Microchip Technology Serial Communication Controllers 214

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Maximum Data Transfer Rate	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Data Encoding or Decoding Method	Communication Protocol	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Drive Interface Standard	Low Power Mode	JESD-609 Code	No. of I/O Lines
COM20020I-DZD-TR	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.5 V	8		3	5	CHIP CARRIER	LDCC28,.5SQ	4.5 V	85 Cel	.625 MBps	-40 Cel	MATTE TIN	QUAD	4.57 mm	2048	11.506 mm		NO	8	NRZ	ASYNC, BIT; SYNC, BYTE	20 MHz			11.506 mm	CMOS		5 V		1	Serial IO/Communication Controllers	8051; 6801	1.27 mm	S-PQCC-J28		Not Qualified		NO	e3
LAN7850T-I/8JX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.26 V			0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	1.1 V	85 Cel	125 MBps	-40 Cel		QUAD	1 mm		8 mm		YES	0		ASYNC, BIT; SYNC, BYTE	25 MHz	NOT SPECIFIED	NOT SPECIFIED	8 mm	CMOS	183 mA	1.2 V		2		USB	.5 mm	S-PQCC-N56				YES
COM20020I3V-HT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.465 V	8	TS 16949	3		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	3.135 V	85 Cel	.625 MBps	-40 Cel	MATTE TIN	QUAD	1.6 mm	2048	7 mm		NO	8	NRZ	ASYNC, BIT	40 MHz			7 mm	CMOS		3.3 V		1		8051; 6801	.5 mm	S-PQFP-G48		Not Qualified		NO	e3
LAN9252T/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		TS 16949	16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	70 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE; ETHERNET	25 MHz			9 mm	CMOS		3.3 V		4		I2C, SPI	.5 mm	S-XQCC-N64				YES
LAN9217-MT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES		8	TS 16949	7	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ		70 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1.6 mm	16384	14 mm		NO	16	NRZI; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz	40	260	14 mm	CMOS	69 mA	1.8 V		1	Serial IO/Communication Controllers		.5 mm	S-PQFP-G100	3	Not Qualified		YES	e3	3
LAN7800-I/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1.26 V		ISO/TS-16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.1 V	85 Cel	60 MBps	-40 Cel		QUAD	1 mm		7 mm	25 MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE	YES	0		ASYNC, BIT; SYNC, BYTE; ETHERNET				7 mm	CMOS		1.2 V		4		USB	.5 mm	S-XQCC-N48				YES
MCP2515-I/PRB2	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V		TS 16949	0		IN-LINE	DIP18,.3	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	5.334 mm		7.62 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			22.86 mm	CMOS	10 mA	5 V		1		SPI	2.54 mm	R-PDIP-T18				YES	e3
MCP2515-I/PRB4	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V		TS 16949	0		IN-LINE	DIP18,.3	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	5.334 mm		7.62 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			22.86 mm	CMOS	10 mA	5 V		1		SPI	2.54 mm	R-PDIP-T18				YES	e3
MCP2515T-E/STRB4	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		TS 16949	0		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	1.2 mm		4.4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			6.5 mm	CMOS	10 mA	5 V		1		SPI	.65 mm	R-PDSO-G20				YES	e3
PM8072B1-F3EI	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL		BALL	1071	BGA	SQUARE	PLASTIC/EPOXY	YES						GRID ARRAY	BGA1071(UNSPEC)			1000 MBps			BOTTOM					NO			ASYNC, BIT					CMOS						PCI, UART		S-PBGA-B1071				NO
LAN9253/R4X	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1.26 V			16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.14 V	70 Cel	12.5 MBps	0 Cel		QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE	25 MHz			9 mm	CMOS		1.2 V		4		I2C; SPI	.5 mm	S-XQCC-N64				YES
MCP2515T-E/STRB2	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		TS 16949	0		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	1.2 mm		4.4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			6.5 mm	CMOS	10 mA	5 V		1		SPI	.65 mm	R-PDSO-G20				YES	e3
