Industrial Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6SLX16-N3FT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS		186		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	1139 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	806 MHz	30 s	186	225 °C (437 °F)	17 mm
XC7A100T-L2CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	101440	Yes	.93 V	7925			300		0.9		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.87 V	.5 mm	100 °C (212 °F)	1.51 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		Also Operates at 1 V nominal supply	e1	1098 MHz		300		10 mm
XC6VLX130T-2FFG784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS		400		1	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No		e1	1286 MHz	30 s	400	245 °C (473 °F)	29 mm
XC5VLX50-2FF324I	Xilinx	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	46080	Yes	1.05 V	3600			220		1	1,2.5 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	3600 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324	4	2.85 mm	19 mm	No		e0		30 s	220	225 °C (437 °F)	19 mm
XC3120-4PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS		64	1000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	3.3 ns	64 CLBS, 1000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 1000-1500	e0	227 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC6VLX75T-2FFG784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	74496	Yes	1.05 V		CMOS		360		1	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No		e1	1286 MHz	30 s	360	245 °C (473 °F)	29 mm
XC5VLX220T-2FFV1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	221184	Yes	1.05 V	17280			680		1		Grid Array	BGA1738,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.77 ns	17280 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm					30 s	680	245 °C (473 °F)	42.5 mm
XC3S200A-4FG320I	Xilinx	FPGA	Industrial	Ball	320	BGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS		248	200000	1.2	1.2,2.5/3.3 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	448 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e0	667 MHz	30 s	192	225 °C (437 °F)	19 mm
XC5VSX240T-1FFV1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	239616	Yes	1.05 V	18720	CMOS		960		1		Grid Array	BGA1738,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.9 ns	18720 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm					30 s	960	245 °C (473 °F)	42.5 mm
XC6VHX380T-1FF1154I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS		320		1	1,1.2/2.5 V	Grid Array	BGA1154,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.5 mm	35 mm	No		e0	1098 MHz		320		35 mm
XC5VLX85T-2FFV1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	82944	Yes	1.05 V	6480			480		1		Grid Array	BGA1136,34X34,40		.95 V	1 mm	100 °C (212 °F)	0.77 ns	6480 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm			e1		30 s	480	245 °C (473 °F)	35 mm
XC6SLX150T-2FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS		396		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	667 MHz	30 s	396	225 °C (437 °F)	27 mm
XC6VLX195T-1LFFG784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	199680	Yes	.97 V	15600	CMOS		400				Grid Array	BGA784,28X28,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	15600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	2.86 mm	29 mm			e1			400		29 mm
XC7A35T-L2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	33280	Yes	.93 V	2600			250		0.9		Grid Array	BGA1156,34X34,40		.87 V	1 mm	100 °C (212 °F)	1.51 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm
XQ4VFX60-10EFG672I	Xilinx	FPGA	Industrial	Ball	672		Square	Plastic/Epoxy		Yes	1.26 V		CMOS									1.14 V		100 °C (212 °F)	0.78 ns		-40 °C (-40 °F)		Bottom	S-PBGA-B672
XCVU190-2FLGB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	2349900	Yes	.979 V	1800			702		.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		1800 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm			e1			702		47.5 mm
XC5VLX155-1FFV1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160			800		1		Grid Array	BGA1760,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.9 ns	12160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm					30 s	800	245 °C (473 °F)	42.5 mm
XC7A75T-L1CPG236I	Xilinx	FPGA	Industrial	Ball	236	LFBGA	Square	Plastic/Epoxy	75520	Yes	.98 V	5900			300		0.95		Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.92 V	.5 mm	100 °C (212 °F)	1.27 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1098 MHz	30 s	300	260 °C (500 °F)	10 mm
XC4025-6PG223I	Xilinx	FPGA	Industrial	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired	1024	No	5.5 V	1024	CMOS		256	20000	5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	6 ns	1024 CLBS, 20000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P223	1	4.064 mm	47.244 mm	No	2560 flip-flops; typical gates = 20000-25000		90.9 MHz		256		47.244 mm
XC6SLX25T-4FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes			CMOS		250			1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1		30 s	250	250 °C (482 °F)	23 mm
XC3120-3PC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS		58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	2.7 ns	64 CLBS, 1000 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	Typical gates = 1000-1500		270 MHz		58		24.2316 mm
XC6SLX100-2FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		480		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	667 MHz	30 s	480	225 °C (437 °F)	27 mm
XC7A100T-1CPG236I	Xilinx	FPGA	Industrial	Ball	236	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925			300		1		Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1098 MHz	30 s	300	260 °C (500 °F)	10 mm
XC6SLX45T-3NFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	806 MHz				23 mm
XC6SLX16-3FT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS		186		1.2	1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	1139 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	862 MHz	30 s	186	225 °C (437 °F)	17 mm
