Industrial Field Programmable Gate Arrays (FPGA) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC3S500E-4VQG100IS1

Xilinx

FPGA

Industrial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

10476

Yes

1.26 V

1164

CMOS

66

500000

1.2

1.2,1.2/3.3,2.5 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

0.76 ns

1164 CLBS, 500000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

e3

572 MHz

30 s

59

260 °C (500 °F)

14 mm

XC3S700A-4FTG256I

Xilinx

FPGA

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

13248

Yes

1.26 V

1472

CMOS

161

700000

1.2

1.2,1.2/3.3,3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

100 °C (212 °F)

0.71 ns

1472 CLBS, 700000 Gates

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

667 MHz

30 s

148

260 °C (500 °F)

17 mm

XCKU11P-1FFVE1517I

Xilinx

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

653100

Yes

.876 V

37320

512

0.85

Grid Array

BGA1517,39X39,40

.825 V

1 mm

100 °C (212 °F)

37320 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B1517

4

3.51 mm

40 mm

e1

30 s

512

245 °C (473 °F)

40 mm

XCKU3P-2FFVB676I

Xilinx

FPGA

Industrial

Ball

676

BGA

Square

Plastic/Epoxy

355950

Yes

.876 V

20340

304

0.85

Grid Array

BGA676,26X26,40

.825 V

1 mm

100 °C (212 °F)

20340 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B676

4

3.52 mm

27 mm

e1

30 s

304

250 °C (482 °F)

27 mm

XCVU13P-1FHGB2104I

Xilinx

FPGA

Industrial

Ball

2104

BGA

Square

Plastic/Epoxy

3780000

Yes

.876 V

216000

832

0.85

Grid Array

BGA2104,46X46,40

.825 V

1 mm

100 °C (212 °F)

216000 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B2104

4.32 mm

52.5 mm

832

52.5 mm

XCVU13P-2FHGB2104I

Xilinx

FPGA

Industrial

Ball

2104

BGA

Square

Plastic/Epoxy

3780000

Yes

.876 V

216000

832

0.85

Grid Array

BGA2104,46X46,40

.825 V

1 mm

100 °C (212 °F)

216000 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B2104

4.32 mm

52.5 mm

832

52.5 mm

10CL080ZF484I8G

Intel

FPGA

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

81264

Yes

1.03 V

5079

423

1

Grid Array

BGA484,22X22,40

.97 V

1 mm

100 °C (212 °F)

5079 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2.4 mm

23 mm

-40 to 125 °C range is available as extended industrial

423

23 mm

10M04SAM153I7G

Intel

FPGA

Industrial

Ball

153

BGA

Square

Plastic/Epoxy

4000

Yes

3.15 V

250

246

3

Grid Array

BGA153,15X15,20

2.85 V

.5 mm

100 °C (212 °F)

250 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B153

3

1 mm

8 mm

Also Operates at 3.3 V nominal supply

246

8 mm

10M25DCF256I7G

Intel

FPGA

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

25000

Yes

1.25 V

1563

360

1.2

1.2 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

100 °C (212 °F)

1563 CLBS

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

360

17 mm

10M25SCE144I7G

Intel

FPGA

Industrial

Gull Wing

144

QFP

Square

Plastic/Epoxy

25000

Yes

3.15 V

1563

360

3

3/3.3 V

Flatpack

HQFP144,.87SQ,20

Field Programmable Gate Arrays

2.85 V

.5 mm

100 °C (212 °F)

1563 CLBS

-40 °C (-40 °F)

Quad

S-PQFP-G144

3

1.65 mm

20 mm

No

Also Operates at 3.3 V nominal supply

360

20 mm

A3P060-1TQG144I

Microchip Technology

FPGA

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

1.575 V

1536

CMOS

60000

1.5

Tray

Flatpack, Low Profile, Fine Pitch

1.425 V

.5 mm

100 °C (212 °F)

1536 CLBS, 60000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

350 MHz

20 mm

A3PE1500-2PQG208I

Microchip Technology

FPGA

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

38400

Yes

1.575 V

38400

CMOS

147

1500000

1.5

Tray

1.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

1.425 V

.5 mm

85 °C (185 °F)