LAN9220-ABZJ	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES		8	TS 16949	7	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		70 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1 mm	16384	8 mm		NO	16	NRZI; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz		260	8 mm	CMOS	48 mA	1.8 V		1	Serial IO/Communication Controllers		.5 mm	S-PQCC-N56	3	Not Qualified		YES	e3	3
MCP2510-I/SOG	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			0		SMALL OUTLINE		4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm		7.5 mm	OPERATES AT 3V MINIMUM SUPPLY @ 16 MHZ	NO	0	NRZ		25 MHz			11.55 mm	CMOS		5 V		1			1.27 mm	R-PDSO-G18	1	Not Qualified		YES	e3
LAN9253-V/R4X	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1.26 V			16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.14 V	105 Cel	12.5 MBps	-40 Cel		QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE	25 MHz			9 mm	CMOS		1.2 V		4		I2C; SPI	.5 mm	S-XQCC-N64				YES
KSZ8841-16MVLI-TR	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.5 V			15		FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16	3.1 V	85 Cel	12.5 MBps	-40 Cel		QUAD	1.6 mm		14 mm		YES	16	NRZ; NRZI; BIPH-LEVEL(MANCHESTER)		25 MHz			14 mm	CMOS		3.3 V					.4 mm	S-PQFP-G128				YES
LAN9500I-ABZJ	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	32		0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	3 V	85 Cel	60 MBps	-40 Cel		QUAD	1 mm	7168	8 mm		YES	0	NRZI		25 MHz			8 mm	CMOS		3.3 V		4		PCI; USB	.5 mm	S-XQCC-N56				YES		11
LAN7850T/8JX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.26 V		TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	1.1 V	70 Cel	125 MBps	0 Cel		QUAD	1 mm		8 mm		YES	0		ASYNC, BIT; SYNC, BYTE	25 MHz			8 mm	CMOS	183 mA	1.2 V		1		USB	.5 mm	S-PQCC-N56			IEEE 802.3; IEEE 802.3U	YES		12
LAN9218I-MT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES		8	TS 16949	7	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ		85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1.6 mm	16384	14 mm		NO	32	NRZI; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz		260	14 mm	CMOS	69 mA	1.8 V		1	Serial IO/Communication Controllers		.5 mm	S-PQFP-G100	3	Not Qualified		YES	e3	3
LAN9513-JZX-TR	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES					3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20		70 Cel	60 MBps	0 Cel	MATTE TIN	QUAD	1 mm		9 mm		YES			SYNC; BIT ;BYTE				9 mm	CMOS		1.8 V		1	Serial IO/Communication Controllers		.5 mm	S-PQCC-N64		Not Qualified		YES	e3
LAN9253-I/R4X	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1.26 V			16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.14 V	85 Cel	12.5 MBps	-40 Cel		QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE	25 MHz			9 mm	CMOS		1.2 V		4		I2C; SPI	.5 mm	S-XQCC-N64				YES
LAN9513-JZX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		TS 16949	0	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	70 Cel	60 MBps	0 Cel	MATTE TIN	QUAD	1 mm		9 mm		YES	0		SYNC; BIT ;BYTE	25 MHz	40	260	9 mm	CMOS		1.8 V		1	Serial IO/Communication Controllers	USB	.5 mm	S-PQCC-N64	1	Not Qualified		YES	e3	8
LAN9730I-ABZJ	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.32 V		TS 16949			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16	1.08 V	85 Cel	60 MBps	-40 Cel	MATTE TIN	QUAD	1 mm		7 mm		YES		NRZI; BIPH-LEVEL(MANCHESTER)	SYNC, BIT, BYTE, ETHERNET	25 MHz			7 mm	CMOS		1.2 V		4		PCI; USB	.5 mm	S-PQCC-N56		Not Qualified		YES	e3	11
LAN9253T-I/R4X	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1.26 V			16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.14 V	85 Cel	12.5 MBps	-40 Cel		QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE	25 MHz			9 mm	CMOS		1.2 V		4		I2C; SPI	.5 mm	S-XQCC-N64				YES
