Industrial Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2064-70PG68I	Xilinx	FPGA	Industrial	Pin/Peg	68	PGA	Square	Ceramic, Metal-Sealed Cofired	64	No	5.5 V	64	CMOS		58	600	5		5 V	Grid Array	PGA68,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	10 ns	64 CLBS, 600 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P68		4.064 mm	27.94 mm	No	122 flip-flops; typical gates = 600-1000		70 MHz		58		27.94 mm
XC6SLX45-1LFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2			Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	500 MHz				23 mm
XC3S250E-4CPG132IS1	Xilinx	FPGA	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS		92	250000	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	572 MHz	30 s	85	260 °C (500 °F)	8 mm
XCVU080-1FFVC1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	975000	Yes	.979 V	672			832		.95			Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		672 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	832	245 °C (473 °F)	40 mm
XCV812E-6BG560I	Xilinx	FPGA	Industrial	Ball	560	LBGA	Square	Plastic/Epoxy	21168	Yes	1.89 V	4704	CMOS		404	254016	1.8		1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.47 ns	4704 CLBS, 254016 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	357 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XC3090-50PQ160ISPC0109	Xilinx	FPGA	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.5 V	320	CMOS			9000	5			Flatpack			4.5 V	.65 mm	85 °C (185 °F)		320 CLBS, 9000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160		4.1 mm	28 mm	No	MAX 137 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				28 mm
XC5VLX155T-2FF1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160			680		1		1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	12160 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm	No		e0		30 s	680	225 °C (437 °F)	42.5 mm
XC5VFX70T-1FF1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	71680	Yes	1.05 V	5600	CMOS		640		1		1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	5600 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e0		30 s	640	225 °C (437 °F)	35 mm
XC7A50T-L1CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	52160	Yes	.98 V	4075			250		0.95			Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.92 V	.5 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		250		10 mm
XC6VLX550T-1FF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	549888	Yes	1.05 V		CMOS		840		1		1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e0	1098 MHz	30 s	840	225 °C (437 °F)	42.5 mm
XC3030-70PC44I	Xilinx	FPGA	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS		34	1500	5		5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	9 ns	100 CLBS, 1500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.318 mm	16.5862 mm	No	360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA	e0	70 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XCVU29P-2FSGA2577I	Xilinx	FPGA	Industrial	Ball	2577	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000			676		0.85			Grid Array	BGA2577,51X51,40		.825 V	1 mm	100 °C (212 °F)		216000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2577		4.51 mm	52.5 mm						676		52.5 mm
XC3042-70PP132I	Xilinx	FPGA	Industrial	Pin/Peg	132	PGA	Square	Plastic/Epoxy	144	No	5.5 V	144	CMOS		96	4200	5		5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	9 ns	144 CLBS, 4200 Gates	-40 °C (-40 °F)		Perpendicular	S-PPGA-P132	1	4.191 mm	37.084 mm	No	MAX 96 I/OS; 480 flip-flops		70 MHz		96		37.084 mm
XQ6VSX475T-1LRF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	476160	Yes	.97 V	37200	CMOS		840					Grid Array	BGA1759,42X42,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	37200 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	4.37 mm	42.5 mm			e0			840		42.5 mm
XC3S1200E-4FGG400I	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		304	1200000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	572 MHz	30 s	132	250 °C (482 °F)	21 mm
XCVU27P-2FSGA2577I	Xilinx	FPGA	Industrial	Ball	2577	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	162000			676		0.85			Grid Array	BGA2577,51X51,40		.825 V	1 mm	100 °C (212 °F)		162000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2577		4.51 mm	52.5 mm						676		52.5 mm
XC7A75T-1CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900			300		1			Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.27 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		300		10 mm
XC3S500E-4PQ208IS1	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS		158	500000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e4	572 MHz		126		28 mm
XC3S250E-4FT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS		172	250000	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	572 MHz	30 s	132	225 °C (437 °F)	17 mm
XC5VSX240T-2FFG1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	239616	Yes	1.05 V	18720	CMOS		960		1		1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	18720 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm	No		e1		30 s	960	245 °C (473 °F)	42.5 mm
XC5VLX155T-1FFG1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160			640		1		1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	12160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e1		30 s	640	245 °C (473 °F)	35 mm
XCVU5P-1FLVC2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1313763	Yes	.876 V	75072			832		0.85			Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		75072 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
XC6SLX45-3NFG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2			Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	806 MHz				27 mm
XC3164-5PQ160I	Xilinx	FPGA	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	224	Yes	5.5 V	224	CMOS		120	4000	5		5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	4.1 ns	224 CLBS, 4000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160	3	3.94 mm	28 mm	No	MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500	e0	190 MHz	30 s	120	225 °C (437 °F)	28 mm
