Automotive Field Programmable Gate Arrays (FPGA) 1,789

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Nominal Supply Voltage (V)	Package Style (Meter)	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Minimum Operating Temperature	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Length
5CGXBC7E7F23A7	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	2 mm	23 mm	23 mm
5CGXFC4C6F23A7N	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	2 mm	23 mm	23 mm
5CGXBC4C7M13A7N	Altera	FPGA	Automotive	Ball	383	TFBGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array, Thin Profile, Fine Pitch	1.07 V	.5 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm	13 mm
5CGXBC5E7U19A7	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array, Fine Pitch	1.07 V	.8 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm	19 mm
5CEBA9F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B672	2 mm	27 mm	27 mm
5CGXFC9B6U19A7N	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array, Fine Pitch	1.07 V	.8 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm	19 mm
5CGXFC5E6F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B672	2 mm	27 mm	27 mm
5CGXBC9B6F23A7N	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	2 mm	23 mm	23 mm
5CSEBA6F31A7SN	Altera	FPGA	Automotive	Ball	896	BGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B896	2 mm	31 mm	31 mm
5CGXFC4A6F23A7	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	2 mm	23 mm	23 mm
5CGXBC9A7U19A7	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array, Fine Pitch	1.07 V	.8 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm	19 mm
5CGXFC9C7U19A7	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array, Fine Pitch	1.07 V	.8 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm	19 mm
10M08DFF484A7	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	Yes			Grid Array			125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484
10M08SAE144A7	Altera	FPGA	Automotive	Gull Wing	144	QFP	Square	Plastic/Epoxy	Yes			Flatpack			125 °C (257 °F)	-40 °C (-40 °F)	Quad	S-PQFP-G144
5CGXFC3D7F23A7N	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	2 mm	23 mm	23 mm
5CGXBC4A7U19A7N	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array, Fine Pitch	1.07 V	.8 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm	19 mm
5CGTFD9C5U19A7	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array, Fine Pitch	1.07 V	.8 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm	19 mm
5CGXFC4D6F23A7	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	2 mm	23 mm	23 mm
5CGXBC3D7U19A7N	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array, Fine Pitch	1.07 V	.8 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm	19 mm
5CGTFD7B5F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B672	2 mm	27 mm	27 mm
5CGXBC7F6F31A7N	Altera	FPGA	Automotive	Ball	896	BGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B896	2 mm	31 mm	31 mm
5CGTFD5A5F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B672	2 mm	27 mm	27 mm
5CGXBC5D6F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B672	2 mm	27 mm	27 mm
5CGXBC3B7F23A7N	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	2 mm	23 mm	23 mm
5CGXBC7C7U19A7	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array, Fine Pitch	1.07 V	.8 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm	19 mm
5CGXBC5C6F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B672	2 mm	27 mm	27 mm
5CEBA2U15A7	Altera	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array, Low Profile, Fine Pitch	1.07 V	.8 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B324	1.5 mm	15 mm	15 mm
5CGXFC5E7U19A7	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array, Fine Pitch	1.07 V	.8 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm	19 mm
5CGXFC4B6M11A7N	Altera	FPGA	Automotive	Ball	301	TFBGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array, Thin Profile, Fine Pitch	1.07 V	.5 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B301	1.1 mm	11 mm	11 mm
5CGXBC4E6M13A7	Altera	FPGA	Automotive	Ball	383	TFBGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array, Thin Profile, Fine Pitch	1.07 V	.5 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm	13 mm
5CGTFD9A5F31A7	Altera	FPGA	Automotive	Ball	896	BGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B896	2 mm	31 mm	31 mm
5CGXFC4E7F23A7	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	2 mm	23 mm	23 mm
5CGXFC7C7F31A7N	Altera	FPGA	Automotive	Ball	896	BGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B896	2 mm	31 mm	31 mm
5CGXFC9C7F23A7	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	2 mm	23 mm	23 mm
5CGXFC5B6M13A7	Altera	FPGA	Automotive	Ball	383	TFBGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array, Thin Profile, Fine Pitch	1.07 V	.5 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm	13 mm
5CEBA5M13A7N	Altera	FPGA	Automotive	Ball	383	TFBGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array, Thin Profile, Fine Pitch	1.07 V	.5 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm	13 mm
5CGXBC5D7M13A7N	Altera	FPGA	Automotive	Ball	383	TFBGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array, Thin Profile, Fine Pitch	1.07 V	.5 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm	13 mm
10M04DFF256A7	Altera	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	Yes			Grid Array			125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B256
5CGXFC5F6M11A7	Altera	FPGA	Automotive	Ball	301	TFBGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array, Thin Profile, Fine Pitch	1.07 V	.5 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B301	1.1 mm	11 mm	11 mm
5CGTFD9B5U19A7N	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array, Fine Pitch	1.07 V	.8 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm	19 mm
5CGXFC4E7F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B672	2 mm	27 mm	27 mm
5CGXBC4D7M13A7N	Altera	FPGA	Automotive	Ball	383	TFBGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array, Thin Profile, Fine Pitch	1.07 V	.5 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm	13 mm
5CGTFD7F5F23A7N	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	2 mm	23 mm	23 mm
5CSEMA5U19A7SN	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array, Fine Pitch	1.07 V	.8 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm	19 mm
5CGXBC5C7F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B672	2 mm	27 mm	27 mm
5CGXBC7D6F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array	1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B672	2 mm	27 mm	27 mm
5CGXBC5D6M13A7	Altera	FPGA	Automotive	Ball	383	TFBGA	Square	Plastic/Epoxy	Yes	1.13 V	1.1	Grid Array, Thin Profile, Fine Pitch	1.07 V	.5 mm	125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B383	1.1 mm	13 mm	13 mm
10M04SCM153A7G	Altera	FPGA	Automotive	Ball	153	BGA	Square	Plastic/Epoxy	Yes			Grid Array			125 °C (257 °F)	-40 °C (-40 °F)	Bottom	S-PBGA-B153

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.