Industrial Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
AGL400V5-FG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	9216	Yes	1.575 V		CMOS	178	400000	1.5			Grid Array	BGA256,16X16,40		1.425 V	1 mm	100 °C (212 °F)		400000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No		e0		20 s	178	225 °C (437 °F)	17 mm
AGL600V5-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	13824	Yes	1.575 V		CMOS	97	600000	1.5			Grid Array, Low Profile	BGA144,12X12,40		1.425 V	1 mm	100 °C (212 °F)		600000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0			97		13 mm
AGLN060V5-VQ100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	1536	CMOS		60000	1.5	Tray		Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		1536 CLBS, 60000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0		20 s		235 °C (455 °F)	14 mm
AGLN125V2-VQ100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	3072	CMOS		125000	1.2	Tray		Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		3072 CLBS, 125000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0					14 mm
AGLP030V5CSG201I	Actel	FPGA	Industrial	Ball	201	VFBGA	Square	Plastic/Epoxy	792	Yes	1.575 V	792	CMOS	120	30000	1.5		1.5 V	Grid Array, Very Thin Profile, Fine Pitch	BGA201,15X15,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		792 CLBS, 30000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B201		.99 mm	8 mm	No			250 MHz		120		8 mm
AGLP030V5-CSG201I	Microchip Technology	FPGA	Industrial	Ball	201	VFBGA	Square	Plastic/Epoxy	792	Yes	1.575 V	792	CMOS	120	30000	1.5		1.5 V	Grid Array, Very Thin Profile, Fine Pitch	BGA201,15X15,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		792 CLBS, 30000 Gates	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B201	3	.99 mm	8 mm	No		e3	250 MHz	30 s	120	260 °C (500 °F)	8 mm
AGLP060V2-VQG176I	Microchip Technology	FPGA	Industrial	Gull Wing	176	TFQFP	Square	Plastic/Epoxy	1584	Yes	1.575 V	1584	CMOS	137	60000	1.5		1.2/1.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP176,.87SQ,16	Field Programmable Gate Arrays	1.425 V	.4 mm	85 °C (185 °F)		1584 CLBS, 60000 Gates	-40 °C (-40 °F)		Quad	S-PQFP-G176	3	1.2 mm	20 mm	No			160 MHz		137		20 mm
AGLP060V2VQG176I	Actel	FPGA	Industrial	Gull Wing	176	TFQFP	Square	Plastic/Epoxy	1584	Yes	1.575 V	1584	CMOS	137	60000	1.5		1.2/1.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP176,.87SQ,16	Field Programmable Gate Arrays	1.425 V	.4 mm	85 °C (185 °F)		1584 CLBS, 60000 Gates	-40 °C (-40 °F)		Quad	S-PQFP-G176		1.2 mm	20 mm	No			160 MHz		137		20 mm
APA075-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	3072	Yes	2.7 V		CMOS	158	75000	2.5	Tray	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	85 °C (185 °F)		75000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	180 MHz	30 s	158	245 °C (473 °F)	28 mm
APA075-TQG144I	Microchip Technology	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	3072	Yes	2.7 V		CMOS	107	75000	2.5		2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	85 °C (185 °F)		75000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	180 MHz	30 s	107	260 °C (500 °F)	20 mm
APA150-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	6144	Yes	2.7 V		CMOS	100	150000	2.5	Tray	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	2.3 V	1 mm	85 °C (185 °F)		150000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	180 MHz	30 s	100	260 °C (500 °F)	13 mm
APA450-FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	12288	Yes	2.7 V		CMOS	344	450000	2.5		2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	2.3 V	1 mm	85 °C (185 °F)		450000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	25 mm	No		e0	180 MHz		344		25 mm
AX1000-2FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	18144	Yes	1.575 V	12096	CMOS	516	1000000	1.5	Tray	1.5,1.5/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.74 ns	12096 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	27 mm	No	1000000 system gates avaiable	e1	870 MHz	30 s	516	250 °C (482 °F)	27 mm
AX2000-FG896I	Microchip Technology	FPGA	Industrial	Ball	896	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	21504	CMOS	684	2000000	1.5	Tray	1.5,1.5/3.3,2.5/3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.99 ns	21504 CLBS, 2000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No	2000000 system gates avaiable	e0	649 MHz		684		31 mm