COM20020I-HT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	8		3		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	4.5 V	85 Cel	.625 MBps	-40 Cel	MATTE TIN	QUAD	1.6 mm	2048	7 mm		NO	8	NRZ	ASYNC, BIT; SYNC, BYTE	40 MHz			7 mm	CMOS		5 V		1		8051; 6801	.5 mm	S-PQFP-G48		Not Qualified		NO	e3
COM20020I3V-DZD-TR	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	3.465 V	8	TS 16949	3		CHIP CARRIER	LDCC28,.5SQ	3.135 V	85 Cel	.625 MBps	-40 Cel		QUAD	4.572 mm	2048	11.5062 mm		NO	8	NRZ	ASYNC, BIT	40 MHz	NOT SPECIFIED	NOT SPECIFIED	11.5062 mm	CMOS		3.3 V		1		8051; 6801	1.27 mm	S-PQCC-J28				NO
LAN9253T-V/R4X	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1.26 V			16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.14 V	105 Cel	12.5 MBps	-40 Cel		QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE	25 MHz			9 mm	CMOS		1.2 V		4		I2C; SPI	.5 mm	S-XQCC-N64				YES
LAN9253T/R4X	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1.26 V			16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.14 V	70 Cel	12.5 MBps	0 Cel		QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE	25 MHz			9 mm	CMOS		1.2 V		4		I2C; SPI	.5 mm	S-XQCC-N64				YES
ENC28J60/SO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	8	TS 16949	0		SMALL OUTLINE	SOP28,.4	3.1 V	70 Cel	1.25 MBps	0 Cel		DUAL	2.65 mm	8192	7.5 mm		NO	0		SYNC, BIT, BYTE, ETHERNET	25 MHz			17.9 mm	CMOS	180 mA	3.3 V		1		SPI	1.27 mm	R-PDSO-G28				YES
LAN9117-MT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES		8	TS 16949	7		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ	2.97 V	70 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1.6 mm	16384	14 mm		NO	16	NRZ; NRZI; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz			14 mm	CMOS		1.8 V		1			.5 mm	S-PQFP-G100		Not Qualified		YES	e3	3
MCP2515-E/P	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	8		0		IN-LINE	DIP18,.3	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	5.334 mm	14	7.62 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			22.86 mm	CMOS	10 mA	5 V		1		SPI	2.54 mm	R-PDIP-T18				YES	e3	0
LAN9118-MT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES		8	TS 16949	7		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ		70 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1.6 mm	16384	14 mm		NO	32	NRZ; NRZI; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz			14 mm	CMOS		1.8 V		1			.5 mm	S-PQFP-G100		Not Qualified		YES	e3	3
LAN91C113-NU	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	OTHER	GULL WING	128	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V			16		FLATPACK, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16	2.97 V	85 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1.2 mm		14 mm		NO	16	NRZ; BIPH-LEVEL(MANCHESTER)	BIT, BYTE, ETHERNET	25 MHz			14 mm	CMOS	140 mA	3.3 V		7		680X0; 683XX	.4 mm	S-PQFP-G128				YES	e3
LAN91C96-MU	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V	8		16		FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	2.97 V	70 Cel	1.25 MBps	0 Cel	MATTE TIN	QUAD	1.2 mm	6144	14 mm	ALSO OPERATES AT 5V SUPPLY	NO	16	BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	20 MHz	40	260	14 mm	CMOS		3.3 V		2		PCMCIA; 68000	.5 mm	S-PQFP-G100	3	Not Qualified		YES	e3
LAN7431-V/YXX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		AEC-Q100; TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V	105 Cel	256 MBps	-40 Cel	Matte Tin (Sn) - annealed	QUAD	1 mm		10 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BYTE; ETHERNET	25 MHz	30	260	10 mm	CMOS		1.2 V		4		PCI	.5 mm	S-XQCC-N72	3			YES	e3
LAN7850-I/4F	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER	INDUSTRIAL	NO LEAD	56	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1.26 V		TS 16949			CHIP CARRIER, HEAT SINK/SLUG	LCC56,.31SQ,20	1.1 V	85 Cel	125 MBps	-40 Cel		QUAD	1 mm		8 mm		YES			SYNC, BYTE; ETHERNET	25 MHz			8 mm	CMOS		1.2 V	0	0			.5 mm	S-PQCC-N56				YES		11
