Automotive Field Programmable Gate Arrays (FPGA) 1,789

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XA3S250E-4FTG256Q	Xilinx	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	AEC-Q100	172	250000	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)	4.88 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	572 MHz	30 s	132	260 °C (500 °F)	17 mm
10M04DCU324A7G	Intel	FPGA	Automotive	Ball	324	BGA	Square	Plastic/Epoxy	4000	Yes	1.25 V	250			246		1.2		1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	125 °C (257 °F)		250 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No					246		15 mm
5CEFA9U19A7N	Intel	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS		240		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm	No					240		19 mm
5CGXFC5C6F23A7N	Intel	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	77000	Yes	1.13 V		CMOS		240		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			240		23 mm
EP3C10E144A7N	Intel	FPGA	Automotive	Gull Wing	144	QFP	Square	Plastic/Epoxy	10320	Yes	2.625 V	10320	CMOS		94		2.5		1.2/3.3 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	125 °C (257 °F)		10320 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3			No		e3			94
EP3C16F256A7N	Intel	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	15408	Yes	2.625 V	15408	CMOS		168		2.5		1.2/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	125 °C (257 °F)		15408 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		3.5 mm	17 mm	No					168		17 mm
EP3C40F484A7N	Intel	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	39600	Yes	2.625 V	39600	CMOS		331		2.5		1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	125 °C (257 °F)		39600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	3.5 mm	23 mm	No		e1			331		23 mm
EP4CE10E22A7N	Intel	FPGA	Automotive	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	10320	Yes	1.25 V	645			91		1.2		1.2,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	125 °C (257 °F)		645 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	472.5 MHz		91		20 mm
LAMXO2280E-3FTN324E	Lattice Semiconductor	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy	2280	Yes	1.26 V	285		AEC-Q100	271		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		285 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.7 mm	19 mm	No		e1		30 s	271	260 °C (500 °F)	19 mm
LAMXO640C-3FTN256E	Lattice Semiconductor	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy	640	Yes	3.465 V	80		AEC-Q100	159		1.8		1.8/2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	125 °C (257 °F)		80 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also Operates at 2.5 V and 3.3 V nominal supply	e1		40 s	159	260 °C (500 °F)	17 mm
LAMXO640C-3TN144E	Lattice Semiconductor	FPGA	Automotive	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	640	Yes	3.465 V	80		AEC-Q100	113		1.8	Tray	1.8/2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	125 °C (257 °F)		80 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Also Operates at 2.5 V and 3.3 V nominal supply	e3		40 s	113	260 °C (500 °F)	20 mm
LIFCL-40-7MG121A	Lattice Semiconductor	FPGA	Automotive	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI		48		1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm					30 s	48	260 °C (500 °F)	6 mm
XA3S100E-4TQG144Q	Xilinx	FPGA	Automotive	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS	AEC-Q100	108	100000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)	4.88 ns	240 CLBS, 100000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	572 MHz	30 s	80	260 °C (500 °F)	20 mm
XA3S250E-4VQG100Q	Xilinx	FPGA	Automotive	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	AEC-Q100	66	250000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)	4.88 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	572 MHz	30 s	59	260 °C (500 °F)	14 mm
XA3S700A-4FGG400Q	Xilinx	FPGA	Automotive	Ball	400	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS	AEC-Q100	311	700000	1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)	4.88 ns	1472 CLBS, 700000 Gates	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	667 MHz	30 s	248	250 °C (482 °F)	21 mm
XA6SLX45-2FGG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes				AEC-Q100	316		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm	125 °C (257 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	62.5 MHz	30 s	316	250 °C (482 °F)	23 mm
