J Bend Field Programmable Gate Arrays (FPGA) 963

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3020-100PC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS	58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	7 ns	64 CLBS, 1000 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA		100 MHz		58		24.2316 mm
XC5206-4PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	784	Yes	5.5 V	196	CMOS	65	6000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		3.8 ns	196 CLBS, 6000 Gates		Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 6000-10000	e0	83 MHz	30 s	65	225 °C (437 °F)	29.3116 mm
XC4008E-3PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	324	CMOS		6000	5		Chip Carrier			4.5 V	1.27 mm		2 ns	324 CLBS, 6000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 8000 Logic gates	e3	125 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC5210-4PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	324	CMOS		10000	5		Chip Carrier			4.5 V	1.27 mm		3.8 ns	324 CLBS, 10000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 10000-16000	e3	83 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC4310-4PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			5		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC3130A-1PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		1500	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	1.75 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 2000 Logic gates	e3	323 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC4008-6PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	770	Yes	5.5 V	324	CMOS	61	6500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	6 ns	324 CLBS, 6500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	936 flip-flops; typical gates = 6500-8000	e0	90.9 MHz	30 s	61	225 °C (437 °F)	29.3116 mm
XC4003E-3PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	2 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 3000 Logic gates	e3	125 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC6264-2PCG84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	16384	CMOS		64000	5		Chip Carrier			4.75 V	1.27 mm			16384 CLBS, 64000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	16384 flip-flops; typical gates = 64000-100000	e3	111 MHz				29.3116 mm
XC3190A-5PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	320	Yes	5.25 V	320	CMOS	70	5000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.1 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 5000-6000	e0	188 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3090-50PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	320	Yes	5.25 V	320	CMOS	70	9000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)		320 CLBS, 9000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 70 I/OS; 928 flip-flops	e0	50 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC5206-3PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	784	Yes	5.5 V	196	CMOS	65	6000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		3 ns	196 CLBS, 6000 Gates		Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 6000-10000	e0	83 MHz	30 s	65	225 °C (437 °F)	29.3116 mm
XCS05-3PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100			2000	5		Chip Carrier			4.5 V	1.27 mm			100 CLBS, 2000 Gates		Tin Lead	Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No		e0					29.3116 mm
XC3090A-7PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	320	CMOS		5000	5		Chip Carrier			4.5 V	1.27 mm		5.1 ns	320 CLBS, 5000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 6000 Logic gates	e3	113 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC4010D-5PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	400	Yes	5.5 V	400	CMOS	160	8000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	4.5 ns	400 CLBS, 8000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	1120 flip-flops; typical gates = 8000-10000	e0	133.3 MHz	30 s	160	225 °C (437 °F)	29.3116 mm
XC3390A-6PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			5		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC8103-2PC44C	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	1024	CMOS		3000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		1024 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQCC-J44		4.572 mm	16.5862 mm	No	512 flip-flops; 3.3 V operation; OTP based						16.5862 mm
XC3020A-1PC68C	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes			CMOS	58		5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68				No		e0	325 MHz		58
XC3142-5PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.5 V	144	CMOS	74	3000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	4.1 ns	144 CLBS, 3000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700	e0	190 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC2064-130PC44C	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	34	600	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	5.5 ns	64 CLBS, 600 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.318 mm	16.5862 mm	No	122 flip-flops; typical gates = 600-1000	e0	130 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC4008-6PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	770	Yes	5.25 V	324	CMOS	61	6500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	6 ns	324 CLBS, 6500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	936 flip-flops; typical gates = 6500-8000	e0	90.9 MHz	30 s	61	225 °C (437 °F)	29.3116 mm
XC3030-70PC44ISPC0104	Xilinx	FPGA	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS		3000	5		Chip Carrier			4.5 V	1.27 mm	85 °C (185 °F)	9 ns	100 CLBS, 3000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44		4.318 mm	16.5862 mm	No	MAX 34 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				16.5862 mm
XC5204-3PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	120	CMOS		4000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	3 ns	120 CLBS, 4000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAX available 6000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC8101-ESPC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	384	CMOS		1248	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	5.5 ns	384 CLBS, 1248 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	MAX 61 I/OS; MAX 192 flip-flops; OTP based						29.3116 mm
