Microchip Technology Serial Communication Controllers 214

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Maximum Data Transfer Rate	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Data Encoding or Decoding Method	Communication Protocol	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	JESD-609 Code	No. of I/O Lines
MCP2518FDT-E/SL	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE	SOP14,.24	2.7 V	125 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	1.75 mm		3.9 mm		NO			SYNC; BIT ;BYTE	40 MHz	30	260	8.65 mm	CMOS	20 mA	3.3 V	1		SPI	1.27 mm	R-PDSO-G14			YES	e3
MCP2515-I/ST	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8		0		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	4.5 V	85 Cel	.125 MBps	-40 Cel	Matte Tin (Sn)	DUAL	1.2 mm	14	4.4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz	40	260	6.5 mm	CMOS	10 mA	5 V	1		SPI	.65 mm	R-PDSO-G20	1		YES	e3	0
LAN9500AI-ABZJ	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	32		0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	3 V	85 Cel	60 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	7168	8 mm		YES	0	NRZI		25 MHz			8 mm	CMOS		3.3 V	4		PCI; USB	.5 mm	S-XQCC-N56			YES		11
MCP2515-I/SO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8		0		SMALL OUTLINE	SOP18,.4	4.5 V	85 Cel	.125 MBps	-40 Cel	Matte Tin (Sn) - annealed	DUAL	2.65 mm	14	7.5 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz	40	260	11.55 mm	CMOS	10 mA	5 V	1		SPI	1.27 mm	R-PDSO-G18	1		YES	e3	0
LAN9500AI-ABZJ-TR	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	32		0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	3 V	85 Cel	60 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	7168	8 mm		YES	0	NRZI		25 MHz			8 mm	CMOS		3.3 V	4		PCI; USB	.5 mm	S-XQCC-N56			YES		11
MCP2518FDT-E/QBB	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	14	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		TS 16949			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25	2.7 V	125 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	.9 mm		3 mm		NO			SYNC; BIT ;BYTE	40 MHz	30	260	4.5 mm	CMOS	20 mA	3.3 V	1		SPI	.65 mm	R-PDSO-N14			YES	e3
MCP2515T-I/ST	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8		0		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	1.2 mm	14	4.4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz		260	6.5 mm	CMOS	10 mA	5 V	1		SPI	.65 mm	R-PDSO-G20	1		YES	e3	0
MCP2518FDT-H/QBB	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	14	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25	2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	.9 mm		3 mm		NO			SYNC; BIT ;BYTE	40 MHz	30	260	4.5 mm	CMOS	20 mA	3.3 V	1		SPI	.65 mm	R-PDSO-N14			YES	e3
MCP2515-E/SO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8		0		SMALL OUTLINE	SOP18,.4	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm	14	7.5 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			11.55 mm	CMOS	10 mA	5 V	1		SPI	1.27 mm	R-PDSO-G18	1		YES	e3	0
MCP2518FDT-E/QBBVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949	0		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC14,.18X.12,30	2.7 V	125 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	.9 mm		3 mm		NO	0		SYNC; BIT ;BYTE	40 MHz	30	260	4.5 mm	CMOS	20 mA	3.3 V	1		SPI	.65 mm	R-PDSO-N14			YES	e3
MCP2518FDT-H/SL	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE	SOP14,.24	2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	1.75 mm		3.9 mm		NO			SYNC; BIT ;BYTE	40 MHz	30	260	8.65 mm	CMOS	20 mA	3.3 V	1		SPI	1.27 mm	R-PDSO-G14			YES	e3
