Industrial Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
A40MX04-PLG44I	Microchip Technology	FPGA	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	547	CMOS			6000	3.3	Tube		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)	2.7 ns	547 CLBS, 6000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Also Operates at 5 V supply	e3	80 MHz	30 s		245 °C (473 °F)	16.5862 mm
AGL060V5-VQG100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	1536	Yes	1.575 V		CMOS		71	60000	1.5			Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ		1.425 V	.5 mm	100 °C (212 °F)		60000 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3			71		14 mm
APA150-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	6144	Yes	2.7 V		CMOS		100	150000	2.5	Tray	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	2.3 V	1 mm	85 °C (185 °F)		150000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0	180 MHz	20 s	100	235 °C (455 °F)	13 mm
AX250-FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	4224	Yes	1.575 V	2816	CMOS		248	250000	1.5		1.5,1.5/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.99 ns	2816 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	27 mm	No	250000 system gates avaiable	e0	649 MHz		248		27 mm
EP1C12F324I7N	Intel	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	12060	Yes	1.575 V	1206			249		1.5		1.5,1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)		1206 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1	320 MHz	30 s	249	245 °C (473 °F)	19 mm
EX128-TQG64I	Microchip Technology	FPGA	Industrial	Gull Wing	64	LFQFP	Square	Plastic/Epoxy		Yes	2.7 V	256	CMOS		46	6000	2.5			Flatpack, Low Profile, Fine Pitch	QFP64,.47SQ,20		2.3 V	.5 mm	85 °C (185 °F)		256 CLBS, 6000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.6 mm	10 mm		4000 typical gates available	e3		30 s	46	260 °C (500 °F)	10 mm
ICE40LP1K-CM81TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	81	VFBGA	Square	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS		63		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B81	3	1 mm	4 mm			e1		30 s	63	260 °C (500 °F)	4 mm
LCMXO1200C-4FTN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	1200	Yes	3.465 V	150			211		1.8		1.8/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	100 °C (212 °F)		150 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No		e1		40 s	211	260 °C (500 °F)	17 mm
LCMXO3D-9400ZC-3BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175			206		2.5			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		2.375 V	.8 mm	100 °C (212 °F)	6.7 ns	1175 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm		Also Operates at 3.3 V nominal supply				206		14 mm
LFE2-12E-6FN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12000	Yes	1.26 V	1500			193		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.331 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	357 MHz	40 s	193	250 °C (482 °F)	17 mm
LFE2-12SE-5FN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12000	Yes	1.26 V	1500			193		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	311 MHz	40 s	193	250 °C (482 °F)	17 mm
LFE5UM5G-45F-8MG285I	Lattice Semiconductor	FPGA	Industrial	Ball	285	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V	5500					1.2			Grid Array, Low Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		5500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B285	3	1.3 mm	10 mm			e1		30 s		260 °C (500 °F)	10 mm
LFXP15C-4FN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	1932	Yes	3.465 V	1932	CMOS		188		1.8		1.8/2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	100 °C (212 °F)	0.53 ns	1932 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	375 MHz	40 s	188	250 °C (482 °F)	17 mm
M1A3P1000L-1PQG208I	Microsemi	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		154	1000000	1.2		1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz		154		28 mm
M1A3P1000L-PQG208I	Microsemi	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		154	1000000	1.2		1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz		154		28 mm
M1A3PE1500-FGG676I	Microchip Technology	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	38400	Yes	1.575 V	38400	CMOS		444	1500000	1.5	Tray	1.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		38400 CLBS, 1500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	350 MHz	30 s	444	250 °C (482 °F)	27 mm
M1A3PE3000-PQ208I	Microsemi	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		147	3000000	1.5		1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	350 MHz		147		28 mm
M2GL010T-1FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	12084	Yes	1.26 V				233		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0		20 s	233	240 °C (464 °F)	23 mm
M7A3PE3000-FG484I	Microsemi	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V		CMOS		280	3000000	1.5		1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		3000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0			280		23 mm
XA3S700A-4FGG400I	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS	AEC-Q100	311	700000	1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	4.88 ns	1472 CLBS, 700000 Gates	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	667 MHz	30 s	248	250 °C (482 °F)	21 mm
XC2S100-5PQ208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	2700	Yes	2.625 V	600			144	100000	2.5		1.5/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)	0.7 ns	600 CLBS, 100000 Gates	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e4	263 MHz		140		28 mm
XC3S1400A-4FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS		375	1400000	1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	2816 CLBS, 1400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	288	250 °C (482 °F)	23 mm
