Industrial Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3020-50PQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS		64	2000	5	5 V	Flatpack	QFP100,.7X1.0	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)		64 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.1496 mm	14 mm	No	MAX 64 I/OS; 256 flip-flops	e0	50 MHz	30 s	64	225 °C (437 °F)	20 mm
XC6SLX100T-N3FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		296		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	806 MHz	30 s	296	225 °C (437 °F)	23 mm
XCVU080-1FFVA2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	975000	Yes	.979 V	672			832		.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		672 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
XC7A200T-L1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	215360	Yes	.98 V	16825			500		0.95		Grid Array	BGA1156,34X34,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	500	245 °C (473 °F)	35 mm
XC5VSX50T-2FFG1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	52224	Yes	1.05 V	4080	CMOS		480		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	4080 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e1		30 s	480	245 °C (473 °F)	35 mm
XC6SLX150T-3NFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	806 MHz				23 mm
XCVU095-2FFVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768			832		.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		768 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.81 mm	42.5 mm			e1		30 s	832	245 °C (473 °F)	42.5 mm
XC7A200T-3CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825			500		1		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	0.94 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1412 MHz	30 s	500	260 °C (500 °F)	15 mm
XC2VP20-7FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS		404		1.5		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)	0.28 ns	2320 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	1350 MHz	30 s	404	225 °C (437 °F)	27 mm
XC3S2000-4FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	46080	Yes	1.26 V	5120	CMOS		489	2000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.61 ns	5120 CLBS, 2000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	630 MHz		489		27 mm
XCKU095-1FFVC1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			702		0.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	No		e1		30 s	702	245 °C (473 °F)	40 mm
XQ6VLX240T-1RFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V	18840	CMOS		600		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	0.79 ns	18840 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.53 mm	35 mm			e0			600		35 mm
XA3S250E-4PQG208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	AEC-Q100	158	250000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	4.88 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	572 MHz	30 s	126	245 °C (473 °F)	28 mm
XC6VLX130T-1LFFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	128000	Yes	.97 V	10000	CMOS		240				Grid Array	BGA484,22X22,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	10000 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4	2.86 mm	23 mm			e1		30 s	240	250 °C (482 °F)	23 mm
XC7A100T-L2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	101440	Yes	.93 V	7925			300		0.9		Grid Array	BGA1156,34X34,40		.87 V	1 mm	100 °C (212 °F)	1.51 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	300	245 °C (473 °F)	35 mm
XC7A12T-1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	150	245 °C (473 °F)	35 mm
XC5VLX30-2FF324I	Xilinx	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400			220		1	1,2.5 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	2400 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324	4	2.85 mm	19 mm	No		e0		30 s	220	225 °C (437 °F)	19 mm
XC3030A-7PC44I	Xilinx	FPGA	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS		34	1500	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	5.1 ns	100 CLBS, 1500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Max usable 2000 Logic gates	e0	113 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC6SLX16-N3FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS		186		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	1139 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	806 MHz		186		17 mm
XC5VLX30-2FFG324I	Xilinx	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400			220		1	1,2.5 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	2400 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	4	2.85 mm	19 mm	No		e1		30 s	220	250 °C (482 °F)	19 mm
XC4003H-6PQ208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	238	Yes	5.5 V	100	CMOS		160	2500	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	6 ns	100 CLBS, 2500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	3.92 mm	28 mm	No	200 flip-flops; typical gates = 2500-3000	e0	90.9 MHz	30 s	160	225 °C (437 °F)	28 mm
XC3S500E-4CP132I	Xilinx	FPGA	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS		92	500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e0	572 MHz	30 s	85	225 °C (437 °F)	8 mm
XC4010-5PQ208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	400	Yes	5.5 V	400	CMOS		160	8000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	4.5 ns	400 CLBS, 8000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	3.92 mm	28 mm	No	1120 flip-flops; typical gates = 8000-10000	e0	133.3 MHz	30 s	160	225 °C (437 °F)	28 mm
XC3030-50PG84ISPC0107	Xilinx	FPGA	Industrial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	100	CMOS			3000	5		Grid Array			4.5 V	2.54 mm	85 °C (185 °F)		100 CLBS, 3000 Gates	-40 °C (-40 °F)	Matte Tin	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 74 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e3	50 MHz				27.94 mm
