Industrial Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
APA075-TQG100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	3072	Yes	2.7 V		CMOS	66	75000	2.5	Tray	2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	85 °C (185 °F)		75000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	180 MHz	30 s	66	260 °C (500 °F)	14 mm
APA150-TQ100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	6144	Yes	2.7 V		CMOS	66	150000	2.5		2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	85 °C (185 °F)		150000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e0	180 MHz	20 s	66	225 °C (437 °F)	14 mm
APA450-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	12288	Yes	2.7 V		CMOS	158	450000	2.5	Tray	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	85 °C (185 °F)		450000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	180 MHz	30 s	158	245 °C (473 °F)	28 mm
APA600-FG676I	Microchip Technology	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	21504	Yes	2.7 V		CMOS	454	600000	2.5	Tray	2.5,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	2.3 V	1 mm	85 °C (185 °F)		600000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	180 MHz		454		27 mm
EP1C12Q240I7	Intel	FPGA	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	12060	Yes	1.575 V	1206		173		1.5		1.5,1.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	100 °C (212 °F)		1206 CLBS	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	320 MHz		173		32 mm
EP1C6F256I7N	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	5980	Yes	1.575 V	598		185		1.5		1.5,1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)		598 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	3.5 mm	17 mm	No		e1	320 MHz		185		17 mm
EP2AGX260FF35I3N	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	244188	Yes	.93 V	10260		612		.9		0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		10260 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.6 mm	35 mm	No		e1	500 MHz		612		35 mm
EP3C40F324I7	Intel	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	195		1.2			Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		39600 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324	3	1.9 mm	19 mm	No		e0	472.5 MHz		195		19 mm
ICE40UL640-CM36AITR1K	Lattice Semiconductor	FPGA	Industrial	Ball	36	BGA	Square	Plastic/Epoxy	640	Yes	1.26 V	80	CMOS	26		1.2			Grid Array			1.14 V	.4 mm	100 °C (212 °F)	9 ns	80 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B36			2.5 mm						26		2.5 mm
LCMXO2280C-3TN100I	Lattice Semiconductor	FPGA	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	2280	Yes	3.465 V	285		73		1.8		1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	100 °C (212 °F)		285 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3		40 s	73	260 °C (500 °F)	14 mm
LCMXO2280C-3TN144I	Lattice Semiconductor	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2280	Yes	3.465 V	285		113		1.8		1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	100 °C (212 °F)		285 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3		30 s	113	260 °C (500 °F)	20 mm
LCMXO3D-9400HC-5BG400I	Lattice Semiconductor	FPGA	Industrial	Ball	400	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		335		2.5			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		2.375 V	.8 mm	100 °C (212 °F)	7 ns	1175 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B400		1.7 mm	17 mm		Also Operates at 3.3 V nominal supply				335		17 mm
LCMXO640C-3MN132I	Lattice Semiconductor	FPGA	Industrial	Ball	132	LFBGA	Square	Plastic/Epoxy	640	Yes	3.465 V	80		101		1.8		1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.71 V	.5 mm	100 °C (212 °F)		80 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1		40 s	101	260 °C (500 °F)	8 mm
LFE5UM-85F-8MG285I	Lattice Semiconductor	FPGA	Industrial	Ball	285	LFBGA	Square	Plastic/Epoxy		Yes	1.155 V	10500				1.1			Grid Array, Low Profile, Fine Pitch			1.045 V	.5 mm	100 °C (212 °F)		10500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B285	3	1.3 mm	10 mm			e1		30 s		260 °C (500 °F)	10 mm
M1A3P1000-2FG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No			350 MHz				17 mm
M1A3P250-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS		250000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0					13 mm
M1AGL1000V5-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V		CMOS	97	1000000	1.5			Grid Array, Low Profile	BGA144,12X12,40		1.425 V	1 mm	100 °C (212 °F)		1000000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0			97		13 mm
M1AGL250V5-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	6144	Yes	1.575 V		CMOS	97	250000	1.5			Grid Array, Low Profile	BGA144,12X12,40		1.425 V	1 mm	100 °C (212 °F)		250000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0			97		13 mm
M2GL005-VF256IX417	Microchip Technology	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V			161		1.2			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.56 mm	14 mm						161		14 mm
M2GL025T-VFG400I	Microchip Technology	FPGA	Industrial	Ball	400	LFBGA	Square	Plastic/Epoxy	27696	Yes	1.26 V		CMOS	207		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B400	3	1.51 mm	17 mm	No					207		17 mm
M2GL060-1FCS325I	Microchip Technology	FPGA	Industrial	Ball	325	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Grid Array			1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325			11 mm					20 s		240 °C (464 °F)	11 mm
M2GL060-1FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s		250 °C (482 °F)	23 mm
M2GL060-FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm			e0					23 mm