AX2000-FGG896I	Microchip Technology	FPGA	Industrial	Ball	896	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	21504	CMOS	684	2000000	1.5	Tray	1.5,1.5/3.3,2.5/3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.99 ns	21504 CLBS, 2000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No	2000000 system gates avaiable	e1	649 MHz	30 s	684	245 °C (473 °F)	31 mm
EX64-TQG64I	Microchip Technology	FPGA	Industrial	Gull Wing	64	LFQFP	Square	Plastic/Epoxy		Yes	2.7 V	128	CMOS	41	3000	2.5			Flatpack, Low Profile, Fine Pitch	QFP64,.47SQ,20		2.3 V	.5 mm	85 °C (185 °F)		128 CLBS, 3000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.6 mm	10 mm		2000 typical gates available	e3		30 s	41	260 °C (500 °F)	10 mm
M1AFS600-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS		600000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1		30 s		250 °C (482 °F)	23 mm
M1AGL1000V2-CS281I	Microchip Technology	FPGA	Industrial	Ball	281	TFBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V		CMOS	215	1000000	1.2			Grid Array, Thin Profile, Fine Pitch	BGA281,19X19,20		1.14 V	.5 mm	100 °C (212 °F)		1000000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B281		1.05 mm	10 mm	No		e0			215		10 mm
M2GL005-1TQG144I	Microchip Technology	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.6 mm	20 mm					30 s		260 °C (500 °F)	20 mm
M2GL010-1VFG256I	Microchip Technology	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.56 mm	14 mm					30 s		260 °C (500 °F)	14 mm
M2GL010-VF256I	Microchip Technology	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.56 mm	14 mm					20 s		240 °C (464 °F)	14 mm
M2GL010-VFG400I	Microchip Technology	FPGA	Industrial	Ball	400	LFBGA	Square	Plastic/Epoxy	12084	Yes	1.26 V		CMOS	195		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B400	3	1.51 mm	17 mm	No					195		17 mm
M2GL050TS-1FCS325I	Microchip Technology	FPGA	Industrial	Ball	325	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V		CMOS	200		1.2	Tray	1.2 V	Grid Array	BGA325,21X21,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325			11 mm	No				20 s	200	240 °C (464 °F)	11 mm
M2GL060TS-FCSG325I	Microchip Technology	FPGA	Industrial	Ball	325	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Grid Array			1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325	3		11 mm					30 s		260 °C (500 °F)	11 mm
M2GL090-FG676I	Microchip Technology	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	86316	Yes	1.26 V		CMOS	425		1.2	Tray	1.2 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0		20 s	425	225 °C (437 °F)	27 mm
M2GL090T-1FCSG325I	Microchip Technology	FPGA	Industrial		325			Plastic	86316	Yes			CMOS	180		1.2	Tray	1.2 V		BGA325,21X21,20	Field Programmable Gate Arrays			100 °C (212 °F)			-40 °C (-40 °F)				3			No					180
M2GL090T-FGG676I	Microchip Technology	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	86316	Yes	1.26 V		CMOS	425		1.2	Tray	1.2 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No				30 s	425	250 °C (482 °F)	27 mm
M2GL090TS-1FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	86316	Yes	1.26 V			267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No					267		23 mm
TPC1020BFN-084I	Texas Instruments	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	547	Yes			CMOS	69		5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	S-PQCC-J84				No					69
TPC1020BFN-068I2	Texas Instruments	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	547	Yes			CMOS	69		5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	S-PQCC-J68				No					69
TPC1010BFN-044I	Texas Instruments	FPGA	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	295	Yes	5.5 V	295	CMOS	57	1200	5		5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	17.82 ns	295 CLBS, 1200 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No	MAX 34 I/OS; 130 flip-flops		100 MHz		57		16.5862 mm
TPC1020BFN-044I2	Texas Instruments	FPGA	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	547	Yes			CMOS	69		5		5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	S-PQCC-J44				No					69
TPC1010BVE-100I2	Texas Instruments	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	295	Yes			CMOS	57		5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.635 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	R-PQFP-G100				No					57