MCP2518FDT-E/SLVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949	0		SMALL OUTLINE	SOP14,.24	2.7 V	125 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	1.75 mm		3.9 mm		NO	0		SYNC; BIT ;BYTE	40 MHz	30	260	8.65 mm	CMOS	20 mA	3.3 V	1		SPI	1.27 mm	R-PDSO-G14			YES	e3
MCP2515-E/ST	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			0		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	4.5 V	125 Cel	.125 MBps	-40 Cel	Matte Tin (Sn)	DUAL	1.2 mm		4.4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz	40	260	6.5 mm	CMOS		5 V	1		CAN, SPI	.65 mm	R-PDSO-G20	1	Not Qualified	YES	e3
LAN9514-JZX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		TS 16949	0	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	70 Cel	60 MBps	0 Cel	MATTE TIN	QUAD	1 mm		9 mm		YES	0		SYNC; BIT ;BYTE	25 MHz	40	260	9 mm	CMOS		1.8 V	1	Serial IO/Communication Controllers	USB	.5 mm	S-PQCC-N64	1	Not Qualified	YES	e3	8
MCP2515T-I/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	8		0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	14	4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz		260	4 mm	CMOS	10 mA	5 V	1		SPI	.5 mm	S-PQCC-N20	1		YES	e3	0
MCP2518FDT-H/SLVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949			SMALL OUTLINE	SOP14,.24	2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	1.75 mm		3.9 mm		NO			SYNC; BIT ;BYTE	40 MHz	30	260	8.65 mm	CMOS	20 mA	3.3 V	1		SPI	1.27 mm	R-PDSO-G14			YES	e3
MCP2515-I/P	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	8		0		IN-LINE	DIP18,.3	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	5.334 mm	14	7.62 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			22.86 mm	CMOS	10 mA	5 V	1		SPI	2.54 mm	R-PDIP-T18			YES	e3	0
LAN9514I-JZX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		TS 16949	0	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	85 Cel	60 MBps	-40 Cel	MATTE TIN	QUAD	1 mm		9 mm		YES	0		SYNC; BIT ;BYTE	25 MHz	40	260	9 mm	CMOS		1.8 V	1	Serial IO/Communication Controllers	USB	.5 mm	S-PQCC-N64	1	Not Qualified	YES	e3	8
MCP2518FDT-H/QBBVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949	0		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC14,.18X.12,30	2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	.9 mm		3 mm		NO	0		SYNC; BIT ;BYTE	40 MHz	30	260	4.5 mm	CMOS	20 mA	3.3 V	1		SPI	.65 mm	R-PDSO-N14			YES	e3
LAN9512I-JZX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	85 Cel	60 MBps	-40 Cel	MATTE TIN	QUAD	1 mm		9 mm		YES	0		SYNC; BIT ;BYTE	25 MHz			9 mm	CMOS		1.8 V	1		USB	.5 mm	S-PQCC-N64	3	Not Qualified	YES	e3	8
MCP2515-I/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	8		0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	14	4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz	40	260	4 mm	CMOS	10 mA	5 V	1		SPI	.5 mm	S-PQCC-N20	1		YES	e3	0
LAN7500I-ABZJ	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.26 V		TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	1.14 V	85 Cel	125 MBps	-40 Cel	MATTE TIN	QUAD	1 mm		8 mm		YES	0		SYNC; BIT ;BYTE	25 MHz		260	8 mm	CMOS		1.2 V	4		USB	.5 mm	S-PQCC-N56	3		YES	e3
LAN91C111I-NU	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	GULL WING	128	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V		TS 16949	16		FLATPACK, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16	2.97 V	85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1.2 mm		14 mm		NO	32	NRZ; BIPH-LEVEL(MANCHESTER)	SYNC, BIT, BYTE, ETHERNET	25 MHz		260	14 mm	CMOS	140 mA	3.3 V	4		680X0; 683XX	.4 mm	S-PQFP-G128	3	Not Qualified	YES	e3
MCP25625-E/SS	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		TS 16949	0		SMALL OUTLINE, SHRINK PITCH		2.7 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2 mm		5.3 mm		NO	0		CAN	25 MHz	40	260	10.2 mm	CMOS	10 mA	4.5 V	1		SPI	.65 mm	R-PDSO-G28	2		YES