XC8101-ESPC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	384	CMOS			1248	5			Chip Carrier			4.5 V	1.27 mm	85 °C (185 °F)	5.5 ns	384 CLBS, 1248 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	MAX 61 I/OS; MAX 192 flip-flops; OTP based						29.3116 mm
XA3S1200E-4FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS	AEC-Q100	190	1200000	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	4.88 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	572 MHz	30 s	150	260 °C (500 °F)	17 mm
XA3S500E-4CPG132I	Xilinx	FPGA	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	AEC-Q100	92	500000	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	4.88 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	572 MHz	30 s	85	260 °C (500 °F)	8 mm
XC6VLX760-1FF1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	758784	Yes	1.05 V		CMOS		1200		1		1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e0	1098 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
XC6VLX550T-L1FF1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	549888	Yes	.93 V		CMOS		1200		.9		1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e0	1098 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
XC3S250E-4FT256IS1	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS		172	250000	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	572 MHz	30 s	132	225 °C (437 °F)	17 mm
XA3S200A-4FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS	AEC-Q100	195	200000	1.2		1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	4.88 ns	448 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	667 MHz	30 s	160	260 °C (500 °F)	17 mm
XC7A15T-L1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	16640	Yes	.98 V	1300			250		0.95			Grid Array	BGA1156,34X34,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm
XC5VSX35T-1FFG665I	Xilinx	FPGA	Industrial	Ball	665	BGA	Square	Plastic/Epoxy	34816	Yes	1.05 V	2720	CMOS		360		1		1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	2720 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm	No		e1		30 s	360	250 °C (482 °F)	27 mm
XC6SLX45T-N3FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS		296		1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	806 MHz	30 s	296	225 °C (437 °F)	23 mm
XC3042-50PP132I	Xilinx	FPGA	Industrial	Pin/Peg	132	PGA	Square	Plastic/Epoxy	144	No	5.5 V	144	CMOS		96	4200	5		5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)		144 CLBS, 4200 Gates	-40 °C (-40 °F)		Perpendicular	S-PPGA-P132	1	4.191 mm	37.084 mm	No	MAX 96 I/OS; 480 flip-flops		50 MHz		96		37.084 mm
XC5VLX110-2FFV1153I	Xilinx	FPGA	Industrial	Ball	1153	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640			800		1			Grid Array	BGA1153,34X34,40		.95 V	1 mm	100 °C (212 °F)	0.77 ns	8640 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1153		3.4 mm	35 mm						800		35 mm
XA3S200-4PQG208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	4320	Yes	1.26 V	480		AEC-Q100	173	200000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)		480 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	125 MHz	30 s	173	245 °C (473 °F)	28 mm
XC5VLX110-2FFV676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640			440		1			Grid Array	BGA676,26X26,40		.95 V	1 mm	100 °C (212 °F)	0.77 ns	8640 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm			e1		30 s	440	250 °C (482 °F)	27 mm
XC3190-4PQ208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	320	Yes	5.5 V	320	CMOS		144	5000	5		5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	3.3 ns	320 CLBS, 5000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	3.92 mm	28 mm	No	MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500	e0	230 MHz	30 s	144	225 °C (437 °F)	28 mm
XCKU19P-L1FFVB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1842750	Yes	.742 V	105300			540		0.72			Grid Array	BGA2104,46X46,40		.698 V	1 mm	100 °C (212 °F)		105300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.27 mm	47.5 mm			e1			540		47.5 mm
XCKU115-1LFLVB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520	CMOS		702		0.95	Tray		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.71 mm	40 mm			e1		30 s	702	245 °C (473 °F)	40 mm
XCS50E-6TQ144I	Xilinx	FPGA	Industrial	Gull Wing	144	QFP	Square	Plastic/Epoxy	1728	Yes	1.89 V		CMOS		182		1.8		1.8,2.5,3.3 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	100 °C (212 °F)	0.47 ns		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3		20 mm	No		e0	357 MHz	30 s	182	225 °C (437 °F)	20 mm
XC6VSX315T-L1FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	314880	Yes	.93 V		CMOS		600		.9		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC7A200T-L2CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	215360	Yes	.93 V	16825			500		0.9			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.87 V	.8 mm	100 °C (212 °F)	1.51 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	500	260 °C (500 °F)	15 mm
XC6VLX365T-3FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	364032	Yes	1.05 V	28440	CMOS		600					Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	0.59 ns	28440 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm			e0	1412 MHz		600		35 mm
XC3042A-7PQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	144	Yes	5.5 V	144	CMOS		82	2000	5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	5.1 ns	144 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 3000 Logic gates	e0	113 MHz	30 s	82	225 °C (437 °F)	20 mm
XC7A75T-L2CPG236I	Xilinx	FPGA	Industrial	Ball	236	LFBGA	Square	Plastic/Epoxy	75520	Yes	.93 V	5900			300		0.9			Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.87 V	.5 mm	100 °C (212 °F)	1.51 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	300	260 °C (500 °F)	10 mm
XQ6VLX130T-1LRF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	.97 V	10000	CMOS		600					Grid Array	BGA1156,34X34,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	10000 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.53 mm	35 mm			e0			600		35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.