LAN9500I-ABZJ-TR	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	32		0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	3 V	85 Cel	60 MBps	-40 Cel		QUAD	1 mm	7168	8 mm		YES	0	NRZI		25 MHz			8 mm	CMOS		3.3 V		4		PCI; USB	.5 mm	S-XQCC-N56				YES		11
MCP2515T-E/STVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949	0		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	1.2 mm		4.4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			6.5 mm	CMOS	10 mA	5 V		1		SPI	.65 mm	R-PDSO-G20				YES	e3
LAN7431-V/YXXVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		AEC-Q100; TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V	105 Cel	256 MBps	-40 Cel	Matte Tin (Sn) - annealed	QUAD	1 mm		10 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BYTE; ETHERNET	25 MHz	30	260	10 mm	CMOS		1.2 V		4		PCI	.5 mm	S-XQCC-N72	3			YES	e3
LAN7431/YXX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V	70 Cel	256 MBps	0 Cel	MATTE TIN	QUAD	1 mm		10 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BYTE; ETHERNET	25 MHz	30	260	10 mm	CMOS		1.2 V		4		PCI	.5 mm	S-XQCC-N72	3			YES	e3
LAN7431T-V/YXX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		AEC-Q100; TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V	105 Cel	256 MBps	-40 Cel	Matte Tin (Sn) - annealed	QUAD	1 mm		10 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BYTE; ETHERNET	25 MHz	30	260	10 mm	CMOS		1.2 V		4		PCI	.5 mm	S-XQCC-N72	3			YES	e3
LAN7850T-I/4F	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER	INDUSTRIAL	NO LEAD	56	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1.26 V		TS 16949			CHIP CARRIER, HEAT SINK/SLUG	LCC56,.31SQ,20	1.1 V	85 Cel	125 MBps	-40 Cel		QUAD	1 mm		8 mm		YES			SYNC, BYTE; ETHERNET	25 MHz			8 mm	CMOS		1.2 V	0	0			.5 mm	S-PQCC-N56				YES		11
LAN7850T/4F	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER	COMMERCIAL	NO LEAD	56	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1.26 V		TS 16949			CHIP CARRIER, HEAT SINK/SLUG	LCC56,.31SQ,20	1.1 V	70 Cel	125 MBps	0 Cel		QUAD	1 mm		8 mm		YES			SYNC, BYTE; ETHERNET	25 MHz			8 mm	CMOS		1.2 V	0	0			.5 mm	S-PQCC-N56				YES		11
LAN8187I-JT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES			TS 16949	0		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1.6 mm		10 mm		NO	0	NRZI; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz			10 mm	CMOS	81.6 mA	1.8 V		4			.5 mm	S-PQFP-G64		Not Qualified		YES	e3
LAN7850/4F	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER	COMMERCIAL	NO LEAD	56	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1.26 V		TS 16949			CHIP CARRIER, HEAT SINK/SLUG	LCC56,.31SQ,20	1.1 V	70 Cel	125 MBps	0 Cel		QUAD	1 mm		8 mm		YES			SYNC, BYTE; ETHERNET	25 MHz			8 mm	CMOS		1.2 V	0	0			.5 mm	S-PQCC-N56				YES		11
LAN8700I-AEZG	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V			0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.97 V	85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1 mm		6 mm		NO	0	NRZI; BIPH-LEVEL(MANCHESTER)		25 MHz			6 mm	CMOS		3.3 V		1			.5 mm	S-XQCC-N36	3	Not Qualified		YES	e3
LAN7801T-I/9JXVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN																														30	260
LAN9218-MT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES		8	TS 16949	7	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ		70 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1.6 mm	16384	14 mm		NO	32	NRZI; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz	40	260	14 mm	CMOS	69 mA	1.8 V		1	Serial IO/Communication Controllers		.5 mm	S-PQFP-G100	3	Not Qualified		YES	e3	3

Serial Communication Controllers

Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.

Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.

Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.