XC7A100T-L2FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	101440	Yes	.93 V	7925			300		0.9		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.87 V	1 mm	100 °C (212 °F)	1.51 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	300	260 °C (500 °F)	17 mm
XC5VLX220T-1FFV1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	221184	Yes	1.05 V	17280			680		1		Grid Array	BGA1738,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.9 ns	17280 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm					30 s	680	245 °C (473 °F)	42.5 mm
XQ6VSX315T-1LRF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	314880	Yes	.97 V	24600	CMOS		600				Grid Array	BGA1156,34X34,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	24600 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.53 mm	35 mm			e0			600		35 mm
XCVU440-1FLGB2377I	Xilinx	FPGA	Industrial	Ball	2377	BGA	Square	Plastic/Epoxy	5540850	Yes	.979 V	2880			1456		.95		Grid Array	BGA2377,49X49,40		.922 V	1 mm	100 °C (212 °F)		2880 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2377		3.83 mm	50 mm			e1			1456		50 mm
XC4002A-6VQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS		64	1600	5	5 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	6 ns	64 CLBS, 1600 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	256 flip-flops; typical gates = 1600-2000	e0	90.9 MHz	30 s	64	240 °C (464 °F)	14 mm
XC4005A-5TQ144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	196	Yes	5.5 V	196	CMOS		112	4000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	4.5 ns	196 CLBS, 4000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	616 flip-flops; typical gates = 4000-5000	e0	133.3 MHz	30 s	112	225 °C (437 °F)	20 mm
XC3S50A-4VQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS		68	50000	1.2	1.2,1.2/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.71 ns	176 CLBS, 50000 Gates	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e4	667 MHz		62		14 mm
XC3164-4PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes	5.5 V	224	CMOS		70	4000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	3.3 ns	224 CLBS, 4000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500	e0	230 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC7A35T-1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600			250		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm
XC5VLX110-1FF676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640			440		1	1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	8640 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e0		30 s	440	225 °C (437 °F)	27 mm
XC3S250E-4PQG208IS1	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS		158	250000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	572 MHz	30 s	126	245 °C (473 °F)	28 mm
XC3042-70PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.5 V	144	CMOS		74	2000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	9 ns	144 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA	e0	70 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC6SLX150T-N3FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS		296		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	806 MHz	30 s	296	225 °C (437 °F)	23 mm
XC6SLX25-L1FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes	1.05 V	1879	CMOS		266		1	1,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.46 ns	1879 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0		30 s	266	225 °C (437 °F)	23 mm
XCVU13P-2FIGD2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000			832		0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		216000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.59 mm	52.5 mm						832		52.5 mm
XC3042-70PG84I	Xilinx	FPGA	Industrial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.5 V	144	CMOS		74	2000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	9 ns	144 CLBS, 2000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA		70 MHz		74		27.94 mm
XC3195-5PG223I	Xilinx	FPGA	Industrial	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired	484	No	5.5 V	484	CMOS		176	6500	5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	4.1 ns	484 CLBS, 6500 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P223	1	4.064 mm	47.244 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000		190 MHz		176		47.244 mm
XC6SLX25-L1FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	24051	Yes	1.05 V	1879	CMOS		186		1	1,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.46 ns	1879 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1		30 s	186	260 °C (500 °F)	17 mm
XCKU085-1FLVF1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190			676		0.95	0.95 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm	No		e1		30 s	676	245 °C (473 °F)	45 mm
XC7S75-L1FGGA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	76800	Yes	.98 V	6000	HKMG		400		0.95		Grid Array	BGA676,26X26,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	6000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676		2.44 mm	27 mm			e1	1098 MHz		400		27 mm
XC6SLX45T-N3CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS		296		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	806 MHz		296		19 mm
XQ5VFX70T-1EF665I	Xilinx	FPGA	Industrial	Ball	665	BGA	Square	Plastic/Epoxy	71680	Yes	1.05 V	6080	CMOS		360		1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B665		2.9 mm	27 mm	No		e0	1098 MHz		360		27 mm
XQ4VLX100-11FFG1148I	Xilinx	FPGA	Industrial	Ball	1148	BGA	Square	Plastic/Epoxy		Yes	1.26 V		CMOS						Grid Array	BGA1148,34X34,40		1.14 V	1 mm	100 °C (212 °F)	0.66 ns		-40 °C (-40 °F)		Bottom	S-PBGA-B1148		3.4 mm	35 mm								35 mm
XC6VLX75T-L1FF784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	74496	Yes	.93 V		CMOS		360		.9	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No		e0	1098 MHz	30 s	360	220 °C (428 °F)	29 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.