38400 CLBS, 1500000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

350 MHz

30 s

147

245 °C (473 °F)

28 mm

A42MX16-VQG100I

Microchip Technology

FPGA

Industrial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

1232

Yes

3.6 V

1232

CMOS

24000

3.3

Tray

Flatpack, Thin Profile, Fine Pitch

3 V

.5 mm

85 °C (185 °F)

2.8 ns

1232 CLBS, 24000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

Also Operates at 5 V supply

e3

94 MHz

30 s

260 °C (500 °F)

14 mm

APA150-TQG100I

Microchip Technology

FPGA

Industrial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

6144

Yes

2.7 V

CMOS

66

150000

2.5

Tray

2.5,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Field Programmable Gate Arrays

2.3 V

.5 mm

85 °C (185 °F)

150000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

180 MHz

30 s

66

260 °C (500 °F)

14 mm

EP1C6Q240I7N

Intel

FPGA

Industrial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

5980

Yes

1.575 V

598

185

1.5

1.5,1.5/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

1.425 V

.5 mm

100 °C (212 °F)

598 CLBS

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

320 MHz

185

32 mm

ICE40LP384-CM49TR

Lattice Semiconductor

FPGA

Industrial

Ball

49

VFBGA

Square

Plastic/Epoxy

384

Yes

1.26 V

48

CMOS

37

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.4 mm

100 °C (212 °F)

9.36 ns

48 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B49

3

1 mm

3 mm

e1

30 s

37

260 °C (500 °F)

3 mm

LFE3-17EA-6FTN256I

Lattice Semiconductor

FPGA

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

17000

Yes

1.26 V

133

1.2

1.2 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

100 °C (212 °F)

0.379 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

375 MHz

30 s

133

260 °C (500 °F)

17 mm

LFE3-35EA-8FN484I

Lattice Semiconductor

FPGA

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

33000

Yes

1.26 V

295

1.2

1.2 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.14 V

1 mm

100 °C (212 °F)

0.281 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.6 mm

23 mm

No

e1

500 MHz

295

250 °C (482 °F)

23 mm

M1A3P600-2FGG484I

Microchip Technology

FPGA

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.575 V

13824

CMOS

600000

1.5

Tray

Grid Array

1.425 V

1 mm

100 °C (212 °F)

13824 CLBS, 600000 Gates

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.44 mm

23 mm

No

e1

30 s

250 °C (482 °F)

23 mm

M2GL025TS-1FCSG325I

Microchip Technology

FPGA

Industrial

Ball

325

BGA

Square

Plastic/Epoxy

27696

Yes

1.26 V

CMOS

180

1.2

Tray

1.2 V

Grid Array

BGA325,21X21,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B325

3

11 mm

No

180

11 mm

XC7S75-2FGGA676I

Xilinx

FPGA

Industrial

Ball

676

BGA

Square

Plastic/Epoxy

76800

Yes

1.05 V

6000

HKMG

400

1

Grid Array

BGA676,26X26,40

.95 V

1 mm

100 °C (212 °F)

1.05 ns

6000 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B676

2.44 mm

27 mm

e1

1286 MHz

400

27 mm

10M25DCF484I6G

Intel

FPGA

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

25000

Yes

1.25 V

1563

360

1.2

Grid Array

BGA484,22X22,40

1.15 V

1 mm

100 °C (212 °F)

1563 CLBS

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B484

2 mm

23 mm

e1

360

23 mm

5SGXMA3H2F35I3N

Intel

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

340000

Yes

.88 V

12830

CMOS

432

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

12830 CLBS

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B1152

4

3.6 mm

35 mm

No

e1

30 s

432

245 °C (473 °F)

35 mm

A3PE3000-FG484I

Microchip Technology

FPGA

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

75264

Yes

1.575 V

75264

CMOS

341

3000000

1.5

Tray

1.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.425 V

1 mm

85 °C (185 °F)

75264 CLBS, 3000000 Gates

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.44 mm

23 mm

No

e0

350 MHz

20 s

341

225 °C (437 °F)

23 mm

A54SX16PPQ208I

Microsemi

FPGA

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

3.6 V

1452

CMOS

16000

3.3

Flatpack, Fine Pitch

3 V

.5 mm

85 °C (185 °F)

