Automotive Field Programmable Gate Arrays (FPGA) 1,789

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
10M08SAU169A7G	Intel	FPGA	Automotive	Ball	169	BGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500			250		3			Grid Array	BGA169,13X13,32		2.85 V	.8 mm	125 °C (257 °F)		500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169		1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				250		11 mm
XC7S25-1CSGA225Q	Xilinx	FPGA	Automotive	Ball	225	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825			150		1			Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32		.95 V	.8 mm	125 °C (257 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm			e1	1098 MHz		150		13 mm
XC7S25-1CSGA324Q	Xilinx	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825			150		1			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	125 °C (257 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm			e1	1098 MHz		150		15 mm
10M02SCE144A7G	Intel	FPGA	Automotive	Gull Wing	144	QFP	Square	Plastic/Epoxy	2000	Yes	3.15 V	125			246		3		3/3.3 V	Flatpack	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	125 °C (257 °F)		125 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				246		20 mm
10M08SCU169A7G	Intel	FPGA	Automotive	Ball	169	BGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500			250		3		3/3.3 V	Grid Array	BGA169,13X13,32	Field Programmable Gate Arrays	2.85 V	.8 mm	125 °C (257 °F)		500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm	No	Also Operates at 3.3 V nominal supply				250		11 mm
10M08SCE144A7G	Intel	FPGA	Automotive	Gull Wing	144	QFP	Square	Plastic/Epoxy	8000	Yes	3.15 V	500			250		3		3/3.3 V	Flatpack	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	125 °C (257 °F)		500 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				250		20 mm
10M16DAF256A7G	Intel	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000			320		1.2			Grid Array	BGA256,16X16,40		1.15 V	1 mm	125 °C (257 °F)		1000 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm			e1			320		17 mm
10M04SCU169A7G	Intel	FPGA	Automotive	Ball	169	BGA	Square	Plastic/Epoxy	4000	Yes	3.15 V	250			246		3		3/3.3 V	Grid Array	BGA169,13X13,32	Field Programmable Gate Arrays	2.85 V	.8 mm	125 °C (257 °F)		250 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm	No	Also Operates at 3.3 V nominal supply				246		11 mm
10M02SCU169A7G	Intel	FPGA	Automotive	Ball	169	BGA	Square	Plastic/Epoxy	2000	Yes	3.15 V	125			246		3		3/3.3 V	Grid Array	BGA169,13X13,32	Field Programmable Gate Arrays	2.85 V	.8 mm	125 °C (257 °F)		125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm	No	Also Operates at 3.3 V nominal supply				246		11 mm
10M16SCU169A7G	Intel	FPGA	Automotive	Ball	169	BGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000			320		3		3/3.3 V	Grid Array	BGA169,13X13,32	Field Programmable Gate Arrays	2.85 V	.8 mm	125 °C (257 °F)		1000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm	No	Also Operates at 3.3 V nominal supply				320		11 mm
XC7S6-1FTGB196Q	Xilinx	FPGA	Automotive	Ball	196	LFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469			100		1			Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40		.95 V	1 mm	125 °C (257 °F)	1.27 ns	469 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm			e3	1098 MHz		100		15 mm
A3P1000-FGG256T	Microchip Technology	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	AEC-Q100	177	1000000	1.5	Tray	1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1	350 MHz	30 s	177	250 °C (482 °F)	17 mm
XC7S25-1FTGB196Q	Xilinx	FPGA	Automotive	Ball	196	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825			150		1			Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40		.95 V	1 mm	125 °C (257 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm			e3	1098 MHz		150		15 mm
XC7S50-1CSGA324Q	Xilinx	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075			250		1			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	125 °C (257 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm			e1	1098 MHz		250		15 mm
10M08DAF256A7G	Intel	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500			250		1.2			Grid Array	BGA256,16X16,40		1.15 V	1 mm	125 °C (257 °F)		500 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm			e1			250		17 mm
10M16SAU169A7G	Intel	FPGA	Automotive	Ball	169	BGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000			320		3			Grid Array	BGA169,13X13,32		2.85 V	.8 mm	125 °C (257 °F)		1000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169		1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				320		11 mm
10M25DCF484A7G	Intel	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563			360		1.2			Grid Array	BGA484,22X22,40		1.15 V	1 mm	125 °C (257 °F)		1563 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484		2 mm	23 mm			e1			360		23 mm
EP3C5E144A7N	Intel	FPGA	Automotive	Gull Wing	144	QFP	Square	Plastic/Epoxy	5136	Yes	2.625 V	5136	CMOS		94		2.5		1.2/3.3 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	125 °C (257 °F)		5136 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144				No					94
10M25DAF484A7G	Intel	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563			360		1.2			Grid Array	BGA484,22X22,40		1.15 V	1 mm	125 °C (257 °F)		1563 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484		2 mm	23 mm			e1			360		23 mm
LIFCL-40-7BG256A	Lattice Semiconductor	FPGA	Automotive	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI		74		1			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		.95 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm					30 s	74	260 °C (500 °F)	14 mm
EP3C25F324A7N	Intel	FPGA	Automotive	Ball	324	BGA	Square	Plastic/Epoxy	24624	Yes	2.625 V	24624	CMOS		215		2.5		1.2/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	2.375 V	1 mm	125 °C (257 °F)		24624 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324		3.5 mm	19 mm	No					215		19 mm
10M50SCE144A7G	Intel	FPGA	Automotive	Gull Wing	144	QFP	Square	Plastic/Epoxy	50000	Yes	3.15 V	3125			500		3		3/3.3 V	Flatpack	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	125 °C (257 °F)		3125 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				500		20 mm
XA7A50T-1CSG324Q	Xilinx	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075	HKMG	AEC-Q100	210		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	125 °C (257 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	210	260 °C (500 °F)	15 mm
10CL016YU256A7G	Intel	FPGA	Automotive	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	963					1.2			Grid Array, Low Profile, Fine Pitch			1.15 V	.8 mm	125 °C (257 °F)		963 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm								14 mm