XC3S400AN-4FGG400I	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		311	400000	1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	667 MHz	30 s	248	250 °C (482 °F)	21 mm
XC5VLX330-1FFG1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	331776	Yes	1.05 V	25920			1200		1		1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	25920 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1		30 s	1200	225 °C (437 °F)	42.5 mm
XC6SLX100-2FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		480		1.2		1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	667 MHz	30 s	480	250 °C (482 °F)	27 mm
XC6SLX150-3FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS		338		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	11519 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	862 MHz	30 s	338	225 °C (437 °F)	23 mm
XC6SLX150-N3CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS		338		1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	806 MHz		338		19 mm
XC6SLX25T-3FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS		250		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	1879 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	862 MHz	30 s	250	225 °C (437 °F)	23 mm
XC6SLX25T-4CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	24051	Yes			CMOS		190				1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1		30 s	190	260 °C (500 °F)	15 mm
XC7A50T-1CS324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075	HKMG		210		1			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm						210		15 mm
XCKU115-2FLVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520			832		.95		0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm	No		e1			832		42.5 mm
XCKU115-2FLVB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520			832		.95		0.95 V	Grid Array	BGA2104,46X46,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm	No		e1		30 s	832	245 °C (473 °F)	47.5 mm
XCVU5P-2FLVA2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1313763	Yes	.876 V	75072			832		0.85			Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		75072 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
10M25DCF256I6G	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563			360		1.2			Grid Array	BGA256,16X16,40		1.15 V	1 mm	100 °C (212 °F)		1563 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm			e1			360		17 mm
A3P1000-2FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS			1000000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
AGLN010V2-UCG36I	Microchip Technology	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy		Yes	1.575 V	260	CMOS			10000	1.2	Tray		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		260 CLBS, 10000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B36		.8 mm	3 mm	No							3 mm
M1A3P1000-2FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS			1000000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
M7A3P1000-2FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		97	1000000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s	97	260 °C (500 °F)	13 mm
XA3S400A-4FGG400I	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	AEC-Q100	311	400000	1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	4.88 ns	896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	667 MHz	30 s	248	250 °C (482 °F)	21 mm
XC7A50T-L1CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	.98 V	4075			250		0.95			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XCKU13P-2FFVE900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	746550	Yes	.876 V	42660			304		0.85			Grid Array	BGA900,30X30,40		.825 V	1 mm	100 °C (212 °F)		42660 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s	304	245 °C (473 °F)	31 mm
APA450-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	12288	Yes	2.7 V		CMOS		100	450000	2.5		2.5,2.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	2.3 V	1 mm	85 °C (185 °F)		450000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	180 MHz	30 s	100	260 °C (500 °F)	13 mm
10M16DCU324I7G	Intel	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000			320		1.2		1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)		1000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No					320		15 mm
EP3C5U256I7N	Intel	FPGA	Industrial	Ball	256	FBGA	Rectangular	Plastic/Epoxy	5136	Yes	1.25 V	5136	CMOS		182		1.2			Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)		5136 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	2.2 mm	14 mm	No		e1	472.5 MHz		182		14 mm
LCMXO256C-3MN100I	Lattice Semiconductor	FPGA	Industrial	Ball	100	LFBGA	Square	Plastic/Epoxy	256	Yes	3.465 V	32			78		1.8		1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA100,14X14,20	Field Programmable Gate Arrays	1.71 V	.5 mm	100 °C (212 °F)		32 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3	1.35 mm	8 mm	No		e1		30 s	78	260 °C (500 °F)	8 mm
XC6SLX45-3FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS		358		1.2		1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	862 MHz	30 s	358	250 °C (482 °F)	27 mm
EP2AGX125EF35I3N	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	118143	Yes	.93 V	4964			612		.9		0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		4964 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.6 mm	35 mm	No		e1	500 MHz		612		35 mm
APA075-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	3072	Yes	2.7 V		CMOS		100	75000	2.5		2.5,2.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	2.3 V	1 mm	85 °C (185 °F)		75000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No			180 MHz	30 s	100	260 °C (500 °F)	13 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.