Automotive Field Programmable Gate Arrays (FPGA) 1,789

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of CLBs	Nominal Supply Voltage (V)	Package Style (Meter)	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
5CGXBC5D7U19A7	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	Yes	1.13 V		1.1	Grid Array, Fine Pitch	1.07 V	.8 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm						19 mm
10M04DAF256A7	Altera	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	Yes				Grid Array			125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B256
5CGXFC4E7U19A7	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	Yes	1.13 V		1.1	Grid Array, Fine Pitch	1.07 V	.8 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm						19 mm
5CGXFC3F7U19A7	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	Yes	1.13 V		1.1	Grid Array, Fine Pitch	1.07 V	.8 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm						19 mm
5CGXFC4F7U19A7N	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	Yes	1.13 V		1.1	Grid Array, Fine Pitch	1.07 V	.8 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm						19 mm
5CGXFC5A7F23A7N	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	Yes	1.13 V		1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm						23 mm
EP2C8AF256A7N	Altera	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy	Yes	1.25 V	516	1.2	Grid Array, Low Profile	1.15 V	1 mm	125 °C (257 °F)	516 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	450 MHz	40 s	260 °C (500 °F)	17 mm
5CGTFD7B5F31A7	Altera	FPGA	Automotive	Ball	896	BGA	Square	Plastic/Epoxy	Yes	1.13 V		1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B896		2 mm	31 mm						31 mm
10M08SCE144A7	Altera	FPGA	Automotive	Gull Wing	144	QFP	Square	Plastic/Epoxy	Yes				Flatpack			125 °C (257 °F)		-40 °C (-40 °F)		Quad	S-PQFP-G144
5CGXFC5B6F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy	Yes	1.13 V		1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5CGTFD9D5F23A7N	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	Yes	1.13 V		1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm						23 mm
5CEBA5F23A7	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	Yes	1.13 V		1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm						23 mm
10M04DCF256A7	Altera	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	Yes				Grid Array			125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B256

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.