Microchip Technology Serial Communication Controllers 214

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Maximum Data Transfer Rate	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Data Encoding or Decoding Method	Communication Protocol	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	JESD-609 Code	No. of I/O Lines
LAN9215I-MT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES		8	TS 16949	7		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ		85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1.6 mm	16384	14 mm		NO	16	NRZI; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz	40	260	14 mm	CMOS	69 mA	1.8 V		1			.5 mm	S-PQFP-G100	3	Not Qualified	YES	e3	3
LAN9115-MT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES		8	TS 16949	7		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ		70 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1.6 mm	16384	14 mm		NO	16	NRZ; NRZI; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz	40	260	14 mm	CMOS		1.8 V		1			.5 mm	S-PQFP-G100	3	Not Qualified	YES	e3	3
COM20020LJP	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.5 V	8		3	5	CHIP CARRIER	LDCC28,.5SQ	4.5 V	70 Cel	.625 MBps	0 Cel	TIN LEAD	QUAD	4.572 mm	1024	11.5062 mm		NO	8	NRZ		40 MHz		235	11.5062 mm	CMOS	50 mA	5 V	0	1	Serial IO/Communication Controllers	8051; 6801	1.27 mm	S-PQCC-J28		Not Qualified	NO	e0	0
COM20020P	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	8		3	5	IN-LINE	DIP24,.6	4.5 V	70 Cel	.625 MBps	0 Cel	TIN LEAD	DUAL	3.81 mm	1024	15.24 mm		NO	8	NRZ		40 MHz		235	31.877 mm	CMOS	50 mA	5 V	0	1	Serial IO/Communication Controllers	8051; 6801	2.54 mm	R-PDIP-T24		Not Qualified	NO	e0	0
LAN7801-I/9JXVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN
MCP2515T-E/MLVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	14	4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			4 mm	CMOS	10 mA	5 V		1		SPI	.5 mm	S-PQCC-N20			YES	e3	0
PM8068B1-F3EI	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER	OTHER	BALL	1022		SQUARE	PLASTIC/EPOXY	YES									105 Cel	1000 MBps	0 Cel		BOTTOM					NO			I2C					CMOS						PCI, UART		S-PBGA-B1022			NO
USB4715T/Y9X	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		TS 16949			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20	3 V	70 Cel		0 Cel		QUAD	1 mm		7 mm	25MHZ NOMINAL CLOCK AVAILABLE	NO			ASYNC, BIT; SYNC, BYTE	25 MHz			7 mm	CMOS		3.3 V		1		I2C; I2S; SMBUS; SPI; UART	.5 mm	S-PQCC-N48			YES
COM20019I-DZD	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	3.465 V	8	TS 16949	3		CHIP CARRIER	LDCC28,.5SQ	3.135 V	85 Cel	.0390625 MBps	-40 Cel	MATTE TIN	QUAD	4.572 mm	2048	11.51 mm		NO	8		ASYNC, BIT	20 MHz			11.51 mm	CMOS		3.3 V		1		8051; 6801	1.27 mm	S-PQCC-J28		Not Qualified	NO	e3
LAN7431T-V/YXXVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		AEC-Q100; TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V	105 Cel	256 MBps	-40 Cel	Matte Tin (Sn) - annealed	QUAD	1 mm		10 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BYTE; ETHERNET	25 MHz	30	260	10 mm	CMOS		1.2 V		4		PCI	.5 mm	S-XQCC-N72	3		YES	e3
LAN7431T-I/YXX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V	85 Cel	256 MBps	-40 Cel	Matte Tin (Sn) - annealed	QUAD	1 mm		10 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BYTE; ETHERNET	25 MHz	30	260	10 mm	CMOS		1.2 V		4		PCI	.5 mm	S-XQCC-N72	3		YES	e3
LAN7431T/YXX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V	70 Cel	256 MBps	0 Cel	Matte Tin (Sn) - annealed	QUAD	1 mm		10 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BYTE; ETHERNET	25 MHz	30	260	10 mm	CMOS		1.2 V		4		PCI	.5 mm	S-XQCC-N72	3		YES	e3