ENC28J60-I/SS	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	8	TS 16949		3.3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	3.1 V	85 Cel	1.25 MBps	-40 Cel	MATTE TIN	DUAL	2 mm	8192	5.3 mm		NO			SYNC; BIT ;BYTE	25 MHz		260	10.2 mm	CMOS	180 mA	3.3 V	1	Serial IO/Communication Controllers	SPI	.65 mm	R-PDSO-G28	1	Not Qualified	YES	e3
MCP25625-E/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V		TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.7 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	QUAD	1 mm		6 mm		NO	0		CAN	25 MHz	40	260	6 mm	CMOS	10 mA	4.5 V	1		SPI	.65 mm	S-PQCC-N28	1		YES	e3
ENC28J60-I/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	8	TS 16949	0	3.3	CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG	LCC28,.24SQ,25	3.1 V	85 Cel	1.25 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	8192	6 mm		NO	0		SYNC; BIT ;BYTE	25 MHz	40	260	6 mm	CMOS	180 mA	3.3 V	1	Serial IO/Communication Controllers	SPI	.65 mm	S-PQCC-N28	1	Not Qualified	YES	e3
LAN8700IC-AEZG-TR	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES			TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1 mm		6 mm	IT ALSO HAS IEEE802.3AB NETWORK PROTOCOL	NO	0	NRZI; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz			6 mm	CMOS	41.3 mA	1.8 V	4			.5 mm	S-PQCC-N36			YES	e3
ENC28J60-I/SO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	8	TS 16949	0	3.3	SMALL OUTLINE	SOP28,.4	3.1 V	85 Cel	1.25 MBps	-40 Cel	Matte Tin (Sn)	DUAL	2.65 mm	8192	7.5 mm		NO	0		SYNC; BIT ;BYTE	25 MHz	40	250	17.9 mm	CMOS	180 mA	3.3 V	1	Serial IO/Communication Controllers	SPI	1.27 mm	R-PDSO-G28	1	Not Qualified	YES	e3
LAN9512-JZX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		TS 16949	0	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	70 Cel	60 MBps	0 Cel	MATTE TIN	QUAD	1 mm		9 mm		YES	0		SYNC; BIT ;BYTE	25 MHz		260	9 mm	CMOS		1.8 V	1	Serial IO/Communication Controllers	USB	.5 mm	S-PQCC-N64	1	Not Qualified	YES	e3	8
MCP2517FD-H/SL	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	TS 16949	0		SMALL OUTLINE	SOP14,.25	2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	1.75 mm	2048	3.9 mm		NO	0		CAN FD	40 MHz	30	260	8.65 mm	CMOS	20 mA		1		SPI	1.27 mm	R-PDSO-G14			YES	e3	2
MCP25625T-E/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V		TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.7 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	QUAD	1 mm		6 mm		NO	0		CAN	25 MHz	40	260	6 mm	CMOS	10 mA	4.5 V	1		SPI	.65 mm	S-PQCC-N28	1		YES	e3
MCP2515-I/STVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	1.2 mm	14	4.4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			6.5 mm	CMOS	10 mA	5 V	1		SPI	.65 mm	R-PDSO-G20			YES	e3	0
ENC624J600-I/PT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	16	TS 16949	16		FLATPACK, THIN PROFILE, FINE PITCH		3 V	85 Cel	12.5 MBps	-40 Cel		QUAD	1.2 mm	12288	10 mm		NO	16			25 MHz			10 mm	CMOS	117 mA	3.3 V			SPI	.5 mm	S-PQFP-G64			YES
LAN8700IC-AEZG	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20	3 V	85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1 mm		6 mm		NO	0	NRZI; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz		260	6 mm	CMOS	41.3 mA	1.8 V	4			.5 mm	S-PQCC-N36	3	Not Qualified	YES	e3
MCP2515-I/STRB4	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		TS 16949	0		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	1.2 mm		4.4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			6.5 mm	CMOS	10 mA	5 V	1		SPI	.65 mm	R-PDSO-G20			YES	e3
