Industrial Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6SLX150T-3FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	396		1.2		1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	11519 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	862 MHz	30 s	396	225 °C (437 °F)	27 mm
XC6SLX150T-3FGG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	540		1.2		1.2,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	862 MHz	30 s	540	250 °C (482 °F)	31 mm
XC7A15T-L1FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	16640	Yes	.98 V	1300		250		0.95			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	17 mm
10M16DAF484I7P	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320		1.2			Grid Array	BGA484,22X22,40		1.15 V	1 mm	100 °C (212 °F)		1000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm						320		23 mm
A3PE600-FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	13824	Yes	1.575 V	13824	CMOS	270	600000	1.5	Tray	1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	350 MHz		270		23 mm
EP3C55F484I7	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	327		1.2			Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		55856 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	472.5 MHz		327		23 mm
M1AGL600V2-FGG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	13824	Yes	1.575 V		CMOS	177	600000	1.2			Grid Array	BGA256,16X16,40		1.14 V	1 mm	100 °C (212 °F)		600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1		30 s	177	250 °C (482 °F)	17 mm
XC6SLX9-2CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS	200		1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	715 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	667 MHz	30 s	200	260 °C (500 °F)	15 mm
XC6VLX195T-2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V		CMOS	600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7A100T-2FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS	300		1		1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1286 MHz	30 s	300	250 °C (482 °F)	27 mm
10CL080ZF780I8G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	81264	Yes	1.03 V	5079		423		1			Grid Array	BGA780,28X28,40		.97 V	1 mm	100 °C (212 °F)		5079 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		2.4 mm	29 mm		-40 to 125 °C range is available as extended industrial				423		29 mm
A54SX32A-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	2880	Yes	2.75 V	2880	CMOS	174	48000	2.5		2.5,3.3/5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	85 °C (185 °F)	1.2 ns	2880 CLBS, 48000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	32000 typical gates available	e3	238 MHz	30 s	174	245 °C (473 °F)	28 mm
A54SX32APQG208I	Microsemi	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	2880	Yes	2.75 V	2880	CMOS	174	48000	2.5		2.5,3.3/5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	85 °C (185 °F)	1.2 ns	2880 CLBS, 48000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	32000 typical gates available	e3	238 MHz	30 s	174	245 °C (473 °F)	28 mm
AGL600V5-FGG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	13824	Yes	1.575 V		CMOS	177	600000	1.5			Grid Array	BGA256,16X16,40		1.425 V	1 mm	100 °C (212 °F)		600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1		30 s	177	250 °C (482 °F)	17 mm
ICE40LP8K-CM121TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	93		1.2	Tape and Reel		Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,16		1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	5 mm			e1	133 MHz		93	260 °C (500 °F)	5 mm
M2GL005S-1FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	6060	Yes	1.26 V			209		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No					209		23 mm
M2GL005S-1FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	6060	Yes	1.26 V			209		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	209	250 °C (482 °F)	23 mm
XC3S1600E-4FGG400IS1	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS	304	1600000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	572 MHz	30 s	232	250 °C (482 °F)	21 mm
10CX105YF780I6G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC	284		.9			Grid Array			.87 V		100 °C (212 °F)		38000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780									284
10M50DAF256I6G	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125		500		1.2			Grid Array	BGA256,16X16,40		1.15 V	1 mm	100 °C (212 °F)		3125 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm			e1			500		17 mm
5AGXBB1D4F40I5N	Intel	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	300000	Yes	1.13 V	11321		704		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.07 V	1 mm	100 °C (212 °F)		11321 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	3	2.7 mm	40 mm	No		e1	622 MHz		704		40 mm
ICE40LP4K-CM81TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	81	VFBGA	Square	Plastic/Epoxy	3520	Yes	1.26 V	440	CMOS	63		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	440 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B81	3	1 mm	4 mm			e1		30 s	63	260 °C (500 °F)	4 mm
ICE40LP8K-CM121TR	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	93		1.2	Tape and Reel		Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,16		1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	5 mm			e1	133 MHz		93	260 °C (500 °F)	5 mm
LFE2-20E-5FN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	20000	Yes	1.26 V	2625		193		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	311 MHz	40 s	193	250 °C (482 °F)	17 mm
