Automotive Field Programmable Gate Arrays (FPGA) 1,789

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XA6SLX75-2CS484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831			328		1.23		Grid Array, Fine Pitch	BGA484,22X22,32		1.2 V	.8 mm	125 °C (257 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			328		19 mm
XA3S1500-4FGG456Q	Xilinx	FPGA	Automotive	Ball	456	BGA	Square	Plastic/Epoxy	29952	Yes				AEC-Q100	333			1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays		1 mm	125 °C (257 °F)			-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3			No		e1	125 MHz	30 s	333	250 °C (482 °F)
XA3S100E-4PQG208Q	Xilinx	FPGA	Automotive	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.26 V	240	CMOS			100000	1.2		Flatpack, Fine Pitch			1.14 V	.5 mm	125 °C (257 °F)	4.88 ns	240 CLBS, 100000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	572 MHz				28 mm
XA6SLX25T-2FG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879			250		1.23		Grid Array	BGA484,22X22,40		1.2 V	1 mm	125 °C (257 °F)	0.26 ns	1879 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e0			250		23 mm
XQ6SLX150T-3FGG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519			296		1.2		Grid Array	BGA484,22X22,40		1.14 V	1 mm	125 °C (257 °F)	0.21 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e1		30 s	296	250 °C (482 °F)	23 mm
XA2S100E-6TQ144Q	Xilinx	FPGA	Automotive	Gull Wing	144	QFP	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS	AEC-Q100	102		1.8	1.2/3.6,1.8 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	125 °C (257 °F)		600 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3			No		e0	357 MHz	30 s	102	225 °C (437 °F)
XCS40XL-4BG256Q	Xilinx	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	784	Yes	3.6 V	784	CMOS		224	13000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	125 °C (257 °F)	1.1 ns	784 CLBS, 13000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates = 40000	e0	217 MHz	30 s	224	225 °C (437 °F)	27 mm
XC2S15-5TQG144Q	Xilinx	FPGA	Automotive	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	2.625 V	96				15000	2.5		Flatpack, Low Profile, Fine Pitch			2.375 V	.5 mm	125 °C (257 °F)		96 CLBS, 15000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3		30 s		260 °C (500 °F)	20 mm
XCS20XL-4PQG208Q	Xilinx	FPGA	Automotive	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	400	CMOS			7000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	1.1 ns	400 CLBS, 7000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates = 20000	e3	217 MHz	30 s		245 °C (473 °F)	28 mm
XC2S200-5FGG456Q	Xilinx	FPGA	Automotive	Ball	456	BGA	Square	Plastic/Epoxy		Yes	2.625 V	864				200000	2.5		Grid Array			2.375 V	1 mm	125 °C (257 °F)		864 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1		30 s		250 °C (482 °F)	23 mm
XC2S50E-6FT256Q	Xilinx	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy	1728	Yes	1.89 V	384	CMOS		182	23000	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	125 °C (257 °F)		384 CLBS, 23000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Maximum no. of gates 50000	e0	357 MHz	30 s	178	240 °C (464 °F)	17 mm
XA3S500E-4CPG132Q	Xilinx	FPGA	Automotive	Ball	132	TFBGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	AEC-Q100	92	500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)	4.88 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	572 MHz	30 s	85	260 °C (500 °F)	8 mm
XQ6SLX150-1LFGG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.05 V	11519			338		1		Grid Array	BGA484,22X22,40		.95 V	1 mm	125 °C (257 °F)	0.46 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e1		30 s	338	250 °C (482 °F)	23 mm
XA3S400-4PQG208Q	Xilinx	FPGA	Automotive	Gull Wing	208	FQFP	Square	Plastic/Epoxy	8064	Yes	1.26 V	896		AEC-Q100	264	400000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)		896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	125 MHz	30 s	264	245 °C (473 °F)	28 mm
XA3S1600E-4TQG144Q	Xilinx	FPGA	Automotive	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS			1600000	1.2		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm	125 °C (257 °F)	4.88 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	572 MHz	30 s		260 °C (500 °F)	20 mm