MCP2517FD-H/JHA	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	TS 16949	0		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	.9 mm	2048	3 mm		NO	0		CAN FD	40 MHz	30	260	4.5 mm	CMOS	20 mA		1		SPI	.65 mm	R-PDSO-N14			YES		2
MCP2515-I/SOVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0		SMALL OUTLINE	SOP18,.4	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm	14	7.5 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			11.55 mm	CMOS	10 mA	5 V	1		SPI	1.27 mm	R-PDSO-G18			YES	e3	0
MCP2515-I/STG	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			0		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		2.7 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	1.2 mm		4.4 mm		NO	0	NRZ		25 MHz		260	6.5 mm	CMOS			1			.65 mm	R-PDSO-G20	1	Not Qualified	YES	e3
MCP2515-I/STRB2	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		TS 16949	0		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	1.2 mm		4.4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			6.5 mm	CMOS	10 mA	5 V	1		SPI	.65 mm	R-PDSO-G20			YES	e3
ENC28J60/SS	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	8	TS 16949	0		SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	3.1 V	70 Cel	1.25 MBps	0 Cel	MATTE TIN	DUAL	2 mm	8192	5.3 mm		NO	0		SYNC; BIT ;BYTE	25 MHz	40	260	10.2 mm	CMOS	180 mA	3.3 V	1		SPI	.65 mm	R-PDSO-G28	2		YES	e3
MCP2515-I/SOGRB2	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		TS 16949	0		SMALL OUTLINE	SOP18,.4	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm		7.5 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			11.55 mm	CMOS	10 mA	5 V	1		SPI	1.27 mm	R-PDSO-G18			YES	e3
LAN9221I-ABZJ	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.98 V	8	TS 16949	8		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	1.62 V	85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	16384	8 mm		NO	16	NRZ; NRZI; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz		260	8 mm	CMOS	48 mA	1.8 V	1			.5 mm	S-PQCC-N56	3	Not Qualified	YES	e3	3
ENC424J600-I/PT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	44	TQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	16	TS 16949	15		FLATPACK, THIN PROFILE		3 V	85 Cel	12.5 MBps	-40 Cel		QUAD	1.2 mm	12288	10 mm		NO	15			25 MHz			10 mm	CMOS	117 mA	3.3 V			SPI	.8 mm	S-PQFP-G44			YES
MCP2517FDT-H/SL	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	TS 16949	0		SMALL OUTLINE	SOP14,.25	2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	1.75 mm	2048	3.9 mm		NO	0		CAN FD	40 MHz	30	260	8.65 mm	CMOS	20 mA		1		SPI	1.27 mm	R-PDSO-G14			YES	e3	2
LAN7430-I/Y9X	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.32 V		TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20	1.14 V	85 Cel	250 MBps	-40 Cel		QUAD	1 mm		7 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BIT, BYTE, ETHERNET	25 MHz	NOT SPECIFIED	NOT SPECIFIED	7 mm	CMOS	90 mA	1.2 V	8		PCI	.5 mm	S-PQCC-N48			YES
ENC28J60T-I/SO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	8	TS 16949	0	3.3	SMALL OUTLINE	SOP28,.4	3.1 V	85 Cel	1.25 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm	8192	7.5 mm		NO	0		SYNC; BIT ;BYTE	25 MHz		250	17.9 mm	CMOS	180 mA	3.3 V	1	Serial IO/Communication Controllers	SPI	1.27 mm	R-PDSO-G28	1	Not Qualified	YES	e3
MCP2517FDT-H/JHA	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	TS 16949	0		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	.9 mm	2048	3 mm		NO	0		CAN FD	40 MHz	30	260	4.5 mm	CMOS	20 mA		1		SPI	.65 mm	R-PDSO-N14			YES		2

Serial Communication Controllers

Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.

Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.

Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.