Industrial Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7A15T-2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300		250		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1286 MHz	30 s	250	245 °C (473 °F)	35 mm
XC6SLX16-3NCSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	806 MHz				15 mm
XC7A35T-L1FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	33280	Yes	.98 V	2600		250		0.95		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	17 mm
XCVU160-2FLGB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	2026500	Yes	.979 V	1560		702		.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		1560 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm			e1			702		47.5 mm
XCKU040-3SFVA784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	530250	Yes	1.03 V	30300		520		1		Grid Array, Fine Pitch	BGA784,28X28,32		.97 V	.8 mm	100 °C (212 °F)		30300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784		3.52 mm	23 mm			e1			520		23 mm
XC7A50T-L2CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	.93 V	4075		250		0.9		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.87 V	.8 mm	100 °C (212 °F)	1.51 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XQ6VLX240T-2RFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V	18840	CMOS	720		1		Grid Array	BGA1759,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.67 ns	18840 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1759		3.5 mm	42.5 mm			e1			720		42.5 mm
XC7A12T-L1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	12800	Yes	.98 V	1000	HKMG	150		0.95		Grid Array	BGA1156,34X34,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	150	245 °C (473 °F)	35 mm
XCS150E-6FT256I	Xilinx	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	3888	Yes	1.89 V		CMOS	265		1.8	1.8,2.5,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	100 °C (212 °F)	0.47 ns		-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3		17 mm	No		e0	357 MHz		265		17 mm
XC3030-100PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	74	1500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	7 ns	100 CLBS, 1500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA	e0	100 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC4003A-6PQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	238	Yes	5.5 V	100	CMOS	77	2500	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	6 ns	100 CLBS, 2500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	360 flip-flops; typical gates = 2500-3000	e0	90.9 MHz	30 s	77	225 °C (437 °F)	20 mm
XC3S250E-4CP132IS1	Xilinx	FPGA	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	92	250000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e0	572 MHz	30 s	85	225 °C (437 °F)	8 mm
XCKU040-1SFVA784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	530250	Yes	.979 V	30300		520		0.95	0.95 V	Grid Array, Fine Pitch	BGA784,28X28,32	Field Programmable Gate Arrays	.922 V	.8 mm	100 °C (212 °F)		30300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784		3.52 mm	23 mm	No		e1			520		23 mm
XC3164-5PG132I	Xilinx	FPGA	Industrial	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	224	No	5.5 V	224	CMOS	110	4000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	4.1 ns	224 CLBS, 4000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500		190 MHz		110		37.084 mm
XC3042-100PP132ISPC0107	Xilinx	FPGA	Industrial	Pin/Peg	132	PGA	Square	Plastic/Epoxy		No	5.5 V	144	CMOS		4200	5		Grid Array			4.5 V	2.54 mm	85 °C (185 °F)	7 ns	144 CLBS, 4200 Gates	-40 °C (-40 °F)		Perpendicular	S-PPGA-P132		4.191 mm	37.084 mm	No	MAX 96 I/OS; 480 flip-flops; power-down supplier current = 3 µA @ VCC = 3.2 V & T = 25°C		100 MHz				37.084 mm
XC4010-5PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	400	Yes	5.5 V	400	CMOS	160	8000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	4.5 ns	400 CLBS, 8000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	1120 flip-flops; typical gates = 8000-10000	e0	133.3 MHz	30 s	160	225 °C (437 °F)	29.3116 mm
XC7A200T-L1FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	215360	Yes	.98 V	16825		500		0.95		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1098 MHz	30 s	500	260 °C (500 °F)	17 mm
XC7K160T-2LFBG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	162240	Yes	.93 V	12675		250		0.9		Grid Array	BGA676,26X26,40		.87 V	1 mm	100 °C (212 °F)	0.91 ns	12675 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm			e1			250		27 mm
XC6SLX75T-2CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	290		1.2	1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	667 MHz	30 s	290	260 °C (500 °F)	19 mm
XC7A25T-L2CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	23360	Yes	.93 V	1825	HKMG	150		0.9		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.87 V	.8 mm	100 °C (212 °F)	1.51 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC3S250E-4VQ100IS1	Xilinx	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	66	250000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Nickel/Palladium/Gold	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e4	572 MHz		59		14 mm
XC3030-100PC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	58	1500	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	7 ns	100 CLBS, 1500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA	e0	100 MHz		58		24.2316 mm
XC5VLX85-2FF676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	82944	Yes	1.05 V	6480		440		1	1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	6480 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e0		30 s	440	225 °C (437 °F)	27 mm
XC4005H-6PQ240I	Xilinx	FPGA	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	466	Yes	5.5 V	196	CMOS	192	4000	5	5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	6 ns	196 CLBS, 4000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240	3	3.75 mm	32 mm	No	392 flip-flops; typical gates = 4000-5000	e0	90.9 MHz	30 s	192	225 °C (437 °F)	32 mm
XC3S1400A-4FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS	502	1400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	2816 CLBS, 1400000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	667 MHz		408		27 mm