M2GL060TS-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s		250 °C (482 °F)	23 mm
M2GL090-FCSG325I	Microchip Technology	FPGA	Industrial		325			Plastic	86316	Yes			CMOS	180		1.2	Tray	1.2 V		BGA325,21X21,20	Field Programmable Gate Arrays			100 °C (212 °F)			-40 °C (-40 °F)				3			No					180
M7A3P1000-2FG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	177	1000000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No			350 MHz		177		17 mm
MPF200TS-FCG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	192000	Yes	1.03 V		CMOS	244		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	4	2.87 mm	23 mm		It also Operates at 1.05 V nominal supply				244		23 mm
MPF300TLS-FCVG484I	Microchip Technology	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	284		1			Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm		It also Operates at 1.05 V nominal supply				284		19 mm
MPF300TS-1FCVG484I	Microchip Technology	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	284		1			Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm		It also Operates at 1.05 V nominal supply				284	260 °C (500 °F)	19 mm
XC3020-50PC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS	58	2000	5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)		64 CLBS, 2000 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68	1	4.699 mm	24.2316 mm	No	MAX 58 I/OS; 256 flip-flops		50 MHz		58		24.2316 mm
XC3S100E-4VQG100I	Xilinx	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS	66	100000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	240 CLBS, 100000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	572 MHz	30 s	59	260 °C (500 °F)	14 mm
XC3S250E-4FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	172	250000	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	572 MHz	30 s	132	260 °C (500 °F)	17 mm
XC3S50A-4VQG100I	Xilinx	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS	68	50000	1.2		1.2,1.2/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.71 ns	176 CLBS, 50000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	667 MHz	30 s	62	260 °C (500 °F)	14 mm
XC3S50AN-4FT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS	144	50000	1.2		1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	176 CLBS, 50000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No			667 MHz		112		17 mm
XC3S50AN-4FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS	144	50000	1.2		1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	176 CLBS, 50000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm	No			667 MHz		112		17 mm
XC5VFX100T-1FF1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	102400	Yes	1.05 V	8000	CMOS	640		1		1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	8000 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e0		30 s	640	225 °C (437 °F)	35 mm
XC6SLX25T-2FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	250		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	1879 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	250	250 °C (482 °F)	23 mm
XC6SLX25T-N3CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	190		1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	1879 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	806 MHz	30 s	190	260 °C (500 °F)	15 mm
XC6SLX9-L1CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	9152	Yes	1.05 V	715	CMOS	200		1		1,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	0.46 ns	715 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1		30 s	200	260 °C (500 °F)	15 mm
XC7A15T-2CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300		250		1			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.05 ns	1300 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1286 MHz	30 s	250	260 °C (500 °F)	15 mm
XCKU115-2FLVF1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520		832		.95		0.95 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm	No		e1		30 s	832	245 °C (473 °F)	45 mm
XCKU11P-2FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320		512		0.85			Grid Array	BGA1156,34X34,40		.825 V	1 mm	100 °C (212 °F)		37320 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.51 mm	35 mm			e1			512		35 mm
XCKU5P-1FFVB676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120		304		0.85			Grid Array	BGA676,26X26,40		.825 V	1 mm	100 °C (212 °F)		27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm			e1		30 s	304	250 °C (482 °F)	27 mm
XCVU3P-1FFVC1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	862050	Yes	.876 V	49260		520		0.85			Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)		49260 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	520	245 °C (473 °F)	40 mm
10M16DAF256I7P	Intel	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320		1.2			Grid Array, Low Profile	BGA256,16X16,40		1.15 V	1 mm	100 °C (212 °F)		1000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm						320		17 mm
10M16DAU324I6G	Intel	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320		1.2			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		1.15 V	.8 mm	100 °C (212 °F)		1000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.55 mm	15 mm						320		15 mm
A3P1000L-PQG208I	Microsemi	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	154	1000000	1.2		1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz		154		28 mm
A3P600-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS		600000	1.5			Grid Array			1.425 V	1 mm	100 °C (212 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	350 MHz	30 s		250 °C (482 °F)	23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.