XC3030-125PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	74	1500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	5.5 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA	e0	125 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC3090-50PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	320	Yes	5.5 V	320	CMOS	70	9000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)		320 CLBS, 9000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 70 I/OS; 928 flip-flops	e0	50 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3390L-8PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			3.3		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC2018-70PC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	10 ns	100 CLBS, 1000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	174 flip-flops; typical gates = 1000-1500	e0	70 MHz		58		24.2316 mm
XC5206L-5PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	196	CMOS		6000	3.3		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)		196 CLBS, 6000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 6000-10000	e0					29.3116 mm
XC5406L-4PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes						3.3		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC3030A-6PCG68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		1500	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	4.1 ns	100 CLBS, 1500 Gates	0 °C (32 °F)		Quad	S-PQCC-J68		5.08 mm	24.2316 mm		Max usable 2000 Logic gates		135 MHz				24.2316 mm
XC5206-4PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	196	CMOS		6000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	3.8 ns	196 CLBS, 6000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAX available 10000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3120A-2PC68I	Xilinx	FPGA		J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS	58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		2.2 ns	64 CLBS, 1000 Gates		Tin Lead	Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	Max usable 1500 Logic gates	e0	323 MHz		58		24.2316 mm
XC2318-70PC68I	Xilinx	FPGA		J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			5		Chip Carrier				1.27 mm						Quad	S-PQCC-J68		5.08 mm	24.2316 mm	No			70 MHz				24.2316 mm
XC6264-2PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	16384	CMOS		64000	5		Chip Carrier			4.5 V	1.27 mm			16384 CLBS, 64000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	16384 flip-flops; typical gates = 64000-100000	e3	111 MHz				29.3116 mm
XC3130A-4PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	74	1500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	3.3 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 2000 Logic gates	e0	227 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XCS10XL-3PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	196	Yes	3.6 V	196	CMOS	112	3000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)		196 CLBS, 3000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0		30 s	112	225 °C (437 °F)	29.3116 mm
XC4010E-3PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	400	CMOS		7000	5		Chip Carrier			4.5 V	1.27 mm		2 ns	400 CLBS, 7000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 10000 Logic gates	e3	125 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC4005L-6PCG84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	196	CMOS		3000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)		196 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 3000-9000	e3					29.3116 mm
XC3120A-4PC68I	Xilinx	FPGA		J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS	58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		3.3 ns	64 CLBS, 1000 Gates		Tin Lead	Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	Max usable 1500 Logic gates	e0	227 MHz		58		24.2316 mm
XC4005XL-09CPGC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	196	CMOS		3000	3.3		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)	1.2 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	Max usable 5000 Logic gates	e3	217 MHz				29.3116 mm
XC3020A-7PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	64	CMOS		1000	5		Chip Carrier			4.5 V	1.27 mm		5.1 ns	64 CLBS, 1000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 1500 Logic gates	e3	113 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC5402-4PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			5		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC3020-70PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS	64	1000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	9 ns	64 CLBS, 1000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA	e0	70 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC2064LPC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	64	CMOS		1000	3.3		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)		64 CLBS, 1000 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68		4.445 mm	24.2316 mm	No	MAX 58 I/OS; 800 to 1000 available gates						24.2316 mm
XC4008E-4PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	324	CMOS		6000	5		Chip Carrier			4.5 V	1.27 mm		2.7 ns	324 CLBS, 6000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 8000 Logic gates	e3	111 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3064-70PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes	5.25 V	224	CMOS	70	3500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	9 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA	e0	70 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC4010L-5PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	400	CMOS		7000	5		Chip Carrier			4.75 V	1.27 mm			400 CLBS, 7000 Gates			Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	Typical gates = 7000-20000						29.3116 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.