Industrial Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XA6SLX75-2FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831		AEC-Q100; TS 16949	280		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	280	250 °C (482 °F)	23 mm
XC7A100T-2CPG236I	Xilinx	FPGA	Industrial	Ball	236	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925			300		1			Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.05 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1286 MHz	30 s	300	260 °C (500 °F)	10 mm
XC6SLX25-N3FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS		266		1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	1879 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	806 MHz	30 s	266	250 °C (482 °F)	23 mm
XC4010D-5PQ160I	Xilinx	FPGA	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	400	Yes	5.5 V	400	CMOS		160	8000	5		5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	4.5 ns	400 CLBS, 8000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160	3	3.92 mm	28 mm	No	1120 flip-flops; typical gates = 8000-10000	e0	133.3 MHz	30 s	160	225 °C (437 °F)	28 mm
XCS100E-6FG456I	Xilinx	FPGA	Industrial	Ball	456	BGA	Square	Plastic/Epoxy	2700	Yes	1.89 V		CMOS		202		1.8		1.8,2.5,3.3 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	100 °C (212 °F)	0.47 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B456	3		23 mm	No		e0	357 MHz	30 s	202	225 °C (437 °F)	23 mm
XCKU095-L1FFVC1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.92 V	67200			702		0.9			Grid Array	BGA1517,39X39,40		.88 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm		Also Operates at 0.95 V nominal supply	e1		30 s	702	245 °C (473 °F)	40 mm
XC3042-100PP132I	Xilinx	FPGA	Industrial	Pin/Peg	132	PGA	Square	Plastic/Epoxy	144	No	5.5 V	144	CMOS		96	4200	5		5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	7 ns	144 CLBS, 4200 Gates	-40 °C (-40 °F)		Perpendicular	S-PPGA-P132	1	4.191 mm	37.084 mm	No	MAX 96 I/OS; 480 flip-flops		100 MHz		96		37.084 mm
XC7A35T-2CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600			250		1			Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.05 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1286 MHz		250		10 mm
XCS100E-6FT256I	Xilinx	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	1.89 V		CMOS		202		1.8		1.8,2.5,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	100 °C (212 °F)	0.47 ns		-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3		17 mm	No		e0	357 MHz		202		17 mm
XC2064-70PC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS		58	600	5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	10 ns	64 CLBS, 600 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	122 flip-flops; typical gates = 600-1000		70 MHz		58	225 °C (437 °F)	24.2316 mm
XC3190-5PP175I	Xilinx	FPGA	Industrial	Pin/Peg	175	PGA	Square	Plastic/Epoxy	320	No	5.5 V	320	CMOS		144	5000	5		5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	4.1 ns	320 CLBS, 5000 Gates	-40 °C (-40 °F)		Perpendicular	S-PPGA-P175	1	3.937 mm	42.164 mm	No	MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500		190 MHz		144		42.164 mm
XC5VLX110-1FFV1153I	Xilinx	FPGA	Industrial	Ball	1153	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640			800		1			Grid Array	BGA1153,34X34,40		.95 V	1 mm	100 °C (212 °F)	0.9 ns	8640 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1153		3.4 mm	35 mm						800		35 mm
XC6SLX45T-4CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	43661	Yes			CMOS		190				1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1		30 s	190	260 °C (500 °F)	15 mm
XC4005E-3PQ208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	196	Yes	5.5 V	196	CMOS		112	3000	5		5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	2 ns	196 CLBS, 3000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 5000 Logic gates	e0	125 MHz	30 s	112	225 °C (437 °F)	28 mm
XC8109-ESPQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.5 V	2688	CMOS			8700	5			Flatpack			4.5 V	.65 mm	85 °C (185 °F)	5.5 ns	2688 CLBS, 8700 Gates	-40 °C (-40 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No	MAX 78 I/OS; MAX 1344 flip-flops; OTP based						20 mm
XC6VLX240T-2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS		600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7A35T-L2FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	33280	Yes	.93 V	2600			250		0.9			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.87 V	1 mm	100 °C (212 °F)	1.51 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	250	260 °C (500 °F)	17 mm
XCKU115-1FLVD1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520			832		.95		0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1		30 s	832	245 °C (473 °F)	40 mm
XC6VLX75T-1LFFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74496	Yes	.97 V	5820	CMOS		240					Grid Array	BGA484,22X22,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	5820 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4	2.86 mm	23 mm			e1		30 s	240	250 °C (482 °F)	23 mm
XC6VLX75T-1FFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74496	Yes	1.05 V		CMOS		240		1		1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No		e1	1098 MHz	30 s	240	250 °C (482 °F)	23 mm
XC5VFX200T-2FFG1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	196608	Yes	1.05 V	15360	CMOS		960		1		1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	15360 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm	No		e1		30 s	960	245 °C (473 °F)	42.5 mm
XCKU115-L1FLVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	.927 V	5520			832		.9		0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.873 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No	Also Operates at 0.95 V nominal supply	e1		30 s	832	245 °C (473 °F)	40 mm
XC3S500E-4FGG320IS1	Xilinx	FPGA	Industrial	Ball	320	BGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS		232	500000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e1	572 MHz	30 s	176	260 °C (500 °F)	19 mm