10M04SCE144A7G	Intel	FPGA	Automotive	Gull Wing	144	QFP	Square	Plastic/Epoxy	4000	Yes	3.15 V	250			246		3		3/3.3 V	Flatpack	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	125 °C (257 °F)		250 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				246		20 mm
10M02DCU324A7G	Intel	FPGA	Automotive	Ball	324	BGA	Square	Plastic/Epoxy	2000	Yes	1.25 V	125			246		1.2		1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	125 °C (257 °F)		125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No					246		15 mm
EP3C25F256A7N	Intel	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	24624	Yes	2.625 V	24624	CMOS		156		2.5		1.2/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	125 °C (257 °F)		24624 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		3.5 mm	17 mm	No					156		17 mm
XC7S50-1FGGA484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075			250		1			Grid Array	BGA484,22X22,40		.95 V	1 mm	125 °C (257 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm			e1	1098 MHz		250		23 mm
A42MX09-PLG84A	Microchip Technology	FPGA	Automotive	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	684	CMOS			14000	5	Tube		Chip Carrier			4.75 V	1.27 mm	125 °C (257 °F)	2 ns	684 CLBS, 14000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Can also be operated at 5.0 V supply	e3	174 MHz				29.3116 mm
10CL006YU256A7G	Intel	FPGA	Automotive	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	392					1.2			Grid Array, Low Profile, Fine Pitch			1.15 V	.8 mm	125 °C (257 °F)		392 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm								14 mm
A42MX09-PL84A	Microchip Technology	FPGA	Automotive	J Bend	84	QCCJ	Square	Plastic/Epoxy	684	Yes	5.25 V	336	CMOS		104	14000	5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	125 °C (257 °F)	2 ns	336 CLBS, 14000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Can also be operated at 3 V supply	e0	174 MHz		104		29.3116 mm
XC7S6-1CSGA225Q	Xilinx	FPGA	Automotive	Ball	225	LFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469			100		1			Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32		.95 V	.8 mm	125 °C (257 °F)	1.27 ns	469 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm			e1	1098 MHz		100		13 mm
EP4CE6F17A7N	Intel	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy	6272	Yes	1.25 V	392			179		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	125 °C (257 °F)		392 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		179		17 mm
10M16SCU169A7P	Intel	FPGA	Automotive	Ball	169	LFBGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000			320		3			Grid Array, Low Profile, Fine Pitch	BGA169,13X13,32		2.85 V	.8 mm	125 °C (257 °F)		1000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169		1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				320		11 mm
EP4CE22E22A7N	Intel	FPGA	Automotive	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	22320	Yes	1.25 V	1395			79		1.2		1.2,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	125 °C (257 °F)		1395 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	472.5 MHz		79		20 mm
10M16DAF484A7G	Intel	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000			320		1.2			Grid Array	BGA484,22X22,40		1.15 V	1 mm	125 °C (257 °F)		1000 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484		2 mm	23 mm			e1			320		23 mm
XC7S6-1CPGA196Q	Xilinx	FPGA	Automotive	Ball	196	TFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469			100		1			Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		.95 V	.5 mm	125 °C (257 °F)	1.27 ns	469 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.1 mm	8 mm			e3	1098 MHz		100		8 mm
10M25DAF256A7G	Intel	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563			360		1.2			Grid Array	BGA256,16X16,40		1.15 V	1 mm	125 °C (257 °F)		1563 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm			e1			360		17 mm
10CL006YE144A7G	Intel	FPGA	Automotive	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	392					1.2			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			1.15 V	.5 mm	125 °C (257 °F)		392 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm								20 mm
10M08DCU324A7G	Intel	FPGA	Automotive	Ball	324	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500			250		1.2		1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	125 °C (257 °F)		500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No					250		15 mm
10M16DCF256A7G	Intel	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000			320		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	125 °C (257 °F)		1000 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			320		17 mm
A3P250-VQG100T	Microchip Technology	FPGA	Automotive	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	6144	Yes	1.575 V	6144	CMOS	AEC-Q100	68	250000	1.5		1.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	350 MHz	30 s	68	260 °C (500 °F)	14 mm
10M08SAE144A7G	Intel	FPGA	Automotive	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	8000	Yes	3.15 V	500			250		3			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20		2.85 V	.5 mm	125 °C (257 °F)		500 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm		Also Operates at 3.3 V nominal supply				250		20 mm
5CGXFC4C6U19A7N	Intel	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	50000	Yes	1.13 V		CMOS		224		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm	No					224		19 mm
EP4CE6E22A7N	Intel	FPGA	Automotive	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	6272	Yes	1.25 V	392			91		1.2		1.2,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	125 °C (257 °F)		392 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	472.5 MHz		91		20 mm
MPF100T-1FCG484T2	Microchip Technology	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	109000	Yes	1.03 V		CMOS		284		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm		It also Operates at 1.05 V nominal supply				284		23 mm
10CL016YE144A7G	Intel	FPGA	Automotive	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	963					1.2			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			1.15 V	.5 mm	125 °C (257 °F)		963 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm								20 mm
10M25SCE144A7G	Intel	FPGA	Automotive	Gull Wing	144	QFP	Square	Plastic/Epoxy	25000	Yes	3.15 V	1563			360		3		3/3.3 V	Flatpack	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	125 °C (257 °F)		1563 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				360		20 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.