XC7S100-1FGGA676Q	Xilinx	FPGA	Automotive	Ball	676	BGA	Square	Plastic/Epoxy	102400	Yes	1.05 V	8000	HKMG		400		1			Grid Array	BGA676,26X26,40		.95 V	1 mm	125 °C (257 °F)	1.27 ns	8000 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B676		2.44 mm	27 mm			e3	1098 MHz		400		27 mm
A3P060-FGG144T	Microchip Technology	FPGA	Automotive	Ball	144	LBGA	Square	Plastic/Epoxy	1536	Yes	1.575 V	1536	CMOS	AEC-Q100	96	60000	1.5		1.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)		1536 CLBS, 60000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s	96	260 °C (500 °F)	13 mm
A3P1000-1FG256T	Microchip Technology	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	AEC-Q100	177	1000000	1.5	Tray	1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e0	350 MHz		177		17 mm
XCS30XL-4PQ208Q	Xilinx	FPGA	Automotive	Gull Wing	208	FQFP	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS		192	10000	3.3		3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	125 °C (257 °F)	1.1 ns	576 CLBS, 10000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates = 30000	e0	217 MHz	30 s	192	225 °C (437 °F)	28 mm
XA3S50-4PQG208Q	Xilinx	FPGA	Automotive	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1728	Yes	1.26 V	192		AEC-Q100	124	50000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)		192 CLBS, 50000 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	125 MHz	30 s	124	245 °C (473 °F)	28 mm
XA6SLX100-2FG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911			326		1.23			Grid Array	BGA484,22X22,40		1.2 V	1 mm	125 °C (257 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e0			326		23 mm
XA3S500E-4PQG208Q	Xilinx	FPGA	Automotive	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	AEC-Q100	158	500000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)	4.88 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	572 MHz	30 s	126	245 °C (473 °F)	28 mm
XA3SD1800A-4FGG676Q	Xilinx	FPGA	Automotive	Ball	676	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS	AEC-Q100	519	37440	1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)	0.71 ns	4160 CLBS, 37440 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	667 MHz	30 s	409	260 °C (500 °F)	27 mm
XA3S200-4VQ100Q	Xilinx	FPGA	Automotive	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	4320	Yes	1.26 V	480		AEC-Q100	173	200000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)		480 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	125 MHz	30 s	173	240 °C (464 °F)	14 mm
XA3S1600E-4FGG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS	AEC-Q100	376	1600000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)	4.88 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	572 MHz	30 s	294	250 °C (482 °F)	23 mm
XC2S15-5TQ144Q	Xilinx	FPGA	Automotive	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	432	Yes	2.625 V	96	CMOS		90	15000	2.5		1.5/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	125 °C (257 °F)		96 CLBS, 15000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	263 MHz	30 s	86	225 °C (437 °F)	20 mm
XQ6SLX75-2FGG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831			280		1.23			Grid Array	BGA484,22X22,40		1.2 V	1 mm	125 °C (257 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e1		30 s	280	250 °C (482 °F)	23 mm
XCS20XL-4PQG208Q	Xilinx	FPGA	Automotive	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	400	CMOS			7000	3.3			Flatpack, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	1.1 ns	400 CLBS, 7000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates = 20000	e3	217 MHz	30 s		245 °C (473 °F)	28 mm
XC2S200-5FGG456Q	Xilinx	FPGA	Automotive	Ball	456	BGA	Square	Plastic/Epoxy		Yes	2.625 V	864				200000	2.5			Grid Array			2.375 V	1 mm	125 °C (257 °F)		864 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1		30 s		250 °C (482 °F)	23 mm
XC2S50E-6FT256Q	Xilinx	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy	1728	Yes	1.89 V	384	CMOS		182	23000	1.8		1.2/3.6,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	125 °C (257 °F)		384 CLBS, 23000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Maximum no. of gates 50000	e0	357 MHz	30 s	178	240 °C (464 °F)	17 mm
XA6SLX25T-2FG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879			250		1.23			Grid Array	BGA484,22X22,40		1.2 V	1 mm	125 °C (257 °F)	0.26 ns	1879 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e0			250		23 mm