XC5VLX220-2FFG1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	221184	Yes	1.05 V	17280			800		1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	17280 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1		30 s	800	225 °C (437 °F)	42.5 mm
XC5VLX50-2FFV676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	46080	Yes	1.05 V	3600			440		1		Grid Array	BGA676,26X26,40		.95 V	1 mm	100 °C (212 °F)	0.77 ns	3600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm			e1		30 s	440	250 °C (482 °F)	27 mm
XC6VLX240T-2FF784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS		400		1	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B784	4	2.86 mm	29 mm	No		e0	1286 MHz	30 s	400	220 °C (428 °F)	29 mm
XC4010-6PQ208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	400	Yes	5.5 V	400	CMOS		160	8000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	6 ns	400 CLBS, 8000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	3.92 mm	28 mm	No	1120 flip-flops; typical gates = 8000-10000	e0	90.9 MHz	30 s	160	225 °C (437 °F)	28 mm
XC5VLX155T-1FF1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160			640		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	12160 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e0		30 s	640	225 °C (437 °F)	35 mm
XC6VHX380T-2FF1154I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS		320		1	1,1.2/2.5 V	Grid Array	BGA1154,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.5 mm	35 mm	No		e0	1286 MHz		320		35 mm
XA3S200-4TQG144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	4320	Yes	1.26 V	480		AEC-Q100	173	200000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)		480 CLBS, 200000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	125 MHz	30 s	173	260 °C (500 °F)	20 mm
XC6SLX25-L1CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	24051	Yes	1.05 V	1879	CMOS		226		1	1,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	0.46 ns	1879 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1		30 s	226	260 °C (500 °F)	15 mm
XQ5VLX110T-2EF1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640	CMOS		640		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1136		3.4 mm	35 mm	No		e0	1265 MHz		640		35 mm
XCKU9P-1FFVE900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	599550	Yes	.876 V	34260			304		0.85		Grid Array	BGA900,30X30,40		.825 V	1 mm	100 °C (212 °F)		34260 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s	304	245 °C (473 °F)	31 mm
XCV405E-8BGG560I	Xilinx	FPGA	Industrial	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	1.89 V	2400	CMOS			129600	1.8		Grid Array, Low Profile			1.71 V	1.27 mm	85 °C (185 °F)	0.4 ns	2400 CLBS, 129600 Gates	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	416 MHz	30 s		260 °C (500 °F)	42.5 mm
XC8103-ESPQ160I	Xilinx	FPGA	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.5 V	1024	CMOS			3328	5		Flatpack			4.5 V	.65 mm	85 °C (185 °F)	5.5 ns	1024 CLBS, 3328 Gates	-40 °C (-40 °F)		Quad	S-PQFP-G160		4.1 mm	28 mm	No	MAX 128 I/OS; MAX 512 flip-flops; OTP based						28 mm
XCKU19P-1FFVJ1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1842750	Yes	.876 V	105300			540		0.85		Grid Array	BGA1760,42X42,40		.825 V	1 mm	100 °C (212 °F)		105300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.27 mm	42.5 mm			e1			540		42.5 mm
XC3S500E-4FTG256IS1	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS		190	500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	572 MHz	30 s	149	260 °C (500 °F)	17 mm
XC3020-70PQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS		64	1000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	9 ns	64 CLBS, 1000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA	e0	70 MHz	30 s	64	225 °C (437 °F)	20 mm
XA3S400-4PQG208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	8064	Yes	1.26 V	896		AEC-Q100	264	400000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)		896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	125 MHz	30 s	264	245 °C (473 °F)	28 mm
XC7K70T-2LFBG676C	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	65600		1.03 V	5125	HKMG		100		0.9		Grid Array	BGA676,26X26,40		.87 V	1 mm	85 °C (185 °F)	0.91 ns	5125 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e1		30 s	100	250 °C (482 °F)	27 mm
XC6SLX100-N3FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		480		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	806 MHz	30 s	480	250 °C (482 °F)	27 mm
XC4008-5PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	770	Yes	5.5 V	324	CMOS		61	6500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	4.5 ns	324 CLBS, 6500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	936 flip-flops; typical gates = 6500-8000	e0	133.3 MHz	30 s	61	225 °C (437 °F)	29.3116 mm
XCKU3P-L1FFVA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	355950	Yes	.742 V	20340			304		0.72		Grid Array	BGA676,26X26,40		.698 V	1 mm	100 °C (212 °F)		20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm			e1		30 s	304	250 °C (482 °F)	27 mm
XC3030-50PC68ISPC0104	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS			3000	5		Chip Carrier			4.5 V	1.27 mm	85 °C (185 °F)		100 CLBS, 3000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J68		4.699 mm	24.2316 mm	No	MAX 58 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				24.2316 mm
XC5VFX130T-2FFG1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	13172	Yes	1.05 V	10240	CMOS		840		1	1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	10240 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm	No		e1		30 s	840	245 °C (473 °F)	42.5 mm
XC3120-5PQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS		64	1000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	4.1 ns	64 CLBS, 1000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Typical gates = 1000-1500	e0	188 MHz	30 s	64	225 °C (437 °F)	20 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.