TPC1225AVE-100I	Texas Instruments	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	451	Yes	5.5 V	451	CMOS	83	2500	5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)		451 CLBS, 2500 Gates	-40 °C (-40 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			66 MHz		83		20 mm
TPC1020AFN-044I1	Texas Instruments	FPGA	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	547	Yes	5.5 V	547	CMOS	69	2000	5		5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	14.796 ns	547 CLBS, 2000 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No	MAX 34 I/OS; 273 flip-flops				69		16.5862 mm
TPC1240VE-144I	Texas Instruments	FPGA	Industrial	Gull Wing	144	QFP	Square	Plastic/Epoxy	684	Yes	5.5 V	684	CMOS	104	4000	5		5 V	Flatpack	QFP144,1.2SQ	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)		684 CLBS, 4000 Gates	-40 °C (-40 °F)		Quad	S-PQFP-G144		4.07 mm	28 mm	No			55 MHz		104		28 mm
TPC1460GB-207I	Texas Instruments	FPGA	Industrial	Pin/Peg	207	PGA	Rectangular	Ceramic, Metal-Sealed Cofired		No			CMOS						Grid Array					85 °C (185 °F)			-40 °C (-40 °F)			R-CPGA-P207				No	MAX 168 I/OS
TPC1020BFN-068I1	Texas Instruments	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	547	Yes			CMOS	69		5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	S-PQCC-J68				No					69
TPC1280GB-176I	Texas Instruments	FPGA	Industrial	Pin/Peg	176	HPGA	Square	Ceramic, Metal-Sealed Cofired	1232	No	5.5 V	1232	CMOS	140	8000	5		5 V	Grid Array, Heat Sink/Slug	HPGA176,15X15	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	17.55 ns	1232 CLBS, 8000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P176		5.46 mm	39.88 mm	No	MAX 140 I/OS; 998 flip-flops		43 MHz		140		39.88 mm
TPC1010BFN-068I	Texas Instruments	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	295	Yes	5.5 V	295	CMOS	57	1200	5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	17.82 ns	295 CLBS, 1200 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68		4.57 mm	24.2316 mm	No	MAX 57 I/OS; 130 flip-flops		100 MHz		57		24.2316 mm
TPC1020BVE-100I2	Texas Instruments	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	547	Yes			CMOS	69		5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.635 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	R-PQFP-G100				No					69
TPC1010BVE-100I	Texas Instruments	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	295	Yes			CMOS	57		5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.635 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	R-PQFP-G100				No					57
TPC1020AFN-068I	Texas Instruments	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	547	Yes	5.5 V	547	CMOS	69	2000	5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	17.82 ns	547 CLBS, 2000 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68		4.57 mm	24.2316 mm	No	MAX 57 I/OS; 273 flip-flops		100 MHz		69		24.2316 mm
TPC1240GB-133I1	Texas Instruments	FPGA	Industrial	Pin/Peg	133	PGA	Square	Ceramic, Metal-Sealed Cofired	684	No	5.5 V	684	CMOS	104	4000	5		5 V	Grid Array	PGA133M,13X13	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)		684 CLBS, 4000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P133		4.27 mm	34.544 mm	No			66 MHz		104		34.544 mm
TPC1020BFN-044I1	Texas Instruments	FPGA	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	547	Yes			CMOS	69		5		5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	S-PQCC-J44				No					69
TPC1010AFN-068I	Texas Instruments	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	295	Yes	5.5 V	295	CMOS	57	1200	5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	17.82 ns	295 CLBS, 1200 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68		4.57 mm	24.2316 mm	No	MAX 57 I/OS; 130 flip-flops		100 MHz		57		24.2316 mm
TPC1240GB-132I	Texas Instruments	FPGA	Industrial	Pin/Peg	132	PGA	Square	Ceramic	684	No			CMOS	104		5		5 V	Grid Array	PGA132,13X13	Field Programmable Gate Arrays		2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)		Perpendicular	S-XPGA-P132				No			55 MHz		104
TPC1010BFN-068I2	Texas Instruments	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	295	Yes			CMOS	57		5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	S-PQCC-J68				No					57

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.