XQ6SLX150T-3FGG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519			296		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	125 °C (257 °F)	0.21 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e1		30 s	296	250 °C (482 °F)	23 mm
XA2S100E-6TQ144Q	Xilinx	FPGA	Automotive	Gull Wing	144	QFP	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS	AEC-Q100	102		1.8		1.2/3.6,1.8 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	125 °C (257 °F)		600 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3			No		e0	357 MHz	30 s	102	225 °C (437 °F)
XCS40XL-4BG256Q	Xilinx	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	784	Yes	3.6 V	784	CMOS		224	13000	3.3		3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	125 °C (257 °F)	1.1 ns	784 CLBS, 13000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates = 40000	e0	217 MHz	30 s	224	225 °C (437 °F)	27 mm
XC2S15-5TQG144Q	Xilinx	FPGA	Automotive	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	2.625 V	96				15000	2.5			Flatpack, Low Profile, Fine Pitch			2.375 V	.5 mm	125 °C (257 °F)		96 CLBS, 15000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3		30 s		260 °C (500 °F)	20 mm
XA3S1200E-4PQG208Q	Xilinx	FPGA	Automotive	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.26 V	2168	CMOS			1200000	1.2			Flatpack, Fine Pitch			1.14 V	.5 mm	125 °C (257 °F)	4.88 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	572 MHz				28 mm
XA3S500E-4FGG400Q	Xilinx	FPGA	Automotive	Ball	400	BGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS			500000	1.2			Grid Array			1.14 V	1 mm	125 °C (257 °F)	4.88 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	572 MHz	30 s		250 °C (482 °F)	21 mm
XA6SLX75-3CSG484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831			328		1.2			Grid Array, Fine Pitch	BGA484,22X22,32		1.14 V	.8 mm	125 °C (257 °F)	0.21 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e1			328		19 mm
XCS40XL-4PQ208Q	Xilinx	FPGA	Automotive	Gull Wing	208	FQFP	Square	Plastic/Epoxy	784	Yes	3.6 V	784	CMOS		224	13000	3.3		3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	125 °C (257 °F)	1.1 ns	784 CLBS, 13000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates = 40000	e0	217 MHz	30 s	224	225 °C (437 °F)	28 mm
XQ6SLX150T-3FG676Q	Xilinx	FPGA	Automotive	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519			396		1.2			Grid Array	BGA676,26X26,40		1.14 V	1 mm	125 °C (257 °F)	0.21 ns	11519 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm			e0			396		27 mm
XA3S1200E-4VQG100Q	Xilinx	FPGA	Automotive	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS			1200000	1.2			Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	125 °C (257 °F)	4.88 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	572 MHz				14 mm
XC2S100E-6TQ144Q	Xilinx	FPGA	Automotive	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS		102	37000	1.8		1.2/3.6,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	125 °C (257 °F)		600 CLBS, 37000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum no. of gates 100000	e0	357 MHz	30 s	98	225 °C (437 °F)	20 mm
XA7A15T-1CSG325Q	Xilinx	FPGA	Automotive	Ball	325	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300	HKMG	AEC-Q100; TS 16949	210		1			Grid Array, Low Profile, Fine Pitch			.95 V	.8 mm	125 °C (257 °F)	1.27 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	210	260 °C (500 °F)	15 mm
XA3S1000-4FTG256Q	Xilinx	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920		AEC-Q100	391	1000000	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		1920 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	125 MHz	30 s	391	260 °C (500 °F)	17 mm
XQ6SLX75T-3CSG484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831			292		1.2			Grid Array, Fine Pitch	BGA484,22X22,32		1.14 V	.8 mm	125 °C (257 °F)	0.21 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e1			292		19 mm
XA3S1600E-4VQG100Q	Xilinx	FPGA	Automotive	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS			1600000	1.2			Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	125 °C (257 °F)	4.88 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	572 MHz				14 mm
XC2S50-5PQG208Q	Xilinx	FPGA	Automotive	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	2.625 V	384				50000	2.5			Flatpack, Fine Pitch			2.375 V	.5 mm	125 °C (257 °F)		384 CLBS, 50000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3		30 s		245 °C (473 °F)	28 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.