0.9 ns

1452 CLBS, 16000 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

Can also be operated at 5 V; 24000 system gates also available

e0

240 MHz

20 s

225 °C (437 °F)

28 mm

A54SX16-PPQ208I

Actel

FPGA

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

1452

Yes

3.6 V

1452

CMOS

175

16000

3.3

3.3,3.3/5 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

3 V

.5 mm

85 °C (185 °F)

0.9 ns

1452 CLBS, 16000 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

Can also be operated at 5 V; 24000 system gates also available

e0

240 MHz

175

28 mm

EP3C25F256I7

Intel

FPGA

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

24624

Yes

1.25 V

24624

CMOS

156

1.2

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

100 °C (212 °F)

24624 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

472.5 MHz

156

17 mm

EP4SGX230FF35I3G

Intel

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

228000

Yes

.93 V

9120

564

.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

100 °C (212 °F)

9120 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

564

35 mm

ICE40LP1K-SWG16TR50

Lattice Semiconductor

FPGA

Industrial

Ball

16

VFBGA

Rectangular

Plastic/Epoxy

Yes

1.26 V

160

CMOS

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.35 mm

100 °C (212 °F)

160 CLBS

-40 °C (-40 °F)

Bottom

R-PBGA-B16

.491 mm

1.4 mm

1.48 mm

ICE40LP384-CM49TR1K

Lattice Semiconductor

FPGA

Industrial

Ball

49

VFBGA

Square

Plastic/Epoxy

Yes

1.26 V

48

CMOS

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.4 mm

100 °C (212 °F)

48 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B49

1 mm

3 mm

3 mm

M1AFS250-1PQG208I

Microsemi

FPGA

Industrial

Flat

208

QFF

Rectangular

Plastic/Epoxy

Yes

1.575 V

6144

CMOS

250000

1.5

Flatpack

1.425 V

.5 mm

85 °C (185 °F)

6144 CLBS, 250000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

R-PQFP-F208

3

4.1 mm

28 mm

No

e3

30.6 mm

M2GL050T-1FGG484I

Microchip Technology

FPGA

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

56340

Yes

1.26 V

267

1.2

Tray

1.2 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.14 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

3

2.44 mm

23 mm

No

30 s

267

250 °C (482 °F)

23 mm

XC6SLX25-3FT256I

Xilinx

FPGA

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

24051

Yes

1.26 V

1879

CMOS

186

1.2

1.2,2.5/3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

100 °C (212 °F)

0.21 ns

1879 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

862 MHz

30 s

186

225 °C (437 °F)

17 mm

10CL010ZM164I8G

Intel

FPGA

Industrial

Ball

164

TFBGA

Square

Plastic/Epoxy

10320

Yes

1.03 V

645

176

1

Grid Array, Thin Profile, Fine Pitch

BGA164,15X15,20

.97 V

.5 mm

100 °C (212 °F)

645 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B164

1.2 mm

8 mm

-40 to 125 °C range is available as extended industrial

176

8 mm

A3P060-VQ100I

Microchip Technology

FPGA

Industrial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

Yes

1.575 V

1536

CMOS

60000

1.5

Tray

Flatpack, Thin Profile, Fine Pitch

1.425 V

.5 mm

100 °C (212 °F)

1536 CLBS, 60000 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

e0

350 MHz

20 s

235 °C (455 °F)

14 mm

EP2AGX45DF29I3N

Intel

FPGA

Industrial

Ball

780

HBGA

Square

Plastic/Epoxy

42959

Yes

.93 V

1805

372

.9

0.9,1.2/3.3,1.5,2.5 V

Grid Array, Heat Sink/Slug

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

1805 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

No

e1

500 MHz

372

29 mm

LCMXO3D-9400HC-6BG256I

Lattice Semiconductor

FPGA

Industrial

Ball

256

LFBGA

Square

Plastic/Epoxy

9400

Yes

3.465 V

1175

206

2.5

Grid Array, Low Profile, Fine Pitch

BGA256,16X16,32

2.375 V

.8 mm

100 °C (212 °F)

