Automotive Field Programmable Gate Arrays (FPGA) 1,789

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XA7A75T-1CSG324Q	Xilinx	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900	HKMG	AEC-Q100	210		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	125 °C (257 °F)	1.27 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	210	260 °C (500 °F)	15 mm
XA3S500E-4CPG132Q	Xilinx	FPGA	Automotive	Ball	132	TFBGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	AEC-Q100	92	500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)	4.88 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	572 MHz	30 s	85	260 °C (500 °F)	8 mm
XQ6SLX150-1LFGG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.05 V	11519			338		1		Grid Array	BGA484,22X22,40		.95 V	1 mm	125 °C (257 °F)	0.46 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e1		30 s	338	250 °C (482 °F)	23 mm
XA3S400-4PQG208Q	Xilinx	FPGA	Automotive	Gull Wing	208	FQFP	Square	Plastic/Epoxy	8064	Yes	1.26 V	896		AEC-Q100	264	400000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)		896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	125 MHz	30 s	264	245 °C (473 °F)	28 mm
XA3S1600E-4TQG144Q	Xilinx	FPGA	Automotive	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS			1600000	1.2		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm	125 °C (257 °F)	4.88 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	572 MHz	30 s		260 °C (500 °F)	20 mm
XC2S150-5PQ208Q	Xilinx	FPGA	Automotive	Gull Wing	208	FQFP	Square	Plastic/Epoxy	3888	Yes	2.625 V	864	CMOS		144	150000	2.5	1.5/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	125 °C (257 °F)		864 CLBS, 150000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	263 MHz	30 s	140	225 °C (437 °F)	28 mm
XC2S200-5FG456Q	Xilinx	FPGA	Automotive	Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	864	CMOS		288	200000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	125 °C (257 °F)		864 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	263 MHz	30 s	284	225 °C (437 °F)	23 mm
XC2S100-5FG256Q	Xilinx	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600	CMOS		180	100000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	125 °C (257 °F)		600 CLBS, 100000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	263 MHz	30 s	176	225 °C (437 °F)	17 mm
XA3S500E-4TQG144Q	Xilinx	FPGA	Automotive	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS			500000	1.2		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm	125 °C (257 °F)	4.88 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	572 MHz	30 s		260 °C (500 °F)	20 mm
XA2S300E-6FT256Q	Xilinx	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	AEC-Q100	182		1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	125 °C (257 °F)		1536 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3			No		e0	357 MHz	30 s	182	240 °C (464 °F)
XC2S200-5PQG208Q	Xilinx	FPGA	Automotive	Gull Wing	208	FQFP	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176			144	200000	2.5		Flatpack, Fine Pitch	QFP208,1.2SQ,20		2.375 V	.5 mm	125 °C (257 °F)		1176 CLBS, 200000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3		30 s	140	245 °C (473 °F)	28 mm
XA3S1500-4FGG676Q	Xilinx	FPGA	Automotive	Ball	676	BGA	Square	Plastic/Epoxy	29952	Yes				AEC-Q100	487			1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm	125 °C (257 °F)			-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3			No		e1	125 MHz	30 s	487	260 °C (500 °F)
XQ6SLX150-2CSG484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519			338		1.23		Grid Array, Fine Pitch	BGA484,22X22,32		1.2 V	.8 mm	125 °C (257 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e1			338		19 mm
XCS40XL-4BGG256Q	Xilinx	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS			13000	3.3		Grid Array			3 V	1.27 mm	125 °C (257 °F)	1.1 ns	784 CLBS, 13000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates = 40000	e1	217 MHz	30 s		250 °C (482 °F)	27 mm
XA7A35T-1CPG236Q	Xilinx	FPGA	Automotive	Ball	236	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600	HKMG	AEC-Q100	106		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20	Field Programmable Gate Arrays	.95 V	.5 mm	125 °C (257 °F)	1.27 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm	No		e1	1098 MHz	30 s	106	260 °C (500 °F)	10 mm
EP4CE6E22A7	Altera	FPGA	Automotive	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.25 V						1.2		Flatpack, Low Profile, Fine Pitch			1.15 V	.5 mm	125 °C (257 °F)			-40 °C (-40 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm								20 mm
5CGXFC5E7F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
10M08DAV81A7	Altera	FPGA	Automotive	Ball	81	BGA	Square	Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B81
5CGXFC5E6U19A7	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
10M04DAU324A7	Altera	FPGA	Automotive	Ball	324	BGA	Square	Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B324
10M16DCF484A7G	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484						e1
5CGXFC3A7F23A7N	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
5CGXFC7D7F31A7N	Altera	FPGA	Automotive	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B896		2 mm	31 mm								31 mm
5CGXBC5F7M13A7N	Altera	FPGA	Automotive	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm								13 mm
5CGXFC4E6U19A7N	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5CGXBC3E7F23A7N	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
5CGXBC7E7U19A7	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5CGXFC5A7F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5CGXFC9D6U19A7	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5CGXFC9C7F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5CEBA7F31A7N	Altera	FPGA	Automotive	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B896		2 mm	31 mm								31 mm
5CGXBC5C7U19A7N	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5CGXFC4A6M11A7N	Altera	FPGA	Automotive	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B301		1.1 mm	11 mm								11 mm
5CSEMA4U19A7	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5CGXBC7B6F23A7N	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
5CGXFC5C6F23A7	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	77000	Yes	1.13 V		CMOS		240		1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					240		23 mm
5CGXFC5D7F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5CGTFD5F5F23A7N	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
5CGXFC9D7F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5CGXBC7B7F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5CGXBC9F6F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
10M02SAE144A7G	Altera	FPGA	Automotive	Gull Wing	144	QFP	Square	Plastic/Epoxy		Yes									Flatpack					125 °C (257 °F)			-40 °C (-40 °F)		Quad	S-PQFP-G144
5CGXFC5C7U19A7N	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5CGXBC5C6M13A7N	Altera	FPGA	Automotive	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm								13 mm
5CGXBC4F7M13A7N	Altera	FPGA	Automotive	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm								13 mm
5CGXBC5C6F23A7	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
5CGXFC7A6F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5CGXFC3B7F23A7N	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.