Automotive Field Programmable Gate Arrays (FPGA) 1,789

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Minimum Operating Temperature	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	No. of Outputs	Length
5CGXBC9E7U19A7N	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm			19 mm
5CGXFC4C7M11A7	Altera	FPGA	Automotive	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B301	1.1 mm	11 mm			11 mm
5CGXFC5E7F23A7	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	2 mm	23 mm			23 mm
5CGXBC7A6U19A7N	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm			19 mm
5CGXFC4B6M13A7N	Altera	FPGA	Automotive	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXBC4F7F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B672	2 mm	27 mm			27 mm
5CGXFC5E7F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B672	2 mm	27 mm			27 mm
5CGXBC9C7U19A7	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm			19 mm
10M16SCE144A7G	Altera	FPGA	Automotive	Gull Wing	144	QFP	Square	Plastic/Epoxy	16000	Yes		CMOS	101		3/3.3 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays		.5 mm	125 °C (257 °F)	-40 °C (-40 °F)	Quad	S-PQFP-G144			No	101
5CGXBC4A6U19A7N	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm			19 mm
10M08DAF256A7	Altera	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy		Yes						Grid Array					125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B256
10M25SCE144A7	Altera	FPGA	Automotive	Gull Wing	144	QFP	Square	Plastic/Epoxy		Yes						Flatpack					125 °C (257 °F)	-40 °C (-40 °F)	Quad	S-PQFP-G144
5CGXFC7F6F23A7N	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	2 mm	23 mm			23 mm
5CEFA4F23A7N	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	2 mm	23 mm			23 mm
5CEBA9F31A7N	Altera	FPGA	Automotive	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B896	2 mm	31 mm			31 mm
5CGXFC5D6F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B672	2 mm	27 mm			27 mm
5CGXBC7C6F31A7	Altera	FPGA	Automotive	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B896	2 mm	31 mm			31 mm
5CGXFC7D7F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B672	2 mm	27 mm			27 mm
5CGXFC5B7F23A7N	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	2 mm	23 mm			23 mm
5CGXBC9D6F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B672	2 mm	27 mm			27 mm
5CGXFC9B7F31A7N	Altera	FPGA	Automotive	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B896	2 mm	31 mm			31 mm
5CGXBC9A6U19A7N	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm			19 mm
5CGXFC3C6U19A7N	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm			19 mm
5CGXFC5C7F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B672	2 mm	27 mm			27 mm
5CGXFC4C7U19A7N	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm			19 mm
5CSXFC5D6U23A7	Altera	FPGA	Automotive	Ball	672	FBGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B672	1.85 mm	23 mm			23 mm
5CSEBA4U23A7SN	Altera	FPGA	Automotive	Ball	672	FBGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B672	1.85 mm	23 mm			23 mm
5CGXBC7B7F31A7	Altera	FPGA	Automotive	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B896	2 mm	31 mm			31 mm
10M04SAU169A7	Altera	FPGA	Automotive	Ball	169	BGA	Square	Plastic/Epoxy		Yes						Grid Array					125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B169
EP4CE15F17A7	Altera	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.25 V			1.2		Grid Array, Low Profile			1.15 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B256	1.55 mm	17 mm			17 mm
5CGXFC5A6M13A7	Altera	FPGA	Automotive	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXBC3E7F23A7	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	2 mm	23 mm			23 mm
5CEFA2F17A7	Altera	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array, Low Profile			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B256	1.55 mm	17 mm			17 mm
5CGXBC7D6F31A7	Altera	FPGA	Automotive	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B896	2 mm	31 mm			31 mm
EP4CE22E22A7	Altera	FPGA	Automotive	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.25 V			1.2		Flatpack, Low Profile, Fine Pitch			1.15 V	.5 mm	125 °C (257 °F)	-40 °C (-40 °F)	Quad	S-PQFP-G144	1.65 mm	20 mm			20 mm
10M08SFE144A7	Altera	FPGA	Automotive	Gull Wing	144	QFP	Square	Plastic/Epoxy		Yes						Flatpack					125 °C (257 °F)	-40 °C (-40 °F)	Quad	S-PQFP-G144
5CGXFC7D7F31A7	Altera	FPGA	Automotive	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B896	2 mm	31 mm			31 mm
5CGTFD9E5F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B672	2 mm	27 mm			27 mm
5CGXFC4B7M13A7N	Altera	FPGA	Automotive	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
10M40DAF256A7	Altera	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy		Yes						Grid Array					125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B256
5CGXFC4E7M13A7N	Altera	FPGA	Automotive	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGTFD9F5F23A7	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	2 mm	23 mm			23 mm
5CGXFC4F6M13A7	Altera	FPGA	Automotive	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
10M04DAU324A7G	Altera	FPGA	Automotive	Ball	324	BGA	Square	Plastic/Epoxy		Yes						Grid Array					125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B324
5CGXBC7D6F23A7	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	2 mm	23 mm			23 mm
5CGTFD5F5U19A7N	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm			19 mm
5CGXFC5D7M13A7N	Altera	FPGA	Automotive	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm
5CGXBC5E7M13A7N	Altera	FPGA	Automotive	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm			13 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.