6.7 ns

1175 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B256

1.7 mm

14 mm

Also Operates at 3.3 V nominal supply

206

14 mm

XCKU040-2FBVA900I

Xilinx

FPGA

Industrial

Ball

900

BGA

Square

Plastic/Epoxy

530250

Yes

.979 V

1920

520

.95

0.95 V

Grid Array

BGA900,30X30,40

Field Programmable Gate Arrays

.922 V

1 mm

100 °C (212 °F)

1920 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B900

4

2.8 mm

31 mm

No

e1

30 s

520

245 °C (473 °F)

31 mm

XCKU115-2FLVA1517I

Xilinx

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

1451100

Yes

.979 V

5520

832

.95

0.95 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.922 V

1 mm

100 °C (212 °F)

5520 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B1517

4

4.09 mm

40 mm

No

e1

30 s

832

245 °C (473 °F)

40 mm

10M40DCF256I6G

Intel

FPGA

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

40000

Yes

1.25 V

2500

500

1.2

Grid Array, Low Profile

BGA256,16X16,40

1.15 V

1 mm

100 °C (212 °F)

2500 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

1.55 mm

17 mm

e1

500

17 mm

A2F500M3G-1FGG484I

Microchip Technology

FPGA

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

11520

Yes

1.575 V

11520

CMOS

128

500000

1.5

Tray

1.5,1.8,2.5,3.3 V

Grid Array

BGA484,26X26,40

Field Programmable Gate Arrays

1.425 V

1 mm

100 °C (212 °F)

11520 CLBS, 500000 Gates

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.44 mm

23 mm

No

e1

100 MHz

30 s

128

250 °C (482 °F)

23 mm

A3P1000-2PQG208I

Microchip Technology

FPGA

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

1.575 V

24576

CMOS

1000000

1.5

Tray

Flatpack, Fine Pitch

1.425 V

.5 mm

100 °C (212 °F)

24576 CLBS, 1000000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

350 MHz

30 s

245 °C (473 °F)

28 mm

A3P600-FG256I

Microchip Technology

FPGA

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

Yes

1.575 V

13824

CMOS

600000

1.5

Tray

Grid Array

1.425 V

1 mm

100 °C (212 °F)

13824 CLBS, 600000 Gates

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.8 mm

17 mm

No

e0

350 MHz

20 s

225 °C (437 °F)

17 mm

AT40K40AL-1BQU

Microchip Technology

FPGA

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

3.6 V

2304

CMOS

40000

3.3

Tray

Flatpack, Low Profile, Fine Pitch

3 V

.5 mm

85 °C (185 °F)

2.2 ns

2304 CLBS, 40000 Gates

-40 °C (-40 °F)

Quad

S-PQFP-G144

1.6 mm

20 mm

Maximum usable gates 50000

20 mm

EP3C10F256I7

Intel

FPGA

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

10320

Yes

1.25 V

10320

CMOS

182

1.2

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

100 °C (212 °F)

10320 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

472.5 MHz

182

17 mm

LCMXO3D-9400HC-5SG72I

Lattice Semiconductor

FPGA

Industrial

No Lead

72

HVQCCN

Square

9400

Yes

3.465 V

1175

58

2.5

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC72,.40SQ,20

2.375 V

.5 mm

100 °C (212 °F)

7 ns

1175 CLBS

-40 °C (-40 °F)

Quad

S-XQCC-N72

.9 mm

10 mm

Also Operates at 3.3 V nominal supply

58

10 mm

MPF300TS-FCG484I

Microchip Technology

FPGA

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

300000

Yes

1.03 V

CMOS

244

1

Grid Array

BGA484,22X22,40

.97 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

4

2.87 mm

23 mm

It also Operates at 1.05 V nominal supply

30 s

244

260 °C (500 °F)

23 mm

XC6SLX150-3FGG676I

Xilinx

FPGA

Industrial

Ball

676

BGA

Square

Plastic/Epoxy

147443

Yes

1.26 V

11519

CMOS

498

1.2

1.2,2.5/3.3 V

Grid Array

BGA676,26X26,40

Field Programmable Gate Arrays

1.14 V

1 mm

100 °C (212 °F)

0.21 ns

11519 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B676

3

2.44 mm

27 mm

No

e1

862 MHz

30 s

498

250 °C (482 °F)

27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.