Industrial Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5AGXMA5G4F31I5G	Intel	FPGA	Industrial	Ball	896	HBGA	Square	Plastic/Epoxy	190000	Yes	1.13 V	7170	TSMC	544		1.1		Grid Array, Heat Sink/Slug	BGA896,30X30,40		1.07 V	1 mm	100 °C (212 °F)		7170 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm						544		31 mm
5SGXEA5N2F45I2L	Intel	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy	490000	Yes	.88 V	18500	CMOS	840		.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)		18500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No					840		45 mm
5SGXEA7N2F40I2LN	Intel	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	622000	Yes	.88 V	23472	CMOS	600		.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)		23472 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No					600		40 mm
ATT3030-70M68I	Lucent Technologies	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	58	1500	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	9 ns	100 CLBS, 1500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J68				No	Typical gates = 1500-2000	e0	70 MHz		58
EP1C6F256I7	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	5980	Yes	1.575 V	598		185		1.5	1.5,1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)		598 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No		e0	320 MHz	20 s	185	220 °C (428 °F)	17 mm
EP1C6Q240I7	Intel	FPGA	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	5980	Yes	1.575 V	598		185		1.5	1.5,1.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	100 °C (212 °F)		598 CLBS	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	320 MHz		185		32 mm
EP1C6T144I7	Intel	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5980	Yes	1.575 V	598		98		1.5	1.5,1.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	100 °C (212 °F)		598 CLBS	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	320 MHz		98		20 mm
EP2AGX45CU17I5G	Intel	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		156		.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	100 °C (212 °F)		1805 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B358		1.7 mm	17 mm						156		17 mm
EP2AGX95DF25I3N	Intel	FPGA	Industrial	Ball	572	HBGA	Square	Plastic/Epoxy	89178	Yes	.93 V	3747		260		.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA572,24X24,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		3747 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B572		2.2 mm	25 mm	No		e1	500 MHz		260		25 mm
EP2S130F780I4N	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	132540	Yes	1.25 V	6627	CMOS	534		1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	5.117 ns	6627 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1	717 MHz		526		29 mm
EP2S60F672I4	Intel	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	24176	CMOS	492		1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1.27 mm	100 °C (212 °F)	5.117 ns	24176 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B672	3	2.6 mm	35 mm	No			717 MHz		484		35 mm
EP2SGX130GF1508I4N	Intel	FPGA	Industrial	Ball	1508	BGA	Square	Plastic/Epoxy	132540	Yes	1.25 V	132540	CMOS	734		1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.117 ns	132540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1508	3	3.5 mm	40 mm	No		e1	717 MHz		734		40 mm
EP3C10M164I7N	Intel	FPGA	Industrial	Ball	164	BGA	Square	Plastic/Epoxy	10320	Yes	2.625 V	10320	CMOS	106		2.5	1.2/3.3 V	Grid Array	BGA164,15X15,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)		10320 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B164	3			No		e1			106
EP3C40F780I7	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	535		1.2		Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		39600 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e0	472.5 MHz		535		29 mm
EP3CLS200F484I7N	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	198464	Yes	1.25 V	198464	CMOS	210		1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		198464 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.15 mm	23 mm	No		e1	450 MHz		210		23 mm
EP3SL70F780I3G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	67500	Yes	.94 V	2700		488		0.9		Grid Array	BGA780,28X28,40		.86 V	1 mm	100 °C (212 °F)		2700 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3 mm	29 mm		It can also operate from 1.05 to 1.15 V supply				488		29 mm
EP4CGX50DF27I7N	Intel	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	49888	Yes	1.25 V	49888		310		1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		49888 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	472.5 MHz	30 s	310	260 °C (500 °F)	27 mm
EP4SGX530NF45I3N	Intel	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy	531200	Yes	.93 V	212480		920		.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		212480 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1932		3.8 mm	45 mm	No		e1	717 MHz		920		45 mm
ICE40LP1K-CM121TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	160	CMOS			1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B121		1 mm	5 mm								5 mm
ICE40UL640-CM36AITR	Lattice Semiconductor	FPGA	Industrial	Ball	36	BGA	Square	Plastic/Epoxy	640	Yes	1.26 V	80	CMOS	26		1.2		Grid Array			1.14 V	.4 mm	100 °C (212 °F)	9 ns	80 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B36			2.5 mm						26		2.5 mm
ICE40UL640-SWG16ITR	Lattice Semiconductor	FPGA	Industrial	Ball	16	BGA	Square	Plastic/Epoxy	640	Yes	1.26 V	80	CMOS	10		1.2		Grid Array			1.14 V	.35 mm	100 °C (212 °F)	9 ns	80 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B16	1		1.409 mm					30 s	10	260 °C (500 °F)	1.409 mm
LCMXO2280C-3FTN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	2280	Yes	3.465 V	285		211		1.8	1.8/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	100 °C (212 °F)		285 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No		e1		40 s	211	260 °C (500 °F)	17 mm
LCMXO3D-4300HC-6SG72I	Lattice Semiconductor	FPGA	Industrial	No Lead	72	HVQCCN	Square		4300	Yes	3.465 V	537		58		2.5		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20		2.375 V	.5 mm	100 °C (212 °F)	6.7 ns	537 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N72		.9 mm	10 mm		Also Operates at 3.3 V nominal supply				58		10 mm