M1A3P600-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS		600000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1		30 s		260 °C (500 °F)	13 mm
XC6SLX45-2FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	316		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	667 MHz	30 s	316	225 °C (437 °F)	23 mm
XC7S100-1FGGA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	102400	Yes	1.05 V	8000	HKMG	400		1			Grid Array	BGA676,26X26,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	8000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676		2.44 mm	27 mm			e1	1098 MHz		400		27 mm
XCKU035-2FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	1700		520		.95		0.95 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		1700 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm	No		e1			520		35 mm
10CL016YE144I7G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	963				1.2			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			1.15 V	.5 mm	100 °C (212 °F)		963 CLBS	-40 °C (-40 °F)	Matte Tin - annealed	Quad	S-PQFP-G144	3	1.65 mm	20 mm			e3		30 s		260 °C (500 °F)	20 mm
10CX150YF672I5G	Intel	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	150000	Yes	.93 V	54770	TSMC	236		.9			Grid Array			.87 V		100 °C (212 °F)		54770 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B672									236
10M04SAU324I7G	Intel	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246		3			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		2.85 V	.8 mm	100 °C (212 °F)		250 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.55 mm	15 mm		Also Operates at 3.3 V nominal supply				246		15 mm
A3P250-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS		250000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0	350 MHz	20 s		235 °C (455 °F)	13 mm
AGLN250V2-VQG100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS		250000	1.2			Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3		30 s		260 °C (500 °F)	14 mm
APA1000-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	56320	Yes	2.7 V		CMOS	158	1000000	2.5	Tray	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	85 °C (185 °F)		1000000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	180 MHz	30 s	158	245 °C (473 °F)	28 mm
EP2AGZ225HF40I3N	Intel	FPGA	Industrial	Ball	1517	HBGA	Square	Plastic/Epoxy	224000	Yes	.93 V		CMOS	734		.9		0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517		3.5 mm	40 mm	No		e1	500 MHz		734		40 mm
LCMXO1200C-3BN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	1200	Yes	3.465 V	150		211		1.8		1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.71 V	.8 mm	100 °C (212 °F)		150 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No		e1			211	260 °C (500 °F)	14 mm
LCMXO3D-9400HC-5BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		206		2.5			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		2.375 V	.8 mm	100 °C (212 °F)	7 ns	1175 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm		Also Operates at 3.3 V nominal supply				206		14 mm
LFD2NX-17-7MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V	4250	FDSOI	23		1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1		30 s	23	260 °C (500 °F)	6 mm
M1AGL600V5-FGG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	13824	Yes	1.575 V		CMOS	177	600000	1.5			Grid Array	BGA256,16X16,40		1.425 V	1 mm	100 °C (212 °F)		600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1		30 s	177	250 °C (482 °F)	17 mm
M2GL010TS-1FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	12084	Yes	1.26 V			233		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0		20 s	233	240 °C (464 °F)	23 mm
M2GL050TS-1VFG400I	Microchip Technology	FPGA	Industrial	Ball	400	LFBGA	Square	Plastic/Epoxy	56340	Yes	1.26 V			207		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B400	3	1.51 mm	17 mm	No					207		17 mm
XC7A25T-1CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG	150		1			Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		150		10 mm
XC7A35T-L1CPG236I	Xilinx	FPGA	Industrial	Ball	236	LFBGA	Square	Plastic/Epoxy	33280	Yes	.98 V	2600		250		0.95			Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.92 V	.5 mm	100 °C (212 °F)	1.27 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	10 mm
XCKU085-2FLVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676		0.95		0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1		30 s	676	245 °C (473 °F)	40 mm
10AX016E3F29I2SG	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	160000	Yes	.93 V	6151	TSMC	288		0.9		0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		6151 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No	Also Operates at 0.95 V nominal supply				288		29 mm
10CL025ZE144I8G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	24624	Yes	1.03 V	1539		150		1			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20		.97 V	.5 mm	100 °C (212 °F)		1539 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm		-40 to 125 °C range is available as extended industrial				150		20 mm
10M50DAF484I6G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125		500		1.2			Grid Array	BGA484,22X22,40		1.15 V	1 mm	100 °C (212 °F)		3125 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484		2 mm	23 mm			e1			500		23 mm
5AGXFB5H4F35I5N	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	420000	Yes	1.13 V	15849		704		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	100 °C (212 °F)		15849 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	2.7 mm	35 mm	No		e1	622 MHz		704		35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.