XC4003A-6VQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	238	Yes	5.5 V	100	CMOS	77	2500	5	5 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	6 ns	100 CLBS, 2500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	360 flip-flops; typical gates = 2500-3000	e0	90.9 MHz	30 s	77	240 °C (464 °F)	14 mm
XQ7A50T-1FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075	HKMG	250		1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3		23 mm	No		e0	1098 MHz	30 s	250	225 °C (437 °F)	23 mm
XC3030-50PC44ISPC0104	Xilinx	FPGA	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS		3000	5		Chip Carrier			4.5 V	1.27 mm	85 °C (185 °F)		100 CLBS, 3000 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J44		4.318 mm	16.5862 mm	No	MAX 34 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C		50 MHz				16.5862 mm
XQ6VLX550T-2RFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	549888	Yes	1.05 V	42960	CMOS	840		1		Grid Array	BGA1759,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.67 ns	42960 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1759		3.5 mm	42.5 mm			e1			840		42.5 mm
XCVU27P-1FSGA2577I	Xilinx	FPGA	Industrial	Ball	2577	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	162000		676		0.85		Grid Array	BGA2577,51X51,40		.825 V	1 mm	100 °C (212 °F)		162000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2577		4.51 mm	52.5 mm						676		52.5 mm
XC5VLX50T-1FFG1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	46080	Yes	10.5 V	3600		480		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	3600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e1		30 s	480	245 °C (473 °F)	35 mm
XC2018-50PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	74	1000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	15 ns	100 CLBS, 1000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 74 I/OS; 174 flip-flops; typical gates = 1000 - 1500	e0	50 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC6VHX565T-2FF1923I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	566784	Yes	1.05 V		CMOS	720		1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1924		3.85 mm	45 mm	No		e0	1286 MHz		720		45 mm
XC5VSX50T-1FFV665I	Xilinx	FPGA	Industrial	Ball	665	BGA	Square	Plastic/Epoxy	52224	Yes	1.05 V	4080	CMOS	360		1		Grid Array	BGA665,26X26,40		.95 V	1 mm	100 °C (212 °F)	0.9 ns	4080 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm			e1		30 s	360	250 °C (482 °F)	27 mm
XC2S300E-6TGGQGG144I	Xilinx	FPGA	Industrial	G	144	FQFP	Square	Plastic/Epoxy		Yes	1.89 V	1536			93000	1.8		Flatpack, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	1536 CLBS, 93000 Gates	-40 °C (-40 °F)		Quad	S-PQFP-G144		1.6 mm	20 mm	No	Maximum usable gates = 300000		357 MHz				20 mm
XCVU125-2FLVB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	1200		884		.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		1200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1		30 s	884	245 °C (473 °F)	47.5 mm
XCKU025-2FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312		0.95		Grid Array	BGA1156,34X34,40		.922 V	1 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm			e1			312		35 mm
XC6SLX150T-3NCS484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519		296		1.2		Grid Array	BGA484,22X22,32		1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			296		19 mm
XC4008-5PQ160I	Xilinx	FPGA	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	770	Yes	5.5 V	324	CMOS	129	6500	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	4.5 ns	324 CLBS, 6500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160	3	3.92 mm	28 mm	No	936 flip-flops; typical gates = 6500-8000	e0	133.3 MHz	30 s	129	225 °C (437 °F)	28 mm
XCKU19P-2FFVJ1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1842750	Yes	.876 V	105300		540		0.85		Grid Array	BGA1760,42X42,40		.825 V	1 mm	100 °C (212 °F)		105300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.27 mm	42.5 mm			e1			540		42.5 mm
XC3030A-7VQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	80	1500	5	5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	5.1 ns	100 CLBS, 1500 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Max usable 2000 Logic gates	e0	113 MHz	30 s	80	240 °C (464 °F)	14 mm
XQ6VLX240T-1RFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V	18840	CMOS	720		1		Grid Array	BGA1759,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.79 ns	18840 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1759		3.5 mm	42.5 mm			e1			720		42.5 mm
XC5VLX30T-1FFV323I	Xilinx	FPGA	Industrial	Ball	323	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		172		1		Grid Array	BGA323,18X18,40		.95 V	1 mm	100 °C (212 °F)	0.9 ns	2400 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B323	4	2.85 mm	19 mm			e1		30 s	172	250 °C (482 °F)	19 mm
XC3195-4PP175I	Xilinx	FPGA	Industrial	Pin/Peg	175	PGA	Square	Plastic/Epoxy	484	No	5.5 V	484	CMOS	144	6500	5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	3.3 ns	484 CLBS, 6500 Gates	-40 °C (-40 °F)	Tin Lead	Perpendicular	S-PPGA-P175	1	3.937 mm	42.164 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000	e0	230 MHz		144		42.164 mm
XC2018LPC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	100	CMOS		1500	3.3		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)		100 CLBS, 1500 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 74 I/OS; 1200 to 1500 available gates						29.3116 mm
XC6VHX380T-1FFG1154I	Xilinx	FPGA	Industrial	Ball	1154	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	320		1	1,1.2/2.5 V	Grid Array	BGA1154,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1154	4	3.5 mm	35 mm	No		e1	1098 MHz	30 s	320	245 °C (473 °F)	35 mm
XC3130-5TQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Square	Plastic/Epoxy	100	Yes			CMOS	80		5	5 V	Flatpack	QFP100,.63SQ,20	Field Programmable Gate Arrays		.5 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3			No		e0	190 MHz	30 s	80	225 °C (437 °F)
XC3030-70PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	74	1500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	9 ns	100 CLBS, 1500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA	e0	70 MHz	30 s	74	225 °C (437 °F)	29.3116 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.