XC2S150-5PQ208Q	Xilinx	FPGA	Automotive	Gull Wing	208	FQFP	Square	Plastic/Epoxy	3888	Yes	2.625 V	864	CMOS		144	150000	2.5	1.5/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	125 °C (257 °F)		864 CLBS, 150000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	263 MHz	30 s	140	225 °C (437 °F)	28 mm
XC2S200-5FG456Q	Xilinx	FPGA	Automotive	Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	864	CMOS		288	200000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	125 °C (257 °F)		864 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	263 MHz	30 s	284	225 °C (437 °F)	23 mm
XC2S100-5FG256Q	Xilinx	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600	CMOS		180	100000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	125 °C (257 °F)		600 CLBS, 100000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	263 MHz	30 s	176	225 °C (437 °F)	17 mm
XA3S500E-4TQG144Q	Xilinx	FPGA	Automotive	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS			500000	1.2		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm	125 °C (257 °F)	4.88 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	572 MHz	30 s		260 °C (500 °F)	20 mm
XA3S1000-4FGG456Q	Xilinx	FPGA	Automotive	Ball	456	BGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920		AEC-Q100	391	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		1920 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	125 MHz	30 s	391	250 °C (482 °F)	23 mm
XQ6SLX150T-3FGG676Q	Xilinx	FPGA	Automotive	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519			396		1.2		Grid Array	BGA676,26X26,40		1.14 V	1 mm	125 °C (257 °F)	0.21 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm			e1		30 s	396	250 °C (482 °F)	27 mm
XA3S200-4PQG208Q	Xilinx	FPGA	Automotive	Gull Wing	208	FQFP	Square	Plastic/Epoxy	4320	Yes	1.26 V	480		AEC-Q100	173	200000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)		480 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	125 MHz	30 s	173	245 °C (473 °F)	28 mm
XQ6SLX75-2CS484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831			280		1.23		Grid Array, Fine Pitch	BGA484,22X22,32		1.2 V	.8 mm	125 °C (257 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			280		19 mm
XA3S400-4PQ208Q	Xilinx	FPGA	Automotive	Gull Wing	208	FQFP	Square	Plastic/Epoxy	8064	Yes	1.26 V	896		AEC-Q100	264	400000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)		896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	125 MHz	30 s	264	225 °C (437 °F)	28 mm
XC2S150-5FG256Q	Xilinx	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	3888	Yes	2.625 V	864	CMOS		180	150000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	125 °C (257 °F)		864 CLBS, 150000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	263 MHz	30 s	176	225 °C (437 °F)	17 mm
XC2S100-5TQG144Q	Xilinx	FPGA	Automotive	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	2.625 V	600				100000	2.5		Flatpack, Low Profile, Fine Pitch			2.375 V	.5 mm	125 °C (257 °F)		600 CLBS, 100000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3		30 s		260 °C (500 °F)	20 mm
XA3S400-4FTG256Q	Xilinx	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896		AEC-Q100	264	400000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	125 MHz	30 s	264	260 °C (500 °F)	17 mm
XQ6SLX150T-3FG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519			296		1.2		Grid Array	BGA484,22X22,40		1.14 V	1 mm	125 °C (257 °F)	0.21 ns	11519 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e0			296		23 mm
XA6SLX45T-2FG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411			296		1.23		Grid Array	BGA484,22X22,40		1.2 V	1 mm	125 °C (257 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e0			296		23 mm
XA7A50T-1CPG236Q	Xilinx	FPGA	Automotive	Ball	236	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075	HKMG	AEC-Q100	106		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20	Field Programmable Gate Arrays	.95 V	.5 mm	125 °C (257 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm	No		e8	1098 MHz	30 s	106	260 °C (500 °F)	10 mm
XA3S1200E-4CPG132Q	Xilinx	FPGA	Automotive	Ball	132	TFBGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS			1200000	1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.5 mm	125 °C (257 °F)	4.88 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	572 MHz				8 mm
XA3S1600E-4PQG208Q	Xilinx	FPGA	Automotive	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.26 V	3688	CMOS			1600000	1.2		Flatpack, Fine Pitch			1.14 V	.5 mm	125 °C (257 °F)	4.88 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	572 MHz				28 mm
