	3			e1
AM4378BZDN80	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			1.3 mm			17 mm						30	260	17 mm		CMOS			1.26 V						.65 mm		S-PBGA-B491	3			e1
AM6232ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel			BOTTOM			.89 mm			13 mm								13 mm		CMOS			.75 V						.5 mm		S-PBGA-B425
AM6234ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel			BOTTOM			.89 mm			13 mm								13 mm		CMOS			.75 V						.5 mm		S-PBGA-B425
AM6251ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel			BOTTOM			.89 mm			13 mm								13 mm		CMOS			.75 V						.5 mm		S-PBGA-B425
CC1310F64RGZ	Texas Instruments	MICROPROCESSOR CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V						QUAD			1 mm			7 mm								7 mm		CMOS									.5 mm		S-PQCC-N48
CC430F6147IRGCT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD SILVER	YES	QUAD			1 mm	32768	4	9 mm		IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY		0	20 MHz	30	260	9 mm	4096	CMOS			3.3 V		Microcontrollers		FLASH	I2C; SPI; UART; USB	.5 mm		S-PQCC-N64	3	Not Qualified	20 rpm	e4
DLPC900ZPC	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V						GRID ARRAY	BGA516,26X26,40	1.1 V	55 Cel		0 Cel			BOTTOM			2.42 mm			27 mm				16	20 MHz			27 mm		CMOS			1.15 V					I2C; SPI; UART; USB	1 mm		S-PBGA-B516						9
MSP430F67471IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD			1.6 mm	262144	32	14 mm				0		30	260	14 mm	32768	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3	Not Qualified	25 rpm	e4
MSP430F67641AIPZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V						FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD			1.6 mm		8	14 mm				0		30	260	14 mm	8192	CMOS			3.3 V					I2C; SPI; UART	.5 mm		S-PQFP-G100	3			e4
MSP430F67651AIPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES		1.6 mm	131072	16	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm	16384	CMOS	6-Ch 10-Bit		3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		R-PQFP-G128	3		25 rpm	e4	8	90
MSP430F67751AIPEUR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES		1.6 mm	131072	16	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm	16384	CMOS	6-Ch 10-Bit		3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		R-PQFP-G128	3		25 rpm	e4	8	90
MSP430F67781AIPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES		1.6 mm	524288	16	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm	16384	CMOS	6-Ch 10-Bit		3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		R-PQFP-G128	3		25 rpm	e4	8	90
MSP430F6778IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD			1.6 mm	524288	16	14 mm				0	25 MHz	30	260	14 mm	16384	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3	Not Qualified	25 rpm	e4
OMAPL138EZWTA3R	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	16 mm		CMOS			1.3 V					I2C; SPI; UART; USB	.8 mm		S-PBGA-B361	3		456 rpm	e1
TDA4AL88TGAALZRQ1	Texas Instruments	SYSTEM ON CHIP		BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100; ISO 26262					GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	125 Cel		-40 Cel			BOTTOM			2.57 mm			23 mm								23 mm		CMOS			.8 V						.8 mm		S-PBGA-B770	3		2000 rpm
VCBU65WMCE30	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			1.3 mm			13 mm				32		30	260	13 mm		CMOS			1.35 V					I2C; SPI; UART; USB	.65 mm		S-PBGA-B338	3			e1
VS3673UNION	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			1.3 mm			13 mm				32		30	260	13 mm		CMOS			1.35 V					I2C; SPI; UART; USB	.65 mm		S-PBGA-B338	3			e1
66AK2G12ABY100	Texas Instruments	SYSTEM ON CHIP	COMMERCIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			1.56 mm			21 mm						30	260	21 mm		CMOS			1 V						.8 mm		S-PBGA-B625	3			e1
AM6234ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel			BOTTOM			.89 mm			13 mm								13 mm		CMOS			.75 V						.5 mm		S-PBGA-B425
AM6254ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel			BOTTOM			.89 mm			13 mm							250	13 mm		CMOS			.75 V						.5 mm		S-PBGA-B425	3
AM6412BKCGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V						GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		-40 Cel			BOTTOM			2.652 mm			17.2 mm		ALSO OPERATES AT 0.85V NOMINAL SUPPLY						17.2 mm		CMOS			.75 V						.8 mm		S-PBGA-B441