LCMXO3D-4300ZC-2BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	4300	Yes	3.465 V	537		206		2.5		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		2.375 V	.8 mm	100 °C (212 °F)	7 ns	537 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm		Also Operates at 3.3 V nominal supply				206		14 mm
LCMXO3D-9400ZC-2SG72I	Lattice Semiconductor	FPGA	Industrial	No Lead	72	HVQCCN	Square		9400	Yes	3.465 V	1175		58		2.5		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20		2.375 V	.5 mm	100 °C (212 °F)	7 ns	1175 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N72		.9 mm	10 mm		Also Operates at 3.3 V nominal supply				58		10 mm
LCMXO640C-3FT256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	640	Yes	3.465 V	80		159		1.8	1.8/2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	100 °C (212 °F)		80 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No		e0		30 s	159	225 °C (437 °F)	17 mm
LCMXO640C-3FTN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	640	Yes	3.465 V	80		159		1.8	1.8/2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	100 °C (212 °F)		80 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No		e1		40 s	159	260 °C (500 °F)	17 mm
LCMXO640C-4TN100I	Lattice Semiconductor	FPGA	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	640	Yes	3.465 V	80		74		1.8	1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	100 °C (212 °F)		80 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3		40 s	74	260 °C (500 °F)	14 mm
LFD2NX-40-8BG196I	Lattice Semiconductor	FPGA	Industrial	Ball	196		Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	92		1					.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B196			12 mm						92		12 mm
LFE2-20E-6FN484I	Lattice Semiconductor	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	20000	Yes	1.26 V	2625		331		1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.331 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	357 MHz		331	250 °C (482 °F)	23 mm
LFE2-35E-6FN484I	Lattice Semiconductor	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	35000	Yes	1.26 V	4000		331		1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.331 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	357 MHz		331	250 °C (482 °F)	23 mm
LFE2-50E-5FN484I	Lattice Semiconductor	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	50000	Yes	1.26 V	6000		339		1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	311 MHz		339	250 °C (482 °F)	23 mm
LFE2-50E-6FN484I	Lattice Semiconductor	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	50000	Yes	1.26 V	6000		339		1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.331 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	357 MHz		339	250 °C (482 °F)	23 mm
LFE3-35EA-6FN484I	Lattice Semiconductor	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	33000	Yes	1.26 V			295		1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.379 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	375 MHz		295	250 °C (482 °F)	23 mm
XC2S100-5TQ144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2700	Yes	2.625 V	600		96	100000	2.5	1.5/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)	0.7 ns	600 CLBS, 100000 Gates	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	263 MHz		92		20 mm
XC2S15-5VQG100I	Xilinx	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	432	Yes	2.625 V	96		86	15000	2.5	1.5/3.3,2.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.7 ns	96 CLBS, 15000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	263 MHz	30 s	86	260 °C (500 °F)	14 mm
XC2S150-5FGG256I	Xilinx	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	3888	Yes	2.625 V	864		260	150000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	864 CLBS, 150000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	263 MHz	30 s	260	260 °C (500 °F)	17 mm
XC2S200-5FG256I	Xilinx	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176		180	200000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)	0.7 ns	1176 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	263 MHz	30 s	176	225 °C (437 °F)	17 mm
XC2S200-5PQG208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176		144	200000	2.5	1.5/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.7 ns	1176 CLBS, 200000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	263 MHz	30 s	140	245 °C (473 °F)	28 mm
XC2S50-5PQG208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1728	Yes	2.625 V	384		176	50000	2.5	1.5/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)	0.7 ns	384 CLBS, 50000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	263 MHz	30 s	176	245 °C (473 °F)	28 mm
XC2VP20-5FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	404		1.5		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)	0.36 ns	2320 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	1050 MHz	30 s	404	225 °C (437 °F)	27 mm
XC3030A-7PC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	58	1500	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	5.1 ns	100 CLBS, 1500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J68	3	5.08 mm	24.2316 mm	No	Max usable 2000 Logic gates	e0	113 MHz		58		24.2316 mm
XC3030A-7PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	74	1500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	5.1 ns	100 CLBS, 1500 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 2000 Logic gates	e0	113 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC3S100E-4TQG144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS	108	100000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	240 CLBS, 100000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	572 MHz	30 s	80	260 °C (500 °F)	20 mm
XC3S1400A-4FT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS	161	1400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	2816 CLBS, 1400000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	667 MHz	30 s	148	225 °C (437 °F)	17 mm
XC3S1600E-4FGG320I	Xilinx	FPGA	Industrial	Ball	320	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS	250	1600000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e1	572 MHz	30 s	194	260 °C (500 °F)	19 mm
XC3S250E-4TQ144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	108	250000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	572 MHz		80		20 mm
XC3S250E-4VQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	66	250000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e4	572 MHz		59		14 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.