Automotive Field Programmable Gate Arrays (FPGA) 1,789

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XQ6SLX150-2FGG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519			338		1.23		Grid Array	BGA484,22X22,40		1.2 V	1 mm	125 °C (257 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e1		30 s	338	250 °C (482 °F)	23 mm
XA3S1200E-4FTG256Q	Xilinx	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS	AEC-Q100	190	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)	4.88 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	572 MHz	30 s	150	260 °C (500 °F)	17 mm
XA7S50-1CSGA324Q4928	Xilinx	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		AEC-Q100; TS 16949	210		1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	125 °C (257 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324	3	1.5 mm	15 mm					10 s	210	260 °C (500 °F)	15 mm
XA3S200A-4FGG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS			200000	1.2		Grid Array			1.14 V	1 mm	125 °C (257 °F)	4.88 ns	448 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s		250 °C (482 °F)	23 mm
XA6SLX45-2CSG484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411			320		1.23		Grid Array, Fine Pitch	BGA484,22X22,32		1.2 V	.8 mm	125 °C (257 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e1			320		19 mm
XA3S1200E-4FGG400Q	Xilinx	FPGA	Automotive	Ball	400	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS	AEC-Q100	304	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)	4.88 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	572 MHz	30 s	232	250 °C (482 °F)	21 mm
XC2S50-5TQG144Q	Xilinx	FPGA	Automotive	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	2.625 V	384				50000	2.5		Flatpack, Low Profile, Fine Pitch			2.375 V	.5 mm	125 °C (257 °F)		384 CLBS, 50000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3		30 s		260 °C (500 °F)	20 mm
XQ6SLX75T-2CSG484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831			292		1.23		Grid Array, Fine Pitch	BGA484,22X22,32		1.2 V	.8 mm	125 °C (257 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e1			292		19 mm
XA3SD1800A-4CSG484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS	AEC-Q100	309	37440	1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	125 °C (257 °F)	0.71 ns	4160 CLBS, 37440 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	667 MHz	30 s	249	260 °C (500 °F)	19 mm
XCS05XL-4VQ100Q	Xilinx	FPGA	Automotive	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	100	Yes	3.6 V	100	CMOS		77	2000	3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	3 V	.5 mm	125 °C (257 °F)	1.1 ns	100 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin/Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Maximum usable gates = 5000	e0	217 MHz	30 s	77	240 °C (464 °F)	14 mm
XQ6SLX75-1LFGG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.05 V	5831			280		1		Grid Array	BGA484,22X22,40		.95 V	1 mm	125 °C (257 °F)	0.46 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e1		30 s	280	250 °C (482 °F)	23 mm
XQ6SLX150-1LCSG484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes	1.05 V	11519			338		1		Grid Array, Fine Pitch	BGA484,22X22,32		.95 V	.8 mm	125 °C (257 °F)	0.46 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e1			338		19 mm
XQ6SLX150T-2FGG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519			296		1.23		Grid Array	BGA484,22X22,40		1.2 V	1 mm	125 °C (257 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e1		30 s	296	250 °C (482 °F)	23 mm
XA7A15T-1CPG236Q	Xilinx	FPGA	Automotive	Ball	236	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300	HKMG	AEC-Q100; TS 16949	210		1		Grid Array, Low Profile, Fine Pitch			.95 V	.5 mm	125 °C (257 °F)	1.27 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1098 MHz	30 s	210	260 °C (500 °F)	10 mm
XQ6SLX75T-2FGG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831			268		1.23		Grid Array	BGA484,22X22,40		1.2 V	1 mm	125 °C (257 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e1		30 s	268	250 °C (482 °F)	23 mm
5CSEMA5U19A7N	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5CGXFC7B6F31A7	Altera	FPGA	Automotive	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B896		2 mm	31 mm								31 mm
5CGXFC7F6F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5CGXFC5D7M11A7	Altera	FPGA	Automotive	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B301		1.1 mm	11 mm								11 mm
5CGTFD9F5U19A7N	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5CGXFC5E6U19A7N	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
10M04DFU324A7G	Altera	FPGA	Automotive	Ball	324	BGA	Square	Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B324
5CGXFC9F7F31A7N	Altera	FPGA	Automotive	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B896		2 mm	31 mm								31 mm
5CGXBC4B7M13A7N	Altera	FPGA	Automotive	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm								13 mm
5CGXBC4D7U19A7N	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5CGXBC5D7M11A7	Altera	FPGA	Automotive	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B301		1.1 mm	11 mm								11 mm
5CSXFC5C6F23A7	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
5CEBA9F31A7	Altera	FPGA	Automotive	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B896		2 mm	31 mm								31 mm
5CGXBC9C6U19A7	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5CGXBC4E7F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5CGXBC4D6F23A7	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
5CEBA2U15A7N	Altera	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm								15 mm
5CGTFD5C5F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
10M50DCF672A7G	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672						e1
5CGXFC3B7F23A7	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
10M40DCF672A7G	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672						e1
5CGTFD7C5F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5CGTFD9A5F23A7	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
5CGXBC9B7U19A7	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5CGXFC3C7U19A7N	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5CGXFC4A7M13A7N	Altera	FPGA	Automotive	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm								13 mm
5CGXBC9C7U19A7N	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5CGXFC9A7F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5CGXFC4A6F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5CGXBC9E6F23A7	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
10M50DFF256A7	Altera	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256
5CGXFC7C6F31A7	Altera	FPGA	Automotive	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B896		2 mm	31 mm								31 mm
5CGTFD7C5F31A7N	Altera	FPGA	Automotive	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B896		2 mm	31 mm								31 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.