AWR1642ABIGABLQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100					GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM			1.17 mm			10.4 mm						30	260	10.4 mm	1572864	CMOS			1.2 V						.65 mm		S-PBGA-B161	3			e1
DM6446ANB6C2127VC	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm						30	260	16 mm		CMOS			1.2 V						.8 mm		S-PBGA-B361	3			e1
DM6446AZWTKEDACOM	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm						30	260	16 mm		CMOS			1.2 V						.8 mm		S-PBGA-B361	3			e1
DM6446GB6C0121MV	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm						30	260	16 mm		CMOS			1.2 V						.8 mm		S-PBGA-B361	3			e1
LM8330TME/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V		128				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16	1.62 V	85 Cel		-30 Cel	TIN SILVER COPPER		BOTTOM		20	.675 mm			2.01 mm						30	260	2.01 mm		CMOS		.03 mA	1.8 V						.4 mm		S-PBGA-B25	1			e1		20
LM8330TMX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V		128				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16	1.62 V	85 Cel		-30 Cel	TIN SILVER COPPER		BOTTOM		20	.675 mm			2.01 mm						30	260	2.01 mm		CMOS		.03 mA	1.8 V						.4 mm		S-PBGA-B25	1			e1		20
MSP430F6747AIPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES		1.6 mm	262144	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	14 mm	32768	CMOS	6-Ch 10-Bit		3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3		25 rpm	e4	8	62
MSP430F6767IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD			1.6 mm	262144	32	14 mm				0	25 MHz	30	260	14 mm	32768	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3	Not Qualified	25 rpm	e4
MSP430F67791IPEUR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD			1.6 mm	524288	32	14 mm				0		30	260	20 mm	32768	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		R-PQFP-G128	3	Not Qualified	25 rpm	e4
OMAPL138BZWTRB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm		IT ASLO OPERATES IN 0.95V MINIMUM SUPPLY				30	260	16 mm		CMOS			1.3 V						.8 mm		S-PBGA-B361	3			e1
OMAPL138CZWTA3RW	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm						30	260	16 mm		CMOS			1.2 V						.8 mm		S-PBGA-B361	3			e1
TMS320DM355DZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V				32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			1.3 mm		8192	13 mm		IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O		32		30	260	13 mm		CMOS			1.3 V		Digital Signal Processors			I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM369ZCEDF	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES					32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25		85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM			1.3 mm		32768	13 mm				32		30	260	13 mm		CMOS					Digital Signal Processors			ETHERNET; I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
TMS320DM6446AZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm		16384	16 mm		DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY		48		30	260	16 mm		CMOS			1.2 V		Digital Signal Processors			I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		e1
TMSDM6446AZWT-COM	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm						30	260	16 mm		CMOS			1.2 V						.8 mm		S-PBGA-B361	3			e1
TNETV6446AINZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm						30	260	16 mm		CMOS			1.2 V						.8 mm		S-PBGA-B361	3			e1
UCD3138A64PFCR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			NO			FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	NO		1.2 mm	65536		12 mm	2K		COMPARATOR(7)	0	2 MHz	30	260	12 mm		CMOS			3.3 V	NO				I2C; SPI; UART	.5 mm		S-PQFP-G80	3			e4	8	43
XTDA4VPXXXGAALY	Texas Instruments	SoC		BALL	1414	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V						GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA1414,38X38,32	.76 V	70 Cel		0 Cel			BOTTOM			3.341 mm			31 mm								31 mm		CMOS			.8 V						.8 mm		S-PBGA-B1414

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.