Automotive Field Programmable Gate Arrays (FPGA) 1,789

Reset All
Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

5CGXBC5B7F23A7N

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

10M08SFM153A7G

Altera

FPGA

Automotive

Ball

153

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B153

5CSEMA2U23A7N

Altera

FPGA

Automotive

Ball

672

FBGA

Square

Plastic/Epoxy

25000

Yes

1.13 V

CMOS

145

1.1

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA672,28X28,32

Field Programmable Gate Arrays

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

1.85 mm

23 mm

No

145

23 mm

5CGXBC5C7M13A7

Altera

FPGA

Automotive

Ball

383

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B383

1.1 mm

13 mm

13 mm

5CGXBC9E6U19A7

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXFC5D7F27A7N

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CGXBC4B7M11A7

Altera

FPGA

Automotive

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CSEBA4U23A7S

Altera

FPGA

Automotive

Ball

672

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

1.85 mm

23 mm

23 mm

5CGXBC9D6F23A7

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXBC3E6U19A7

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CSXFC4C6U23A7

Altera

FPGA

Automotive

Ball

672

FBGA

Square

Plastic/Epoxy

40000

Yes

1.13 V

CMOS

145

1.1

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA672,28X28,32

Field Programmable Gate Arrays

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

1.85 mm

23 mm

No

145

23 mm

5CGXBC4B7U19A7

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC9C7F27A7N

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CGXFC3E6F23A7

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXFC5F7F27A7

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CGXFC5F7M13A7

Altera

FPGA

Automotive

Ball

383

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B383

1.1 mm

13 mm

13 mm

5CGXBC4D7M11A7

Altera

FPGA

Automotive

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXFC4D7M13A7

Altera

FPGA

Automotive

Ball

383

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B383

1.1 mm

13 mm

13 mm

5CEFA2F23A7

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXBC9D7F31A7

Altera

FPGA

Automotive

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B896

2 mm

31 mm

31 mm

5CGTFD9E5F31A7

Altera

FPGA

Automotive

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B896

2 mm

31 mm

31 mm

5CEBA5M13A7

Altera

FPGA

Automotive

Ball

383

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B383

1.1 mm

13 mm

13 mm

10M25DFF484A7G

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

e1

5CGXBC5A7F23A7

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXBC7E7F27A7

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

10M08DAU324A7

Altera

FPGA

Automotive

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

10M50DFF672A7

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

5CGXFC5F7M11A7N

Altera

FPGA

Automotive

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXFC9B6F31A7

Altera

FPGA

Automotive

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B896

2 mm

31 mm

31 mm

5CGTFD7A5U19A7N

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC3E7U19A7

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

10M02SAM153A7G

Altera

FPGA

Automotive

Ball

153

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B153

5CGXBC5A7M11A7N

Altera

FPGA

Automotive

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC9F6F31A7N

Altera

FPGA

Automotive

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B896

2 mm

31 mm

31 mm

5CGXFC7F7F23A7N

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXFC3C7U19A7

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXFC4D6M13A7

Altera

FPGA

Automotive

Ball

383

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B383

1.1 mm

13 mm

13 mm

5CGXFC4A7U19A7

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGTFD7F5U19A7

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CSEMA6F31A7S

Altera

FPGA

Automotive

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B896

2 mm

31 mm

31 mm

5CGXFC5B7F27A7N

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CGXBC4B6F27A7

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CGXBC9A7U19A7N

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC4C6F23A7

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXBC5C7U19A7

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC9D6F31A7

Altera

FPGA

Automotive

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B896

2 mm

31 mm

31 mm

5CGXFC5F6F23A7N

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXBC5A6M11A7

Altera

FPGA

Automotive

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.