XQ6SLX150-1LCS484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes	1.05 V	11519			338		1		Grid Array, Fine Pitch	BGA484,22X22,32		.95 V	.8 mm	125 °C (257 °F)	0.46 ns	11519 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			338		19 mm
XA3S1500-4FG456Q	Xilinx	FPGA	Automotive	Ball	456	BGA	Square	Plastic/Epoxy	29952	Yes				AEC-Q100	333			1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays		1 mm	125 °C (257 °F)			-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3			No		e0	125 MHz	30 s	333	225 °C (437 °F)
XC2S100-5TQ144Q	Xilinx	FPGA	Automotive	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2700	Yes	2.625 V	600	CMOS		96	100000	2.5	1.5/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	125 °C (257 °F)		600 CLBS, 100000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	263 MHz	30 s	92	225 °C (437 °F)	20 mm
XA3S200-4VQG100Q	Xilinx	FPGA	Automotive	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	4320	Yes	1.26 V	480		AEC-Q100	173	200000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)		480 CLBS, 200000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	125 MHz	30 s	173	260 °C (500 °F)	14 mm
XC2S300E-6FG456Q	Xilinx	FPGA	Automotive	Ball	456	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS		329	93000	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	125 °C (257 °F)		1536 CLBS, 93000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum no. of gates 300000	e0	357 MHz	30 s	329	225 °C (437 °F)	23 mm
XA3S1200E-4FGG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS			1200000	1.2		Grid Array			1.14 V	1 mm	125 °C (257 °F)	4.88 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	572 MHz	30 s		250 °C (482 °F)	23 mm
XA7S25-1CSGA324Q4875	Xilinx	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825		AEC-Q100; TS 16949	150		1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	125 °C (257 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324	3	1.5 mm	15 mm					10 s	150	260 °C (500 °F)	15 mm
XA3S400-4FT256Q	Xilinx	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896		AEC-Q100	264	400000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	125 MHz	30 s	264	225 °C (437 °F)	17 mm
XC2S100-5PQ208Q	Xilinx	FPGA	Automotive	Gull Wing	208	FQFP	Square	Plastic/Epoxy	2700	Yes	2.625 V	600	CMOS		144	100000	2.5	1.5/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	125 °C (257 °F)		600 CLBS, 100000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	263 MHz	30 s	140	225 °C (437 °F)	28 mm
XC2S150-5FGG256Q	Xilinx	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	864				150000	2.5		Grid Array			2.375 V	1 mm	125 °C (257 °F)		864 CLBS, 150000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1					17 mm
XQ6SLX75-2FG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831			280		1.23		Grid Array	BGA484,22X22,40		1.2 V	1 mm	125 °C (257 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e0			280		23 mm
XA3S500E-4FGG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS			500000	1.2		Grid Array			1.14 V	1 mm	125 °C (257 °F)	4.88 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	572 MHz	30 s		250 °C (482 °F)	23 mm
XA6SLX45-3CSG484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411			320		1.2		Grid Array, Fine Pitch	BGA484,22X22,32		1.14 V	.8 mm	125 °C (257 °F)	0.21 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e1			320		19 mm
XC2S300E-6PQ208Q	Xilinx	FPGA	Automotive	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS		146	93000	1.8	1.2/3.6,1.8 V	Flatpack, Heat Sink/Slug, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	125 °C (257 °F)		1536 CLBS, 93000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates = 300000	e0	357 MHz	30 s	146	225 °C (437 °F)	28 mm
XA3S50-4VQ100Q	Xilinx	FPGA	Automotive	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	1728	Yes	1.26 V	192		AEC-Q100	124	50000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)		192 CLBS, 50000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	125 MHz	30 s	124	240 °C (464 °F)	14 mm
XA6SLX75T-3FG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831			268		1.23		Grid Array	BGA484,22X22,40		1.2 V	1 mm	125 °C (257 °F)	0.21 ns	5831 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e0			268		23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.