XC3042A-7PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.5 V	144	CMOS		74	2000	5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	5.1 ns	144 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 3000 Logic gates	e0	113 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC7A35T-3CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600			250		1			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	0.94 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1412 MHz	30 s	250	260 °C (500 °F)	15 mm
XQ4VLX40-10FFG668I	Xilinx	FPGA	Industrial	Ball	668	BGA	Square	Plastic/Epoxy		Yes	1.26 V		CMOS							Grid Array	BGA668,26X26,40		1.14 V	1 mm	100 °C (212 °F)	0.78 ns		-40 °C (-40 °F)		Bottom	S-PBGA-B668		2.85 mm	27 mm								27 mm
XC6SLX75T-3NFG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2			Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	806 MHz				27 mm
XC3190-4PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	320	Yes	5.5 V	320	CMOS		70	5000	5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	3.3 ns	320 CLBS, 5000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500	e0	230 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC7S6-L1CPGA196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	6000	Yes	.98 V	469			100		0.95			Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		.92 V	.5 mm	100 °C (212 °F)	1.27 ns	469 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196		1.1 mm	8 mm			e1	1098 MHz		100		8 mm
XA3S50-4VQG100I	Xilinx	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	1728	Yes	1.26 V	192		AEC-Q100	124	50000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)		192 CLBS, 50000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	125 MHz	30 s	124	260 °C (500 °F)	14 mm
XC5VSX50T-1FFG1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	52224	Yes	1.05 V	4080	CMOS		480		1		1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	4080 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e1		30 s	480	245 °C (473 °F)	35 mm
XC2018-100PG84I	Xilinx	FPGA	Industrial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.5 V	100	CMOS		74	1000	5		5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	8 ns	100 CLBS, 1000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	174 flip-flops; typical gates = 1000-1500		100 MHz		74		27.94 mm
XC6SLX150-1LFG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2			Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	500 MHz				27 mm
XC3020-50PG84ISPC0110	Xilinx	FPGA	Industrial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	64	CMOS			2000	5			Grid Array			4.5 V	2.54 mm	85 °C (185 °F)		64 CLBS, 2000 Gates	-40 °C (-40 °F)	Matte Tin	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e3	50 MHz				27.94 mm
XC6SLX150T-N3CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS		296		1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	806 MHz		296		19 mm
XQ6VSX475T-1RFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V	37200	CMOS		840		1			Grid Array	BGA1759,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.79 ns	37200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1759		4.37 mm	42.5 mm			e1			840		42.5 mm
XQ6VSX475T-1LRF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	.97 V	37200	CMOS		600					Grid Array	BGA1156,34X34,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	37200 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.53 mm	35 mm			e0			600		35 mm
XCKU060-1LFFVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	2760	CMOS		624		0.95	Tray		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		2760 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm			e1		30 s	624	245 °C (473 °F)	40 mm
XC6SLX75-2FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS		280		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	667 MHz	30 s	280	225 °C (437 °F)	23 mm
XQ5VLX110T-1EF1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640	CMOS		640		1		1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1136		3.4 mm	35 mm	No		e0	1098 MHz		640		35 mm
XC8109-ESPC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	2688	CMOS			8700	5			Chip Carrier			4.5 V	1.27 mm	85 °C (185 °F)	5.5 ns	2688 CLBS, 8700 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	MAX 61 I/OS; MAX 1344 flip-flops; OTP based						29.3116 mm
XC4004A-6PG120I	Xilinx	FPGA	Industrial	Pin/Peg	120	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.5 V	144	CMOS		95	3200	5		5 V	Grid Array	PGA120,13X13	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	6 ns	144 CLBS, 3200 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P120		3.81 mm	34.544 mm	No	480 flip-flops; typical gates = 3200-4000		90.9 MHz		95		34.544 mm
XQ6VSX315T-1LRFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	314880	Yes	.93 V	24600	CMOS		720		0.9			Grid Array	BGA1759,42X42,40		.87 V	1 mm	100 °C (212 °F)	0.85 ns	24600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1759		3.5 mm	42.5 mm			e1			720		42.5 mm
XC6VLX365T-1LFFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	364032	Yes	.97 V	28440	CMOS		720					Grid Array	BGA1759,42X42,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	28440 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm			e1		30 s	720	245 °C (473 °F)	42.5 mm
XC7A75T-1CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900			300		1			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	300	260 °C (500 °F)	15 mm
XC6VHX380T-2FFG1923I	Xilinx	FPGA	Industrial	Ball	1923	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS		720		1		1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1923	4	3.85 mm	45 mm	No		e1	1286 MHz	30 s	720	245 °C (473 °F)	45 mm
XC6SLX150T-4FGG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes			CMOS		540				1.2,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1		30 s	540	250 °C (482 °F)	31 mm
XC5VSX240T-2FF1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	239616	Yes	1.05 V	18720	CMOS		960		1		1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	18720 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm	No		e0		30 s	960	225 °C (437 °F)	42.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.