LAN7801-V/9JXVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN
LAN7801T-I/MR	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.26 V		ISO/TS-16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.1 V	85 Cel	60 MBps	-40 Cel		QUAD	1 mm		9 mm	25 MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE	YES	0		ASYNC, BIT; SYNC, BYTE; ETHERNET				9 mm	CMOS		1.2 V		4		USB	.5 mm	S-PQCC-N64			YES
COM20022I-HT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	8	TS 16949	3		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	4.5 V	70 Cel	1.25 MBps	0 Cel	MATTE TIN	QUAD	1.6 mm	2048	7 mm		NO	16	NRZ	ASYNC, BIT	20 MHz	40	260	7 mm	CMOS		5 V		1		8051; 6801	.5 mm	S-PQFP-G48		Not Qualified	NO	e3
LAN91C93I-MU	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V			20	3.3/5	FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	2.97 V	85 Cel	1.25 MBps	-40 Cel		QUAD	1.2 mm		14 mm		NO	16	NRZ; BIPH-LEVEL(MANCHESTER)		20 MHz			14 mm	CMOS	95 mA	3.3 V		2	Serial IO/Communication Controllers		.5 mm	S-PQFP-G100		Not Qualified	YES
COM20022I3V-HT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.465 V	8	TS 16949	3		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	3.135 V	85 Cel	1.25 MBps	-40 Cel	MATTE TIN	QUAD	1.6 mm	2048	7 mm		NO	16	NRZ	ASYNC, BIT; SYNC, BYTE	20 MHz			7 mm	CMOS		3.3 V		1		68XX; 80XX	.5 mm	S-PQFP-G48		Not Qualified	NO	e3
LAN9210-ABZJ	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.9 V			7	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	1.7 V	70 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1 mm		8 mm		YES	16	NRZI; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz			8 mm	CMOS	46 mA	1.8 V		1	Serial IO/Communication Controllers	PCI	.5 mm	S-PQCC-N56		Not Qualified	YES	e3
LAN9215-MT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES		8	TS 16949	7	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ		70 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1.6 mm	16384	14 mm		NO	16	NRZI; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz	40	260	14 mm	CMOS	69 mA	1.8 V		1	Serial IO/Communication Controllers		.5 mm	S-PQFP-G100	3	Not Qualified	YES	e3	3
LAN9730I-ABZJ-TR	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.32 V		TS 16949			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16	1.08 V	85 Cel	60 MBps	-40 Cel	MATTE TIN	QUAD	1 mm		7 mm		YES		NRZI; BIPH-LEVEL(MANCHESTER)	SYNC, BIT, BYTE, ETHERNET	25 MHz			7 mm	CMOS		1.2 V		4		PCI; USB	.5 mm	S-PQCC-N56		Not Qualified	YES	e3	11
SCH3224-SY	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER	COMMERCIAL	BALL	100	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.63 V	8		0		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA100,11X11,25	2.97 V	70 Cel	.1875 MBps	0 Cel	TIN SILVER COPPER	BOTTOM	.8 mm	256	8 mm		NO	0		SYNC, BYTE	33 MHz			8 mm	CMOS	1 mA	3 V	4	2		PCI; UART	.65 mm	S-PBGA-B100			YES	e1	24
SCH3226I-SY	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER	INDUSTRIAL	BALL	100	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.63 V	8		0		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA100,11X11,25	2.97 V	85 Cel	.1875 MBps	-40 Cel	TIN SILVER COPPER	BOTTOM	.8 mm	256	8 mm		NO	0		SYNC, BYTE	33 MHz			8 mm	CMOS	1 mA	3 V	0	6		PCI; UART	.65 mm	S-PBGA-B100			YES	e1	40

Serial Communication Controllers

Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.

Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.

Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.