J Bend Field Programmable Gate Arrays (FPGA) 963

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4005XL-09PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	196	Yes	3.6 V	196	CMOS	112	3000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.2 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 3000-9000	e0	217 MHz	30 s	112	225 °C (437 °F)	29.3116 mm
XC3330A-6PC68C	Xilinx	FPGA		J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			5		Chip Carrier				1.27 mm						Quad	S-PQCC-J68		5.08 mm	24.2316 mm	No							24.2316 mm
XC3120-4PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS	64	1000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	3.3 ns	64 CLBS, 1000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 1000-1500	e0	227 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC6216-2PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	4096	Yes	5.25 V	4096	CMOS	256	16000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm			4096 CLBS, 16000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 16000-24000	e0	111 MHz	30 s	256	225 °C (437 °F)	29.3116 mm
XC3130A-3PC68I	Xilinx	FPGA		J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	58	1500	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		2.7 ns	100 CLBS, 1500 Gates		Tin Lead	Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	Max usable 2000 Logic gates	e0	270 MHz		58		24.2316 mm
XC3030A-6PC68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	58	1500	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.1 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	3	5.08 mm	24.2316 mm	No	Max usable 2000 Logic gates	e0	135 MHz		58		24.2316 mm
XC3020-70PC84CSPC0107	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		1000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	9 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	256 flip-flops; typical gates = 1000-1500	e0	70 MHz				29.3116 mm
XC2064-70PC44C	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	34	600	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	10 ns	64 CLBS, 600 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.318 mm	16.5862 mm	No	122 flip-flops; typical gates = 600-1000	e0	70 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC4405-3PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			5		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC3130A-2PC44C	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	34	1500	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	2.2 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Max usable 2000 Logic gates	e0	323 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC5210-5PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	324	Yes	5.25 V	324	CMOS	196	10000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.6 ns	324 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAX available 16000 Logic gates	e0	83 MHz	30 s	196	225 °C (437 °F)	29.3116 mm
XC3195A-4PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	484	Yes	5.25 V	484	CMOS	70	6500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	3.3 ns	484 CLBS, 6500 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 7500 Logic gates	e0	227 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
5962-01-417-5318	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes			CMOS	74		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	S-PQCC-J84				No			70 MHz		74
XC3130A-5PC68I	Xilinx	FPGA		J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	58	1500	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		4.1 ns	100 CLBS, 1500 Gates			Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	Typical gates = 1500-2000		188 MHz		58		24.2316 mm
XC5404L-4PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes						3.3		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC3330A-6PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			5		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC3064-100PC84CSPC0108	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	224	CMOS		6400	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	7 ns	224 CLBS, 6400 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 70 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C		100 MHz				29.3116 mm
XC5210-3PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	324	Yes	5.5 V	324	CMOS	196	10000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		3 ns	324 CLBS, 10000 Gates		Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 10000-16000	e0	83 MHz	30 s	196	225 °C (437 °F)	29.3116 mm
XC4005A-5PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	196	Yes	5.25 V	196	CMOS	112	4000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.5 ns	196 CLBS, 4000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	616 flip-flops; typical gates = 4000-5000	e0	133.3 MHz	30 s	112	225 °C (437 °F)	29.3116 mm
XC4006E-2PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	256	CMOS		4000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	1.6 ns	256 CLBS, 4000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 6000 Logic gates	e3	125 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC4010E-4PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	400	CMOS		7000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	2.7 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 10000 Logic gates	e3	111 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC2018-100PC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	8 ns	100 CLBS, 1000 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	174 flip-flops; typical gates = 1000-1500		100 MHz		58		24.2316 mm
XC4005XL-3PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	196	CMOS		3000	3.3		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)	1.6 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 5000 Logic gates	e3	166 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3020A-7PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		1000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	5.1 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 1500 Logic gates	e3	113 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC2018-100PC68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	7.5 ns	100 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	174 flip-flops; typical gates = 1000-1500	e0	100 MHz		58		24.2316 mm
XC4010XL-1PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	400	Yes	3.6 V	400	CMOS	160	7000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.3 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 10000 Logic gates	e0	200 MHz	30 s	160	225 °C (437 °F)	29.3116 mm
XC4008E-3PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	324	CMOS		6000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	2 ns	324 CLBS, 6000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 8000 Logic gates	e3	125 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC2018-70PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	74	1000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	10 ns	100 CLBS, 1000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	174 flip-flops; typical gates = 1000-1500	e0	70 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC3064-125PC84CSPC0108	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	224	CMOS		6400	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	5.5 ns	224 CLBS, 6400 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 70 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C		125 MHz				29.3116 mm
XC3130-3PC44C	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	34	2000	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	2.7 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.318 mm	16.5862 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700	e0	270 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC6209-2PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	2304	Yes	5.25 V	2304	CMOS		9000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	3 ns	2304 CLBS, 9000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	2304 flip-flops; typical gates = 9000-13000	e0	111 MHz				29.3116 mm
XC3164-5PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes	5.5 V	224	CMOS	70	4000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	4.1 ns	224 CLBS, 4000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500	e0	190 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3020-50PC84CSPC0107	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				29.3116 mm
XC5202-4PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	3.8 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAX available 3000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3030-50PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	74	3000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)		100 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 74 I/OS; 360 flip-flops	e0	50 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC3030-100PC68CSPC0107	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		1500	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	7 ns	100 CLBS, 1500 Gates	0 °C (32 °F)		Quad	S-PQCC-J68		4.445 mm	24.2316 mm	No	360 flip-flops; typical gates = 1500-2000		100 MHz				24.2316 mm
XC2018-33PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes			CMOS	74		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3			No		e0	33 MHz	30 s	74	225 °C (437 °F)
XC3390A-6PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			5		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC3042L-8PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	3.6 V	144	CMOS	74	2000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	6.7 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 3000 Logic gates	e0	80 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC3330L-8PC68C	Xilinx	FPGA		J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			3.3		Chip Carrier				1.27 mm						Quad	S-PQCC-J68		5.08 mm	24.2316 mm	No							24.2316 mm
XC3130-3PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	74	2000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	2.7 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700	e0	270 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC3030-100PC68ISPC0107	Xilinx	FPGA		J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS		1500	5		Chip Carrier			4.5 V	1.27 mm		7 ns	100 CLBS, 1500 Gates			Quad	S-PQCC-J68		4.445 mm	24.2316 mm	No	360 flip-flops; typical gates = 1500-2000		100 MHz				24.2316 mm
XC4010XL-3PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	400	Yes	3.6 V	400	CMOS	160	7000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm		1.6 ns	400 CLBS, 7000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 10000 Logic gates	e0	166 MHz	30 s	160	225 °C (437 °F)	29.3116 mm
XC4002XL-2PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	3.6 V	64	CMOS	64	1000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.5 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 1600 Logic gates	e0	179 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC3090-70PC84CSPC0107	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	320	CMOS		5000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	9 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	928 flip-flops; typical gates = 5000-6000	e0	70 MHz				29.3116 mm
XC3130A-4PC68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	58	1500	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	3.3 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	3	5.08 mm	24.2316 mm	No	Max usable 2000 Logic gates	e0	227 MHz		58		24.2316 mm
XC4003E-4PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	80	2000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		2.7 ns	100 CLBS, 2000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 3000 Logic gates	e0	111 MHz	30 s	80	225 °C (437 °F)	29.3116 mm
XC3030L-8PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	3.6 V	100	CMOS	74	1500	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	6.7 ns	100 CLBS, 1500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 2000 Logic gates	e0	80 MHz	30 s	74	225 °C (437 °F)	29.3116 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.